Abstract: The invention relates to methods and products associated with in vivo enzyme profiling. In particular, biomarker nanoparticles capable of quantitatively detecting enzymatic activity in vivo are described. These nanoparticles can be used to detect in vivo enzyme activity. The invention also relates to products, kits, and databases for use in the methods of the invention.

Abstract: A method and system provide a magnetic transducer having an air-bearing surface (ABS). The magnetic transducer includes a main pole having a pole tip, at least one auxiliary pole and at least one coil for energizing the main pole. The auxiliary pole(s) are adjacent to the main pole in a down track direction and recessed from the ABS. The coil(s) have a plurality of turns. At least one of the turns is between the auxiliary pole(s) and the ABS.

Abstract: Methods for manufacturing hybrid coils for magnetic write heads used in disk drives are described. One such embodiment includes a magnetic read/write head including a read transducer, and a write transducer including a pair of write poles, a hybrid coil including a first coil having a pancake coil configuration with at least one turn positioned between the pair of write poles, and a second coil having a helical coil configuration including a plurality of turns positioned between the pair of write poles, the second coil coupled to the first coil, where the at least one turn of the first coil is interleaved with the turns of the second coil.

Abstract: A method and system provide a magnetic transducer having an air-bearing surface (ABS). The magnetic transducer includes a write pole and a coil. The write pole has a pole tip and a yoke. The coil energizes the write pole and includes a plurality of turns. A turn of the plurality of turns has a first portion and a second portion. The first portion has a first length in a stripe height direction substantially perpendicular to the ABS. The second portion has a second length in the stripe height direction. The second length is greater than the first length and extends at least to at least one adjacent turn.

Abstract: A method and system provide a magnetic transducer having an air-bearing surface (ABS). The magnetic transducer includes a write pole and at least one coil. The write pole has a pole tip and a yoke. The coil(s) energize the write pole. The coil(s) include a plurality of turns a first distance from the pole and at least one additional turn a second distance from the pole. The first distance is different from the second distance. The at least one additional turn extends over at least part of two of the plurality of turns, has a length in a stripe height direction perpendicular to the ABS and has a height in a down track direction. The length is greater than the height.

Abstract: A method for manufacturing a magnetic transducer is described. The method includes providing a negative mask having a bottom, a plurality of sides, and a top wider than the bottom. The method also includes depositing a nonmagnetic layer on the negative mask. The nonmagnetic layer has a plurality of portions covering the plurality of sides of the negative mask. The method also includes providing a first mask having a first trench therein. The negative mask resides in the first trench. The method further includes depositing side shield material(s), at least a portion of which resides in the first trench. The method further includes removing the negative mask to create a second trench between the plurality of portions of the nonmagnetic layer and form a pole, at least a portion of which resides in the second trench.

Abstract: Systems and methods for providing hybrid coils for magnetic write heads used in disk drives are described. One such system includes a magnetic read/write head including a read transducer, and a write transducer including a pair of write poles, a hybrid coil including a first coil having a pancake coil configuration including at least one turn positioned between the pair of write poles, and a second coil having a helical coil configuration including a plurality of turns positioned between the pair of write poles, the second coil coupled to the first coil, where the at least one turn of the first coil is interleaved with the turns of the second coil.

Abstract: A magnetic recording transducer includes a main pole including a nose portion, the nose portion terminating at an air-bearing surface (ABS). The magnetic recording transducer further includes at least one coil having a coil front distal from the ABS, and at least one side shield, the at least one side shield extending from at the ABS to not further than the coil front.

Abstract: A method provides an EAMR transducer. A sacrificial post is provided on an NFT distal from the ABS. This post has an edge proximate and substantially parallel to the ABS. A sacrificial mask is provided on the NFT between the post and the ABS. Optical material(s) are provided. The post is between the optical material(s) and the ABS. The post is removed. A heat sink post corresponding to the post is provided. The heat sink post has a bottom thermally coupled with the NFT and an edge proximate and substantially parallel to the ABS. Part of the heat sink post is removed, forming a heat sink having a top surface at an acute angle from the ABS. Nonmagnetic material(s) are provided on the optical material(s). A pole having a bottom surface thermally coupled with the heat sink and coil(s) are provided.

Abstract: A method provides a magnetic transducer that includes an underlayer and a nonmagnetic layer on the underlayer. The method includes providing a plurality of trenches in the nonmagnetic layer. A first trench of corresponds to a main pole, while at least one side trench corresponds to at least one side shield. The method also includes providing mask covering the side trench(es) and providing the main pole. At least a portion of the main pole resides in the first trench. The method also includes removing at least a portion of the nonmagnetic layer residing between the side trench(es) and the main pole. The method also includes providing at least one side shield. The shield(s) extend from at least an air-bearing surface location to not further than a coil front location.

Abstract: An electro-mechanical device package includes a cap material permanently bonded to a device wafer encapsulating an electromechanical device. An intermediate material is used to bond the device and capping material together at a low temperature, and a structure including the intermediate material emanating from either the device or cap material, or both, provides an interlocking at the bonding interface. One package includes a reusable carrier wafer with a similar coefficient of thermal expansion as a mating material and a low cost cap wafer of different material than the device wafer. A method for temporarily bonding the cap material to the carrier wafer includes attaching the cap material to the carrier wafer and is then singulated to mitigate thermal expansion mismatch with the device wafer.

Abstract: A wafer level package filter includes a device wafer having an acoustic wave device disposed on its surface, the acoustic wave device including at least an acoustic wave resonator associated with a piezoelectric substrate and a connecting pad. A capped substrate includes circuitry having inductors and capacitors. The capped substrate has a coefficient of thermal expansion significantly unequal to a coefficient of thermal expansion for the piezoelectric substrate. An adhesive bond connects the capped substrate to the device wafer for encapsulating the acoustic wave device within a cavity. A dielectric overcoat is deposited over a portion of the capped substrate, and a metallization layer extends over a portion of the dielectric layer connecting the capped substrate circuitry to a connecting pad of the acoustic wave device. Optionally, a bond connecting the capped substrate to the device wafer may provide an interlocking connection.

Abstract: A SAW filter is fabricated at a wafer level for providing desirable temperature characteristics. The filter includes a piezoelectric substrate bonded to a carrier substrate, wherein the coefficient of thermal expansion of the carrier substrate is less than the coefficient of thermal expansion of the piezoelectric substrate. Interdigital transducers are formed on the piezoelectric substrate so as to form a SAW composite die structure. A cap substrate having a coefficient of thermal expansion similar to that of the carrier substrate is bonded to the SAW composite die structure for enclosing the interdigital transducers. Plated vias form signal pad interconnects to input and output pads of the interdigital transducer and a sealing pad formed on the surface of the piezoelectric substrate bonds the SAW composite die structure to the cap substrate.

Abstract: An electro-mechanical device package includes a cap material permanently bonded to a device wafer encapsulating an electromechanical device. An intermediate material is used to bond the device and capping material together at a low temperature, and a structure including the intermediate material emanating from either the device or cap material, or both, provides an interlocking at the bonding interface. One package includes a reusable carrier wafer with a similar coefficient of thermal expansion as a mating material and a low cost cap wafer of different material than the device wafer. A method for temporarily bonding the cap material to the carrier wafer includes attaching the cap material to the carrier wafer and is then singulated to mitigate thermal expansion mismatch with the device wafer.