Patents by Inventor Kevin J. Moeggenborg
Kevin J. Moeggenborg has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8101093Abstract: The invention provides methods of polishing a noble metal-containing substrate with one of two chemical-mechanical polishing compositions. The first chemical-mechanical polishing composition comprises (a) an abrasive comprising ?-alumina, (b) about 0.05 to about 50 mmol/kg of ions of calcium, strontium, barium, or mixtures thereof, and (c) a liquid carrier comprising water. The second chemical-mechanical polishing composition comprises (a) an abrasive selected from the group consisting of ?-alumina, ?-alumina, ?-alumina, ?-alumina, diamond, boron carbide, silicon carbide, tungsten carbide, titanium nitride, and mixtures thereof, (b) about 0.05 to about 3.5 mmol/kg of ions of calcium, strontium, barium, magnesium, zinc, or mixtures thereof, and (c) a liquid carrier comprising water.Type: GrantFiled: February 26, 2009Date of Patent: January 24, 2012Assignee: Cabot Microelectronics CorporationInventors: Francesco de Rege Thesauro, Kevin J. Moeggenborg, Vlasta Brusic, Benjamin P. Bayer
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Patent number: 7754098Abstract: The invention provides a chemical-mechanical polishing composition comprising: (a) silica particles, (b) about 5×10?3 to about 10 millimoles per kilogram of at least one alkaline earth metal selected from the group consisting of calcium, strontium, barium, and mixtures thereof, based on the total weight of the polishing composition, (c) about 0.1 to about 15 wt. % of an oxidizing agent, and (d) a liquid carrier comprising water. The invention also provides a polishing composition, which optionally comprises an oxidizing agent, comprising about 5×10?3 to about 10 millimoles per kilogram of at least one alkaline earth metal selected from the group consisting of calcium, strontium, and mixtures thereof. The invention further provides methods for polishing a substrate using the aforementioned polishing compositions.Type: GrantFiled: September 10, 2004Date of Patent: July 13, 2010Assignee: Cabot Microelectronics CorporationInventors: David J. Schroeder, Kevin J. Moeggenborg
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Publication number: 20090152240Abstract: The invention provides methods of polishing a noble metal-containing substrate with one of two chemical-mechanical polishing compositions. The first chemical-mechanical polishing composition comprises (a) an abrasive comprising ?-alumina, (b) about 0.05 to about 50 mmol/kg of ions of calcium, strontium, barium, or mixtures thereof, and (c) a liquid carrier comprising water. The second chemical-mechanical polishing composition comprises (a) an abrasive selected from the group consisting of ?-alumina, ?-alumina, ?-alumina, ?-alumina, diamond, boron carbide, silicon carbide, tungsten carbide, titanium nitride, and mixtures thereof, (b) about 0.05 to about 3.5 mmol/kg of ions of calcium, strontium, barium, magnesium, zinc, or mixtures thereof, and (c) a liquid carrier comprising water.Type: ApplicationFiled: February 26, 2009Publication date: June 18, 2009Applicant: Cabot Microelectronics CorporationInventors: Francesco de Rege Thesauro, Kevin J. Moeggenborg, Vlasta Brusic, Benjamin P. Bayer
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Patent number: 7485241Abstract: The invention provides a chemical-mechanical polishing composition comprising: (a) fumed silica particles, (b) about 5×10?3 to about 10 millimoles per kilogram of at least one alkaline earth metal selected from the group consisting of calcium, strontium, barium, and mixtures thereof, based on the total weight of the polishing composition, (c) about 0.1 to about 15 wt. % of an oxidizing agent, and (d) a liquid carrier comprising water. The invention also provides a polishing composition, which optionally comprises an oxidizing agent, comprising about 5×10?3 to about 10 millimoles per kilogram of at least one alkaline earth metal selected from the group consisting of calcium, strontium, and mixtures thereof. The invention further provides methods for polishing a substrate using the aforementioned polishing compositions.Type: GrantFiled: September 11, 2003Date of Patent: February 3, 2009Assignee: Cabot Microelectronics CorporationInventors: David J. Schroeder, Kevin J. Moeggenborg
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Publication number: 20080057832Abstract: The invention provides a chemical-mechanical polishing composition comprising: (a) silica particles, (b) about 5×10?3 to about 10 millimoles per kilogram of at least one alkaline earth metal selected from the group consisting of calcium, strontium, barium, and mixtures thereof, based on the total weight of the polishing composition, (c) about 0.1 to about 15 wt. % of an oxidizing agent, and (d) a liquid carrier comprising water. The invention also provides a polishing composition, which optionally comprises an oxidizing agent, comprising about 5×10?3 to about 10 millimoles per kilogram of at least one alkaline earth metal selected from the group consisting of calcium, strontium, and mixtures thereof. The invention further provides methods for polishing a substrate using the aforementioned polishing compositions.Type: ApplicationFiled: September 10, 2004Publication date: March 6, 2008Inventors: David J. Schroeder, Kevin J. Moeggenborg
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Patent number: 7255810Abstract: The invention provides a polishing system and method of its use comprising (a) a liquid carrier, (b) a polymer having a degree of branching of about 50% or greater, and (c) a polishing pad, an abrasive, or a combination thereof.Type: GrantFiled: January 9, 2004Date of Patent: August 14, 2007Assignee: Cabot Microelectronics CorporationInventors: Kevin J. Moeggenborg, Fred F. Sun
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Patent number: 7004819Abstract: The invention provides a chemical-mechanical polishing system and method comprising a liquid carrier, a polishing pad and/or an abrasive, and at least one amine-containing polymer, wherein the amine-containing polymer has about 5 or more sequential atoms separating the nitrogen atoms of the amino functional groups or is a block copolymer with at least one polymer block comprising one or more amine functional groups and at least one polymer block not comprising any amine functional groups.Type: GrantFiled: January 18, 2002Date of Patent: February 28, 2006Assignee: Cabot Microelectronics CorporationInventors: Kevin J. Moeggenborg, Isaac K. Cherian, Vlasta Brusic
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Patent number: 6974777Abstract: The invention provides a method of polishing a substrate containing a low-k dielectric layer comprising (i) contacting the substrate with a chemical-mechanical polishing system comprising (a) an abrasive, a polishing pad, or a combination thereof, (b) an amphiphilic nonionic surfactant, and (c) a liquid carrier, and (ii) abrading at least a portion of the substrate to polish the substrate.Type: GrantFiled: June 7, 2002Date of Patent: December 13, 2005Assignee: Cabot Microelectronics CorporationInventors: Kevin J. Moeggenborg, Homer Chou, Joseph D. Hawkins, Jeffrey P. Chamberlain
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Patent number: 6936543Abstract: The invention provides methods of polishing a substrate comprising (i) contacting a substrate comprising at least one metal layer comprising copper with a chemical-mechanical polishing (CMP) system and (ii) abrading at least a portion of the metal layer comprising copper to polish the substrate. The CMP system comprises (a) an abrasive, (b) an amphiphilic nonionic surfactant, (c) a means for oxidizing the metal layer, (d) an organic acid, (e) a corrosion inhibitor, and (f) a liquid carrier. The invention further provides a two-step method of polishing a substrate comprising a first metal layer and a second, different metal layer. The first metal layer is polishing with a first CMP system comprising an abrasive and a liquid carrier, and the second metal layer is polished with a second CMP system comprising (a) an abrasive, (b) an amphiphilic nonionic surfactant, and (c) a liquid carrier.Type: GrantFiled: October 11, 2002Date of Patent: August 30, 2005Assignee: Cabot Microelectronics CorporationInventors: David J. Schroeder, Kevin J. Moeggenborg, Homer Chou, Jeffrey P. Chamberlain, Joseph D. Hawkins, Phillip Carter
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Patent number: 6841479Abstract: The invention provides a method of reducing in-trench smearing during polishing. The method comprises providing a substrate comprising a first layer comprising an insulating material, a second layer comprising a filling material, and a plurality of field and trench regions. A polymeric material is infiltrated over the substrate, wherein the polymeric material fills the trench regions and covers the field regions. The polymeric material optionally is removed from the field regions, followed by baking of the substrate such that the polymeric material in the trench regions becomes recessed below the insulating material of the field regions. The substrate is then subjected to a temperature of about 100° C. or more for about 30 minutes or longer, such that during polishing of the substrate, smearing of the filling material in the trench regions is reduced as compared to polishing of the substrate under the same conditions except for subjecting the substrate to the temperature of about 100° C.Type: GrantFiled: April 10, 2002Date of Patent: January 11, 2005Assignee: Cabot Microelectronics CorporationInventors: Isaac K. Cherian, Paul M. Feeney, Kevin J. Moeggenborg
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Publication number: 20030228762Abstract: The invention provides a method of polishing a substrate containing a low-k dielectric layer comprising (i) contacting the substrate with a chemical-mechanical polishing system comprising (a) an abrasive, a polishing pad, or a combination thereof, (b) an amphiphilic nonionic surfactant, and (c) a liquid carrier, and (ii) abrading at least a portion of the substrate to polish the substrate.Type: ApplicationFiled: June 7, 2002Publication date: December 11, 2003Applicant: Cabot Microelectronics CorporationInventors: Kevin J. Moeggenborg, Homer Chou, Joseph D. Hawkins, Jeffrey P. Chamberlain
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Publication number: 20030228763Abstract: The invention provides methods of polishing a substrate comprising (i) contacting a substrate comprising at least one metal layer comprising copper with a chemical-mechanical polishing (CMP) system and (ii) abrading at least a portion of the metal layer comprising copper to polish the substrate. The CMP system comprises (a) an abrasive, (b) an amphiphilic nonionic surfactant, (c) a means for oxidizing the metal layer, (d) an organic acid, (e) a corrosion inhibitor, and (f) a liquid carrier. The invention further provides a two-step method of polishing a substrate comprising a first metal layer and a second, different metal layer. The first metal layer is polishing with a first CMP system comprising an abrasive and a liquid carrier, and the second metal layer is polished with a second CMP system comprising (a) an abrasive, (b) an amphiphilic nonionic surfactant, and (c) a liquid carrier.Type: ApplicationFiled: October 11, 2002Publication date: December 11, 2003Applicant: Cabot Microelectronics CorporationInventors: David J. Schroeder, Kevin J. Moeggenborg, Homer Chou, Jeffrey P. Chamberlain, Joseph D. Hawkins, Phillip Carter
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Publication number: 20030139116Abstract: The invention provides a chemical-mechanical polishing system and method comprising a liquid carrier, a polishing pad and/or an abrasive, and at least one amine-containing polymer, wherein the amine-containing polymer has about 5 or more sequential atoms separating the nitrogen atoms of the amino functional groups or is a block copolymer with at least one polymer block comprising one or more amine functional groups and at least one polymer block not comprising any amine functional groups.Type: ApplicationFiled: January 18, 2002Publication date: July 24, 2003Applicant: Cabot Microelectronics CorporationInventors: Kevin J. Moeggenborg, Isaac K. Cherian, Vlasta Brusic
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Patent number: 6527622Abstract: The invention provides a method of polishing a substrate comprising a noble metal comprising (i) contacting the substrate with a CMP system and (ii) abrading at least a portion of the substrate to polish the substrate. The CMP systems each comprise an abrasive and/or polishing pad, a liquid carrier, and optionally one or more polishing additives. In a first embodiment, the polishing additives are selected from the group consisting of diketones, diketonates, heterocyclic nitrogen-containing compounds, heterocyclic oxygen-containing compounds, heterocyclic phosphorus-containing compounds, urea compounds, nitrogen-containing compounds that can be zwitterionic compounds, salts thereof, and combinations thereof. In a second embodiment, the polishing additive is a metal compound with two or more oxidation states and is used in conjunction with a peroxy-type oxidizer.Type: GrantFiled: January 22, 2002Date of Patent: March 4, 2003Assignee: Cabot Microelectronics CorporationInventors: Vlasta Brusic, Francesco M. De Rege, Kevin J. Moeggenborg, Isaac K. Cherian, Renjie Zhou
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Publication number: 20020151177Abstract: The invention provides a method of reducing in-trench smearing during polishing. The method comprises providing a substrate comprising a first layer comprising an insulating material, a second layer comprising a filling material, and a plurality of field and trench regions. A polymeric material is infiltrated over the substrate, wherein the polymeric material fills the trench regions and covers the field regions. The polymeric material optionally is removed from the field regions, followed by baking of the substrate such that the polymeric material in the trench regions becomes recessed below the insulating material of the field regions. The substrate is then subjected to a temperature of about 100° C. or more for about 30 minutes or longer, such that during polishing of the substrate, smearing of the filling material in the trench regions is reduced as compared to polishing of the substrate under the same conditions except for subjecting the substrate to the temperature of about 100° C.Type: ApplicationFiled: April 10, 2002Publication date: October 17, 2002Applicant: Cabot Microelectrics CorporationInventors: Isaac K. Cherian, Paul M. Feeney, Kevin J. Moeggenborg
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Patent number: 6153106Abstract: The present invention relates to a method for inhibiting the formation and deposition of silica scale in water systems. The method includes treating the water in such water systems with an effective amount of a polyamide that exhibits secondary amine and/or ether and amide functional groups.Type: GrantFiled: March 3, 1999Date of Patent: November 28, 2000Assignee: Nalco Chemical CompanyInventors: Douglas G. Kelley, Kevin J. Moeggenborg, David P. Workman
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Patent number: 6075082Abstract: A method for binding ceramic materials in aqueous media is disclosed. The method utilizes water-soluble cross-linked polyamides prepared by condensation polymerization for binding various classes of ceramic materials.Type: GrantFiled: September 29, 1998Date of Patent: June 13, 2000Assignee: Nalco Chemical CompanyInventors: David P. Workman, Kristy M. Bailey, Kevin J. Moeggenborg
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Patent number: 6060318Abstract: The present invention provides for an improved method for monitoring the concentration of molecules and chemical treatment agents in ceramic slurries and powders.Type: GrantFiled: December 31, 1998Date of Patent: May 9, 2000Assignee: Nalco Chemical CompanyInventors: Kevin J. Moeggenborg, James E. Whitten, Joseph C. Alfano
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Patent number: 6005040Abstract: Methods for dispersing and binding ceramic materials in aqueous media are disclosed. The methods utilize water-soluble polymers having pendant derivatized amide, ester or ether functionalities for dispersing and binding various classes of ceramic materials.Type: GrantFiled: November 5, 1998Date of Patent: December 21, 1999Assignee: Nalco Chemical CompanyInventors: Christopher P. Howland, Kevin J. Moeggenborg, John D. Morris, Peter E. Reed, Jiansheng Tang, Jin-Shan Wang
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Patent number: 5922801Abstract: A method for binding ceramic materials in aqueous media is disclosed. The method utilizes water-soluble polyamides prepared by condensation polymerization for binding various classes of ceramic materials.Type: GrantFiled: December 3, 1997Date of Patent: July 13, 1999Assignee: Nalco Chemical CompanyInventors: Kristy M. Bailey, Christopher P. Howland, Kevin J. Moeggenborg