Abstract: A method for fabricating a rigid lamination. The method includes providing a first rigid substrate, disposing an adhesive on a surface of the first rigid substrate and disposing a second rigid substrate on at least a portion of the adhesive. The second rigid substrate has a first end and a second end. The second rigid substrate is heated to a substantially uniform temperature, where the temperature is sufficient to melt the adhesive. A non-uniform pressure is applied to a surface of the second rigid substrate. The non-uniform pressure includes a lesser pressure and a greater pressure, where the greater pressure is applied at the first end of the second rigid substrate and is sufficient to impart adhesive flow in a direction toward the second end.