Abstract: A pressure sensitive adhesive includes a substantially continuous polymer phase having pressure sensitive adhesive properties, and a plurality of pores arranged within the substantially continuous polymer phase and disposed to permit fluid to pass from a first side through at least a portion of the plurality of pores to a second side. The plurality of pores is substantially resistant to cold flow. A method of forming a porous pressure sensitive adhesive tape includes providing a solution for forming an adhesive having pressure sensitive adhesive properties, the solution including a pore forming material, casting a film comprising the solution, laminating a liner on the film, and exposing the adhesive to an energy source to form pores in the adhesive and cure the adhesive to form the pressure sensitive adhesive tape.

Abstract: A high Tg acrylic polymer is provided as well as an epoxy-blend thereof for use as a pressure sensitive adhesive. The high Tg acrylic polymer comprises a copolymer of an alkyl (meth)acrylate monomer whose homopolymer has a Tg>20° C., optionally a C1-30 (meth)acrylate monomer, an nitrogen-containing polar monomer, and a polymerizable epoxy-containing monomer, with the monomers being present in an amount such that the copolymer has a Tg>50° C. When blended with at least one liquid epoxy resin, the resulting mixture exhibits desirable pressure sensitive adhesive properties and may be cured.

Abstract: A method for the production of glass or plastic laminates is provided comprising applying between opposing faces of glass or plastic substrates a pressure sensitive adhesive comprised of a curable blend of an epoxy resin and a polymer comprised of the polymerization reaction product of an alkyl (meth)acrylate monomer whose homopolymer has a Tg>20° C., optionally a C1-30 (meth)acrylate monomer, a nitrogen-containing polar monomer, and a polymerizable epoxy-containing monomer, with the monomers being present in an amount such that the copolymer has a Tg>50° C., and curing the adhesive.

Abstract: A high Tg acrylic polymer is provided as well as an epoxy-blend thereof for use as a pressure sensitive adhesive. The high Tg acrylic polymer comprises a copolymer of an alkyl (meth)acrylate monomer having a Tg>20° C., a C1-30 (meth)acrylate monomer, an nitrogen-containing polar monomer, and a polymerizable epoxy-containing monomer, with the polymer having a Tg>50° C. When blended with an epoxy resin, the resulting mixture exhibits desirable pressure sensitive adhesive properties and may be thermocured.

Abstract: A high Tg acrylic polymer is provided as well as an epoxy-blend thereof for use as a pressure sensitive adhesive. The high Tg acrylic polymer comprises a copolymer of an alkyl (meth)acrylate monomer having a Tg>20° C., a C1-30 (meth)acrylate monomer, an nitrogen-containing polar monomer, and a polymerizable epoxy-containing monomer, with the polymer having a Tg>50° C. When blended with an epoxy resin, the resulting mixture exhibits desirable pressure sensitive adhesive properties and may be thermocured.