Patents by Inventor Kevin J. Doran

Kevin J. Doran has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210296242
    Abstract: A device and method of utilizing an interconnect bridge to electrically couple two semiconductor dies located on different surfaces. Integrated circuit packages using an interconnect bridge to electrically couple a semiconductor die on a substrate to a semiconductor die on a motherboard are shown. Integrated circuit packages using an interconnect bridge to electrically couple a semiconductor die on a top surface of a substrate to a semiconductor die on a bottom surface of a substrate are shown. Methods of electrically coupling semiconductor dies on different surfaces using interconnect bridges are shown.
    Type: Application
    Filed: June 7, 2021
    Publication date: September 23, 2021
    Inventors: MD Altaf Hossain, Kevin J. Doran, Yu Amos Zhang, Zhiguo Qian
  • Patent number: 11031341
    Abstract: A device and method of utilizing an interconnect bridge to electrically couple two semiconductor dies located on different surfaces. Integrated circuit packages using an interconnect bridge to electrically couple a semiconductor die on a substrate to a semiconductor die on a motherboard are shown. Integrated circuit packages using an interconnect bridge to electrically couple a semiconductor die on a top surface of a substrate to a semiconductor die on a bottom surface of a substrate are shown. Methods of electrically coupling semiconductor dies on different surfaces using interconnect bridges are shown.
    Type: Grant
    Filed: March 29, 2017
    Date of Patent: June 8, 2021
    Assignee: Intel Corporation
    Inventors: Md Altai Hossain, Kevin J Doran, Yu Amos Zhang, Zhiguo Qian
  • Patent number: 10877559
    Abstract: This disclosure is directed to a system to provide tactile feedback during non-contact interaction. A system may comprise at least display circuitry, sensing circuitry, tactile feedback circuitry and processing circuitry. The processing circuitry may cause the display circuitry to present a user interface. The sensing circuitry may sense when a body part of a user (e.g., a hand, a finger, etc.) is proximate to the user interface and may generate position data based on a sensed position of the body part. The processing circuitry may determine a relative position of the body part with respect to the user interface based on the position data, and may determine if the body part is interacting with the user interface based on the relative position. If it is determined that the body part is interacting with the user interface, the processing circuitry may cause the tactile feedback circuitry to generate directional feedback.
    Type: Grant
    Filed: March 29, 2016
    Date of Patent: December 29, 2020
    Assignee: Intel Corporation
    Inventors: Kevin J. Doran, Stephen H. Hall, Murali Veeramoney, Vijay M. Rao, Royce Fernald
  • Patent number: 10732011
    Abstract: Methods, apparatus, systems and articles of manufacture are disclosed herein including a monitoring system for a building including an in-wall guide for a drone, the in-wall guide extending behind at least one wall from a first location to a second location and a power delivery circuit in, or adjacent, the in-wall guide.
    Type: Grant
    Filed: November 22, 2017
    Date of Patent: August 4, 2020
    Assignee: Intel Corporation
    Inventors: David W. Browning, Kevin J. Doran, Gabriel Cox, Jose Ignacio Parra Vilchis, Rafael De La Guardia González, David I. Gonzalez Aguirre
  • Patent number: 10532232
    Abstract: Systems, apparatus, and methods to deploy safety equipment from a drone are disclosed. An example apparatus includes a sensor to gather environmental data and an analyzer in communication with the sensor. In this example, the analyzer is to identify an anchor site based on the environmental data and produce an assessment of stability of the anchor site based on the environmental data and model data. The example apparatus also includes one or more actuators to deploy a securing device in response to the assessment of the analyzer indicating the anchor site is stable and to deploy the safety equipment.
    Type: Grant
    Filed: December 15, 2017
    Date of Patent: January 14, 2020
    Assignee: Intel Corporation
    Inventors: David W. Browning, Kevin J. Doran, Subramanian Anandaraj, Songnan Yang, Bradley A. Jackson, Shashi Jain, Venkata Rakesh Seethamsetty
  • Publication number: 20190341349
    Abstract: A device and method of utilizing an interconnect bridge to electrically couple two semiconductor dies located on different surfaces. Integrated circuit packages using an interconnect bridge to electrically couple a semiconductor die on a substrate to a semiconductor die on a motherboard are shown. Integrated circuit packages using an interconnect bridge to electrically couple a semiconductor die on a top surface of a substrate to a semiconductor die on a bottom surface of a substrate are shown. Methods of electrically coupling semiconductor dies on different surfaces using interconnect bridges are shown.
    Type: Application
    Filed: March 29, 2017
    Publication date: November 7, 2019
    Inventors: MD Altaf Hossain, Kevin J Doran, Yu Amos Zhang, Zhiguo Qian
  • Publication number: 20190049274
    Abstract: Methods, apparatus, systems and articles of manufacture are disclosed herein including a monitoring system for a building including an in-wall guide for a drone, the in-wall guide extending behind at least one wall from a first location to a second location and a power delivery circuit in, or adjacent, the in-wall guide.
    Type: Application
    Filed: November 22, 2017
    Publication date: February 14, 2019
    Inventors: David W. Browning, Kevin J. Doran, Gabriel Cox, Jose Ignacio Parra Vilchis, Rafael De La Guardia González, David I. Gonzalez Aguirre
  • Publication number: 20190046816
    Abstract: Systems, apparatus, and methods to deploy safety equipment from a drone are disclosed. An example apparatus includes a sensor to gather environmental data and an analyzer in communication with the sensor. In this example, the analyzer is to identify an anchor site based on the environmental data and produce an assessment of stability of the anchor site based on the environmental data and model data. The example apparatus also includes one or more actuators to deploy a securing device in response to the assessment of the analyzer indicating the anchor site is stable and to deploy the safety equipment.
    Type: Application
    Filed: December 15, 2017
    Publication date: February 14, 2019
    Inventors: David W. Browning, Kevin J. Doran, Subramanian Anandaraj, Songnan Yang, Bradley A. Jackson, Shashi Jain, Venkata Rakesh Seethamsetty
  • Publication number: 20180189516
    Abstract: Methods and apparatus for preserving privacy from a drone are disclosed herein. An example drone includes a privacy mode controller to, when the drone is within a restricted zone, flag data gathered by the drone in the restricted zone; and a private data deleter to, when the drone exits the restricted zone, delete the flagged data.
    Type: Application
    Filed: February 15, 2017
    Publication date: July 5, 2018
    Inventors: DAVID W. BROWNING, KEVIN J. DORAN, KIRK W. SKEBA, MUHAMMAD ABOZAED, ANAND S. KONANUR, ANURADHA SRINIVASAN
  • Publication number: 20170285745
    Abstract: This disclosure is directed to a system to provide tactile feedback during non-contact interaction. A system may comprise at least display circuitry, sensing circuitry, tactile feedback circuitry and processing circuitry. The processing circuitry may cause the display circuitry to present a user interface. The sensing circuitry may sense when a body part of a user (e.g., a hand, a finger, etc.) is proximate to the user interface and may generate position data based on a sensed position of the body part. The processing circuitry may determine a relative position of the body part with respect to the user interface based on the position data, and may determine if the body part is interacting with the user interface based on the relative position. If it is determined that the body part is interacting with the user interface, the processing circuitry may cause the tactile feedback circuitry to generate directional feedback.
    Type: Application
    Filed: March 29, 2016
    Publication date: October 5, 2017
    Applicant: Intel Corporation
    Inventors: KEVIN J. DORAN, STEPHEN H. HALL, MURALI VEERAMONEY, VIJAY M. RAO, ROYCE FERNALD
  • Patent number: 9515031
    Abstract: In accordance with one aspect of the present description, a transmission line such as a microstrip or stripline transmission line, has stub-shaped projections adapted to compensate simultaneously for both far-end crosstalk (FEXT) induced by inductive coupling between the transmission line and an adjacent transmission line, and also far-end crosstalk induced by inductive coupling between the vertical electrical interconnect at the far end of the transmission line and an adjacent vertical electrical interconnect electrically connected to the adjacent transmission line. In another aspect of the present description, a microstrip transmission line may have multiple stubby line sections having different resistances and impedances to more gradually transition from to the typically low impedance characteristics of vertical interconnects such as the PTH vias and socket connectors. Other aspects are described.
    Type: Grant
    Filed: December 29, 2011
    Date of Patent: December 6, 2016
    Assignee: INTEL CORPORATION
    Inventors: Nevin Altunyurt, Kemal Aygun, Kevin J. Doran, Yidnekachew S. Mekonnen
  • Publication number: 20160174362
    Abstract: Techniques and mechanisms to mitigate noise in a signal line extending across rails arranged in a split plane configuration. In an embodiment, respective sides of a first rail and a second rail define opposite sides of a boundary region between the rails. The first rail forms a groove and the second rail forms a branch portion that extends at least in part into the groove. In another embodiment, one or more signal lines each extend across the boundary region and proximate to the branch portion, the one or more signals each to communicate a respective signal while the first rail is at a first voltage and while the second rail is at a second voltage. The branch portion and groove contribute to a reduced impedance discontinuity across the boundary region, which mitigates the creation of signal noise in the one or more signal lines.
    Type: Application
    Filed: December 12, 2014
    Publication date: June 16, 2016
    Inventors: Kevin J. Doran, Stephen H. Hall, Thomas D. Whiteley, Kai Xiao, Yuan-Liang Li, Jimmy Hsu, Thonas Yi-Ren Su
  • Patent number: 9268724
    Abstract: Disclosed embodiments may include a circuit having a plurality of data terminals, no more than two pairs of differential data strobe terminals associated with the plurality of data terminals, and digital logic circuitry. The digital logic circuitry may be coupled to the data terminals and configured to use the no more than two pairs of differential data strobe terminals concurrently with the plurality of data terminals to transfer data. Other embodiments may be disclosed.
    Type: Grant
    Filed: February 17, 2014
    Date of Patent: February 23, 2016
    Assignee: INTEL CORPORATION
    Inventors: Md Altaf Hossain, Kevin J. Doran, Nagi Aboulenein
  • Publication number: 20140317343
    Abstract: Disclosed embodiments may include a circuit having a plurality of data terminals, no more than two pairs of differential data strobe terminals associated with the plurality of data terminals, and digital logic circuitry. The digital logic circuitry may be coupled to the data terminals and configured to use the no more than two pairs of differential data strobe terminals concurrently with the plurality of data terminals to transfer data. Other embodiments may be disclosed.
    Type: Application
    Filed: February 17, 2014
    Publication date: October 23, 2014
    Inventors: Md Altaf Hossain, Kevin J. Doran, Nagi Aboulenein
  • Publication number: 20140203417
    Abstract: In accordance with one aspect of the present description, a transmission line such as a microstrip or stripline transmission line, has stub-shaped projections adapted to compensate simultaneously for both far-end crosstalk (FEXT) induced by inductive coupling between the transmission line and an adjacent transmission line, and also far-end crosstalk induced by inductive coupling between the vertical electrical interconnect at the far end of the transmission line and an adjacent vertical electrical interconnect electrically connected to the adjacent transmission line. In another aspect of the present description, a microstrip transmission line may have multiple stubby line sections having different resistances and impedances to more gradually transition from to the typically low impedance characteristics of vertical interconnects such as the PTH vias and socket connectors. Other aspects are described.
    Type: Application
    Filed: December 29, 2011
    Publication date: July 24, 2014
    Inventors: Nevin Altunyurt, Kemal Aygun, Kevin J. Doran, Yidnekachew S. Mekonnen
  • Patent number: 8683096
    Abstract: Disclosed embodiments may include a circuit having a plurality of data terminals, no more than two pairs of differential data strobe terminals associated with the plurality of data terminals, and digital logic circuitry. The digital logic circuitry may be coupled to the data terminals and configured to use the no more than two pairs of differential data strobe terminals concurrently with the plurality of data terminals to transfer data. Other embodiments may be disclosed.
    Type: Grant
    Filed: June 27, 2012
    Date of Patent: March 25, 2014
    Assignee: Intel Corporation
    Inventors: Md Altaf Hossain, Kevin J. Doran, Nagi Aboulenein
  • Publication number: 20140003169
    Abstract: Disclosed embodiments may include a circuit having a plurality of data terminals, no more than two pairs of differential data strobe terminals associated with the plurality of data terminals, and digital logic circuitry. The digital logic circuitry may be coupled to the data terminals and configured to use the no more than two pairs of differential data strobe terminals concurrently with the plurality of data terminals to transfer data. Other embodiments may be disclosed.
    Type: Application
    Filed: June 27, 2012
    Publication date: January 2, 2014
    Inventors: Md Altaf Hossain, Kevin J. Doran, Nagi Aboulenein
  • Publication number: 20080151591
    Abstract: In some embodiments, a chip includes transmitter circuitry, receiver circuitry, and control circuitry to detect whether a memory module is coupled to the receiver circuitry. The control circuitry selectively provides memory chip configuration signals to the transmitter circuitry to be provided to memory chips to control how many interface lanes in the memory chips are to be used to carry read data in response to a read request and whether some of the interface lanes are used for carrying read data signals or command signals. Other embodiments are described.
    Type: Application
    Filed: December 21, 2006
    Publication date: June 26, 2008
    Inventors: Kevin J. Doran, Joseph H. Salmon, Michael W. Williams