Patents by Inventor Kevin Joseph Lodge

Kevin Joseph Lodge has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20040173660
    Abstract: In a method of soldering the surfaces of a component (11) to a substrate (12), a solder preform (15) is located in the gap between the surfaces. The solder is heated and an over pressure applied to move the surfaces together whilst the solder is molten. Abutments (17) between the surfaces limit the spacing between them. A trapped void (18) is decreased in volume as the pressure is applied. The method is particularly applicable to monolithic microwave integrated circuits (MMIC) and reduces void areas in joints.
    Type: Application
    Filed: April 27, 2004
    Publication date: September 9, 2004
    Inventors: Kevin Joseph Lodge, Giles Humpston, James Vincent