Abstract: A device and method of utilizing an interconnect bridge to electrically couple two semiconductor dies located on different surfaces. Integrated circuit packages using an interconnect bridge to electrically couple a semiconductor die on a substrate to a semiconductor die on a motherboard are shown. Integrated circuit packages using an interconnect bridge to electrically couple a semiconductor die on a top surface of a substrate to a semiconductor die on a bottom surface of a substrate are shown. Methods of electrically coupling semiconductor dies on different surfaces using interconnect bridges are shown.

Abstract: A device and method of utilizing an interconnect bridge to electrically couple two semiconductor dies located on different surfaces. Integrated circuit packages using an interconnect bridge to electrically couple a semiconductor die on a substrate to a semiconductor die on a motherboard are shown. Integrated circuit packages using an interconnect bridge to electrically couple a semiconductor die on a top surface of a substrate to a semiconductor die on a bottom surface of a substrate are shown. Methods of electrically coupling semiconductor dies on different surfaces using interconnect bridges are shown.

Abstract: This disclosure is directed to a system to provide tactile feedback during non-contact interaction. A system may comprise at least display circuitry, sensing circuitry, tactile feedback circuitry and processing circuitry. The processing circuitry may cause the display circuitry to present a user interface. The sensing circuitry may sense when a body part of a user (e.g., a hand, a finger, etc.) is proximate to the user interface and may generate position data based on a sensed position of the body part. The processing circuitry may determine a relative position of the body part with respect to the user interface based on the position data, and may determine if the body part is interacting with the user interface based on the relative position. If it is determined that the body part is interacting with the user interface, the processing circuitry may cause the tactile feedback circuitry to generate directional feedback.

Abstract: Methods, apparatus, systems and articles of manufacture are disclosed herein including a monitoring system for a building including an in-wall guide for a drone, the in-wall guide extending behind at least one wall from a first location to a second location and a power delivery circuit in, or adjacent, the in-wall guide.

Abstract: Systems, apparatus, and methods to deploy safety equipment from a drone are disclosed. An example apparatus includes a sensor to gather environmental data and an analyzer in communication with the sensor. In this example, the analyzer is to identify an anchor site based on the environmental data and produce an assessment of stability of the anchor site based on the environmental data and model data. The example apparatus also includes one or more actuators to deploy a securing device in response to the assessment of the analyzer indicating the anchor site is stable and to deploy the safety equipment.

Abstract: A device and method of utilizing an interconnect bridge to electrically couple two semiconductor dies located on different surfaces. Integrated circuit packages using an interconnect bridge to electrically couple a semiconductor die on a substrate to a semiconductor die on a motherboard are shown. Integrated circuit packages using an interconnect bridge to electrically couple a semiconductor die on a top surface of a substrate to a semiconductor die on a bottom surface of a substrate are shown. Methods of electrically coupling semiconductor dies on different surfaces using interconnect bridges are shown.

Abstract: Systems, apparatus, and methods to deploy safety equipment from a drone are disclosed. An example apparatus includes a sensor to gather environmental data and an analyzer in communication with the sensor. In this example, the analyzer is to identify an anchor site based on the environmental data and produce an assessment of stability of the anchor site based on the environmental data and model data. The example apparatus also includes one or more actuators to deploy a securing device in response to the assessment of the analyzer indicating the anchor site is stable and to deploy the safety equipment.

Abstract: Methods, apparatus, systems and articles of manufacture are disclosed herein including a monitoring system for a building including an in-wall guide for a drone, the in-wall guide extending behind at least one wall from a first location to a second location and a power delivery circuit in, or adjacent, the in-wall guide.

Abstract: Methods and apparatus for preserving privacy from a drone are disclosed herein. An example drone includes a privacy mode controller to, when the drone is within a restricted zone, flag data gathered by the drone in the restricted zone; and a private data deleter to, when the drone exits the restricted zone, delete the flagged data.

Abstract: This disclosure is directed to a system to provide tactile feedback during non-contact interaction. A system may comprise at least display circuitry, sensing circuitry, tactile feedback circuitry and processing circuitry. The processing circuitry may cause the display circuitry to present a user interface. The sensing circuitry may sense when a body part of a user (e.g., a hand, a finger, etc.) is proximate to the user interface and may generate position data based on a sensed position of the body part. The processing circuitry may determine a relative position of the body part with respect to the user interface based on the position data, and may determine if the body part is interacting with the user interface based on the relative position. If it is determined that the body part is interacting with the user interface, the processing circuitry may cause the tactile feedback circuitry to generate directional feedback.

Abstract: In accordance with one aspect of the present description, a transmission line such as a microstrip or stripline transmission line, has stub-shaped projections adapted to compensate simultaneously for both far-end crosstalk (FEXT) induced by inductive coupling between the transmission line and an adjacent transmission line, and also far-end crosstalk induced by inductive coupling between the vertical electrical interconnect at the far end of the transmission line and an adjacent vertical electrical interconnect electrically connected to the adjacent transmission line. In another aspect of the present description, a microstrip transmission line may have multiple stubby line sections having different resistances and impedances to more gradually transition from to the typically low impedance characteristics of vertical interconnects such as the PTH vias and socket connectors. Other aspects are described.

Abstract: Techniques and mechanisms to mitigate noise in a signal line extending across rails arranged in a split plane configuration. In an embodiment, respective sides of a first rail and a second rail define opposite sides of a boundary region between the rails. The first rail forms a groove and the second rail forms a branch portion that extends at least in part into the groove. In another embodiment, one or more signal lines each extend across the boundary region and proximate to the branch portion, the one or more signals each to communicate a respective signal while the first rail is at a first voltage and while the second rail is at a second voltage. The branch portion and groove contribute to a reduced impedance discontinuity across the boundary region, which mitigates the creation of signal noise in the one or more signal lines.

Abstract: Disclosed embodiments may include a circuit having a plurality of data terminals, no more than two pairs of differential data strobe terminals associated with the plurality of data terminals, and digital logic circuitry. The digital logic circuitry may be coupled to the data terminals and configured to use the no more than two pairs of differential data strobe terminals concurrently with the plurality of data terminals to transfer data. Other embodiments may be disclosed.

Abstract: Disclosed embodiments may include a circuit having a plurality of data terminals, no more than two pairs of differential data strobe terminals associated with the plurality of data terminals, and digital logic circuitry. The digital logic circuitry may be coupled to the data terminals and configured to use the no more than two pairs of differential data strobe terminals concurrently with the plurality of data terminals to transfer data. Other embodiments may be disclosed.

Abstract: In accordance with one aspect of the present description, a transmission line such as a microstrip or stripline transmission line, has stub-shaped projections adapted to compensate simultaneously for both far-end crosstalk (FEXT) induced by inductive coupling between the transmission line and an adjacent transmission line, and also far-end crosstalk induced by inductive coupling between the vertical electrical interconnect at the far end of the transmission line and an adjacent vertical electrical interconnect electrically connected to the adjacent transmission line. In another aspect of the present description, a microstrip transmission line may have multiple stubby line sections having different resistances and impedances to more gradually transition from to the typically low impedance characteristics of vertical interconnects such as the PTH vias and socket connectors. Other aspects are described.

Abstract: Disclosed embodiments may include a circuit having a plurality of data terminals, no more than two pairs of differential data strobe terminals associated with the plurality of data terminals, and digital logic circuitry. The digital logic circuitry may be coupled to the data terminals and configured to use the no more than two pairs of differential data strobe terminals concurrently with the plurality of data terminals to transfer data. Other embodiments may be disclosed.

Abstract: Disclosed embodiments may include a circuit having a plurality of data terminals, no more than two pairs of differential data strobe terminals associated with the plurality of data terminals, and digital logic circuitry. The digital logic circuitry may be coupled to the data terminals and configured to use the no more than two pairs of differential data strobe terminals concurrently with the plurality of data terminals to transfer data. Other embodiments may be disclosed.

Abstract: In some embodiments, a chip includes transmitter circuitry, receiver circuitry, and control circuitry to detect whether a memory module is coupled to the receiver circuitry. The control circuitry selectively provides memory chip configuration signals to the transmitter circuitry to be provided to memory chips to control how many interface lanes in the memory chips are to be used to carry read data in response to a read request and whether some of the interface lanes are used for carrying read data signals or command signals. Other embodiments are described.