Abstract: The present invention is directed to the synthesis of metallic nickel-molybdenum-tungsten films and coatings with direct current sputter deposition, which results in fully-dense crystallographically textured films that are filled with nano-scale faults and twins. The as-deposited films exhibit linear-elastic mechanical behavior and tensile strengths above 2.5 GPa, which is unprecedented for materials that are compatible with wafer-level device fabrication processes. The ultra-high strength is attributed to a combination of solid solution strengthening and the presence of the dense nano-scale faults and twins. These films also possess excellent thermal and mechanical stability, high density, low CTE, and electrical properties that are attractive for next generation metal MEMS applications. Deposited as coatings these films provide protection against friction and wear.

Abstract: The present invention is directed to a manifold for directing cooling fluid and/or gas to a heat exchanger in a flow configuration designed to optimize heat transfer from the heat exchanger. The manifold can take many different forms such as a layered construction with distributed inlet paths, local outlet paths, a central collection changer and a path for fluid removal. The manifold can be formed from a metal, plastic, rubber, ceramic, or other heat resistant material known to or conceivable by one of skill in the art. The manifold can also be combined with any type of heat exchanger known to or conceivable by one of skill in the art to form a thermal management unit. To optimize overall properties such as low pressure drop, high heat transfer, and excellent temperature uniformity of the thermal management unit, the manifold can be graded, expanded and scaled as needed.

Abstract: The present invention is directed to devices formed from three dimensional (3D) structures composed of wires, yarns of wires, or 3D printed structures. The devices of the present invention offer the potential for 3D structures with multiple properties optimized concurrently, using optimization within the 3D manufacturing constraints. The 3D structures of the present invention include multiple properties that are optimized for heat transfer applications. The present invention also includes the methods for optimization of the 3D woven lattices as well as methods of use of the 3D woven lattices in heat transfer applications.

Abstract: The present invention is directed to the synthesis of metallic nickel-molybdenum-tungsten films and coatings with direct current sputter deposition, which results in fully-dense crystallographically textured films that are filled with nano-scale faults and twins. The as-deposited films exhibit linear-elastic mechanical behavior and tensile strengths above 2.5 GPa, which is unprecedented for materials that are compatible with wafer-level device fabrication processes. The ultra-high strength is attributed to a combination of solid solution strengthening and the presence of the dense nano-scale faults and twins. These films also possess excellent thermal and mechanical stability, high density, low CTE, and electrical properties that are attractive for next generation metal MEMS applications. Deposited as coatings these films provide protection against friction and wear.

Abstract: The present invention is directed to three dimensional weaves composed of wires or yarns that offer the potential for damping not achievable with solid materials, including high temperature damping. Three damping mechanisms have been identified: (1) Internal material damping, (2) Frictional energy dissipation (Coulomb damping), and (3) inertial damping (tuned mass damping). These three damping mechanisms can be optimized by modifying the wire material chemistries (metals, ceramics, polymers, etc.), wire sizes, wire shapes, wire coatings, wire bonding, and wire architecture (by removing certain wires). These have the effect of modifying the lattice and wire stiffnesses, masses, coefficients of friction, and internal material damping. Different materials can be used at different locations in the woven lattice. These design variables can also be modified to tailor mechanical stiffness and strength of the lattice, in addition to damping.

Abstract: The present invention is directed to three dimensional weaves composed of wires or yarns that offer the potential for damping not achievable with solid materials, including high temperature damping. Three damping mechanisms have been identified: (1) Internal material damping, (2) Frictional energy dissipation (Coulomb damping), and (3) inertial damping (tuned mass damping). These three damping mechanisms can be optimized by modifying the wire material chemistries (metals, ceramics, polymers, etc.), wire sizes, wire shapes, wire coatings, wire bonding, and wire architecture (by removing certain wires). These have the effect of modifying the lattice and wire stiffnesses, masses, coefficients of friction, and internal material damping. Different materials can be used at different locations in the woven lattice. These design variables can also be modified to tailor mechanical stiffness and strength of the lattice, in addition to damping.

Abstract: The present invention is directed to devices formed from three-dimensional (3D) structures composed of metallic, ceramic or polymeric wires or bundles and yarns of wires that are either solid or hollow like a tube. The devices of the present invention offer the potential for 3D structures with multiple properties optimized concurrently, in some cases using a topology optimization routine that includes the 3D manufacturing constraints. The properties can be optimized in different directions. The 3D structures of the present invention include multiple properties that are optimized for a range of different applications, including heat transfer. The present invention also includes the methods for optimization of the 3D structures as well as methods of use of the 3D structures in heat transfer applications.

Abstract: The present invention is directed to devices formed from three dimensional (3D) structures composed of wires, yarns of wires, or 3D printed structures. The devices of the present invention offer the potential for 3D structures with multiple properties optimized concurrently, using optimization within the 3D manufacturing constraints. The 3D structures of the present invention include multiple properties that are optimized for heat transfer applications. The present invention also includes the methods for optimization of the 3D woven lattices as well as methods of use of the 3D woven lattices in heat transfer applications.

Abstract: The present invention is directed to a manifold for directing cooling fluid and/or gas to a heat exchanger in a flow configuration designed to optimize heat transfer from the heat exchanger. The manifold can take many different forms such as a layered construction with distributed inlet paths, local outlet paths, a central collection changer and a path for fluid removal. The manifold can be formed from a metal, plastic, rubber, ceramic, or other heat resistant material known to or conceivable by one of skill in the art. The manifold can also be combined with any type of heat exchanger known to or conceivable by one of skill in the art to form a thermal management unit. To optimize overall properties such as low pressure drop, high heat transfer, and excellent temperature uniformity of the thermal management unit, the manifold can be graded, expanded and scaled as needed.