Patents by Inventor Kevin John Bersamira Delos Santos

Kevin John Bersamira Delos Santos has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11211320
    Abstract: A semiconductor package includes a pad and leads having a planar profile shaped from a planar base metal, a semiconductor die attached to the pad, a wire bond extending from the semiconductor die to a respective lead, and mold compound covering the semiconductor die, the wire bond, and a first portion of the respective lead, wherein a second portion of the respective lead extends beyond the mold compound. A shape of the respective lead within the planar profile includes a notch indented relative to a first elongated side of the shape of the respective lead and a protrusion protruding outwardly relative to a second elongated side of the shape of the respective lead. The notch and the protrusion are each partially covered by the mold compound and partially outside the mold compound.
    Type: Grant
    Filed: December 31, 2019
    Date of Patent: December 28, 2021
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Dolores Babaran Milo, Joe Ann Feive Carbonell Lopez, Gloria Bibal Manaois, Kevin John Bersamira Delos Santos
  • Publication number: 20210202365
    Abstract: A semiconductor package includes a pad and leads having a planar profile shaped from a planar base metal, a semiconductor die attached to the pad, a wire bond extending from the semiconductor die to a respective lead, and mold compound covering the semiconductor die, the wire bond, and a first portion of the respective lead, wherein a second portion of the respective lead extends beyond the mold compound. A shape of the respective lead within the planar profile includes a notch indented relative to a first elongated side of the shape of the respective lead and a protrusion protruding outwardly relative to a second elongated side of the shape of the respective lead. The notch and the protrusion are each partially covered by the mold compound and partially outside the mold compound.
    Type: Application
    Filed: December 31, 2019
    Publication date: July 1, 2021
    Inventors: Dolores Babaran Milo, Joe Ann Feive Carbonell Lopez, Gloria Bibal Manaois, Kevin John Bersamira Delos Santos