Patents by Inventor Kevin J. Hagerty

Kevin J. Hagerty has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9108867
    Abstract: A process of incorporating technetium into an electroless deposit, forming an alloy that is extremely resistant to corrosion and reduces the mobility of technetium on a geologic time scale is disclosed and claimed. The process includes providing a liquid containing technetium, such as an aqueous waste stream generated during the used nuclear fuel reprocessing activities. The technetium is collected and concentrated, and provided into an electroless deposition bath. A substrate, such as suitably prepared zero valent iron or stainless steel, is introduced into the bath to initiate autocatalytic electroless deposition of the technetium onto the substrate due to the difference in electrochemical potential between the plating bath and the metals in solution. This causes a layer of technetium metal to form on the substrate.
    Type: Grant
    Filed: August 12, 2013
    Date of Patent: August 18, 2015
    Assignee: AREVA Inc.
    Inventor: Kevin J. Hagerty
  • Publication number: 20140058183
    Abstract: A process of incorporating technetium into an electroless deposit, forming an alloy that is extremely resistant to corrosion and reduces the mobility of technetium on a geologic time scale is disclosed and claimed. The process includes providing a liquid containing technetium, such as an aqueous waste stream generated during the used nuclear fuel reprocessing activities. The technetium is collected and concentrated, and provided into an electroless deposition bath. A substrate, such as suitably prepared zero valent iron or stainless steel, is introduced into the bath to initiate autocatalytic electroless deposition of the technetium onto the substrate due to the difference in electrochemical potential between the plating bath and ti metals in solution. This causes a layer of technetium metal to form on the substrate.
    Type: Application
    Filed: August 12, 2013
    Publication date: February 27, 2014
    Applicant: AREVA NP Inc.
    Inventor: Kevin J. Hagerty