Abstract: Web connectors for use in occupant restraint systems in a vehicle are disclosed herein. In one embodiment, first and second web connectors include first and second web receiving portions, respectively. The first web receiving portion includes a first projection at a first side and a first recess adjacent a second side opposite the first side. The first recess includes a first surface feature. The second web receiving portion includes a second recess and a second projection having a second surface feature. In this embodiment, the second recess is configured to receive the first projection, the first recess is configured to receive the second projection, and the first surface feature is configured to engage the second surface feature to resist movement between the first and second connectors during use.

Abstract: This invention relates to a method for decolorizing a dyed denim fabric through a dry ozone process to obtain an aesthetically pleasing decolorized look or fashionably faded look in the denim fabric. The method comprises three dry ozone treatment processes used alone or in combination thereof. The first dry ozone treatment process includes wetting a denim textile product with water and oxidizing it with ozone. The second dry ozone treatment process includes spraying water to desired areas of the textile product and oxidizing it with ozone. The third dry ozone treatment process includes loading the denim textile product and wetted cotton fabric scraps into a drum, and oxidizing them with ozone.

Abstract: This invention relates to a method for decolorizing a dyed denim fabric through a dry ozone process to obtain an aesthetically pleasing decolorized look or fashionably faded look in the denim fabric. The method comprises three dry ozone treatment processes used alone or in combination thereof. The first dry ozone treatment process includes wetting a denim textile product with water and oxidizing it with ozone. The second dry ozone treatment process includes spraying water to desired areas of the textile product and oxidizing it with ozone. The third dry ozone treatment process includes loading the denim textile product and wetted cotton fabric scraps into a drum, and oxidizing them with ozone.

Abstract: Web connectors for use in occupant restraint systems in a vehicle are disclosed herein. In one embodiment, first and second web connectors include first and second web receiving portions, respectively. The first web receiving portion includes a first projection at a first side and a first recess adjacent a second side opposite the first side. The first recess includes a first surface feature. The second web receiving portion includes a second recess and a second projection having a second surface feature. In this embodiment, the second recess is configured to receive the first projection, the first recess is configured to receive the second projection, and the first surface feature is configured to engage the second surface feature to resist movement between the first and second connectors during use.

Abstract: This invention relates to a method for decolorizing a dyed denim fabric through a dry ozone process to obtain an aesthetically pleasing decolorized look or fashionably faded look in the denim fabric. The method comprises three dry ozone treatment processes used alone or in combination thereof. The first dry ozone treatment process includes wetting a denim textile product with water and oxidizing it with ozone. The second dry ozone treatment process includes spraying water to desired areas of the textile product and oxidizing it with ozone. The third dry ozone treatment process includes loading the denim textile product and wetted cotton fabric scraps into a drum, and oxidizing them with ozone.

Abstract: A moveable dispenser assembly including is shown. The dispenser includes a reservoir having bonding adhesive therein including particles and a liquid carrier. The dispenser is moved to provide agitation to the dispenser for mixing the bonding adhesive into a homogeneous mixture of particles and the liquid carrier. An opening at an end of said dispenser dispenses the bonding adhesive onto a bonding location on the workpiece without removing the dispenser from the die attach apparatus. A one controller for sends a control signal that triggers moving of said moveable dispenser assembly for mixing said bonding adhesive before dispensing said volume of bonding adhesive onto said surface of said workpiece. The controller includes logic to control of movements such as oscillations to keep the bonding adhesive well mixed based on a comparing a parameter to be in a predetermined limit or range.

Abstract: This invention relates to a method for decolorizing a dyed denim fabric through a dry ozone process to obtain an aesthetically pleasing decolorized look or fashionably faded look in the denim fabric. The method comprises three dry ozone treatment processes used alone or in combination thereof. The first dry ozone treatment process includes wetting a denim textile product with water and oxidizing it with ozone. The second dry ozone treatment process includes spraying water to desired areas of the textile product and oxidizing it with ozone. The third dry ozone treatment process includes loading the denim textile product and wetted cotton fabric scraps into a drum, and oxidizing them with ozone.

Abstract: A method for die bonding includes positioning a dispenser in a die bonding apparatus, wherein the dispenser includes a reservoir having bonding adhesive therein including particles and a liquid carrier. The dispenser is moved to provide mechanical agitation to the dispenser for mixing the bonding adhesive into a homogeneous mixture of particles and the liquid carrier, wherein the bonding adhesive is not dispensed during moving. After the moving, the bonding adhesive is dispensed onto a bonding location on the workpiece without removing the dispenser from the die attach apparatus. An integrated circuit (IC) die is attached onto the bonding adhesive over the bonding location. The method can also include determining an amount of time elapsed after the last mixing of the bonding adhesive or the positioning of the dispenser in the die bonding apparatus, and automatically initiating movement for mixing only if the elapsed time exceeds a predetermined time.

Abstract: A moveable dispenser assembly including is shown. The dispenser includes a reservoir having bonding adhesive therein including particles and a liquid carrier. The dispenser is moved to provide agitation to the dispenser for mixing the bonding adhesive into a homogeneous mixture of particles and the liquid carrier. An opening at an end of said dispenser dispenses the bonding adhesive onto a bonding location on the workpiece without removing the dispenser from the die attach apparatus. A one controller for sends a control signal that triggers moving of said moveable dispenser assembly for mixing said bonding adhesive before dispensing said volume of bonding adhesive onto said surface of said workpiece. The controller includes logic to control of movements such as oscillations to keep the bonding adhesive well mixed based on a comparing a parameter to be in a predetermined limit or range.

Abstract: A method for die bonding includes positioning a dispenser in a die bonding apparatus, wherein the dispenser includes a reservoir having bonding adhesive therein including particles and a liquid carrier. The dispenser is moved to provide mechanical agitation to the dispenser for mixing the bonding adhesive into a homogeneous mixture of particles and the liquid carrier, wherein the bonding adhesive is not dispensed during moving. After the moving, the bonding adhesive is dispensed onto a bonding location on the workpiece without removing the dispenser from the die attach apparatus. An integrated circuit (IC) die is attached onto the bonding adhesive over the bonding location. The method can also include determining an amount of time elapsed after the last mixing of the bonding adhesive or the positioning of the dispenser in the die bonding apparatus, and automatically initiating movement for mixing only if the elapsed time exceeds a predetermined time.

Abstract: The invention provides semiconductor chip packages, tools, and methods for preventing and for correcting leadfinger deformation caused during wirebonding in semiconductor chip package manufacturing. Disclosed are improved heat blocks and methods for their use in ensuring adequate clearance between leadfingers and adjacent heat spreaders, as well as semiconductor chip package assemblies wherein a selected clearance between leadfingers and parallel surfaces may be assured. Methods of the invention include steps for supporting the proximal ends of the leadfingers using the wirebonding cavity of a heat block. Thus supported, a plurality of bondwires are attached to couple bond pads of the semiconductor chip to the proximal ends of leadfingers. Thereafter, the clearance between the wirebonded proximal ends of the leadfingers and the adjacent parallel surface of the heat spreader is adjusted using a spacing cavity of the heat block.

Abstract: The invention provides semiconductor chip packages, tools, and methods for preventing and for correcting leadfinger deformation caused during wirebonding in semiconductor chip package manufacturing. Disclosed are improved heat blocks and methods for their use in ensuring adequate clearance between leadfingers and adjacent heat spreaders, as well as semiconductor chip package assemblies wherein a selected clearance between leadfingers and parallel surfaces may be assured. Methods of the invention include steps for supporting the proximal ends of the leadfingers using the wirebonding cavity of a heat block. Thus supported, a plurality of bondwires are attached to couple bond pads of the semiconductor chip to the proximal ends of leadfingers. Thereafter, the clearance between the wirebonded proximal ends of the leadfingers and the adjacent parallel surface of the heat spreader is adjusted using a spacing cavity of the heat block.

Abstract: Methods and apparatus are disclosed to dispense adhesive for semiconductor packaging. A disclosed example shower head dispenser includes a body to receive adhesive from the dispenser, and a shower head tip having a dispensing cavity in communication with the body to dispense the adhesive in a pattern. The example shower head dispenser also includes a layer of non-stick material coating a contact surface of the dispensing cavity to reduce tailing of the adhesive.

Abstract: A flip chip semiconductor device having non-solder contact terminals is assembled by securing the chip and substrate with a rapidly thermosetting adhesive. The process is amenable to various bump and substrate materials, and has the advantage of simultaneously adhering the components and of providing a void free underfill. The process makes use of absorption of infrared energy by the chip to heat the adhesive and cause it to flow prior to rapidly solidifying from the center outwardly. The rapid assembly, using a simple infrared exposure apparatus is compatible with reel to reel, or other highly automated in-line processes.

Abstract: A flip chip semiconductor device having non-solder contact terminals is assembled by securing the chip and substrate with a rapidly thermosetting adhesive. The process is amenable to various bump and substrate materials, and has the advantage of simultaneously adhering the components and of providing a void free underfill. The process makes use of absorption of infrared energy by the chip to heat the adhesive and cause it to flow prior to rapidly solidifying from the center outwardly. The rapid assembly, using a simple infrared exposure apparatus is compatible with reel to reel, or other highly automated in-line processes.

Abstract: A flip chip semiconductor device having non-solder contact terminals is assembled by securing the chip and substrate with a rapidly thermosetting adhesive. The process is amenable to various bump and substrate materials, and has the advantage of simultaneously adhering the components and of providing a void free underfill. The process makes use of absorption of infrared energy by the chip to heat the adhesive and cause it to flow prior to rapidly solidifying from the center outwardly. The rapid assembly, using a simple infrared exposure apparatus is compatible with reel to reel, or other highly automated in-line processes.