Abstract: A composite composition, and process for making and article comprising same, the composition comprising 3 to 30 parts by weight particles comprising aramid copolymer including an imidazole group, and up to 97 parts by weight of a thermoplastic engineering polymer; wherein said particles are uniformly dispersed in the thermoplastic engineering polymer and reduce the wear rate of the thermoplastic engineering polymer by at least 25 percent.

Abstract: A polymeric film and process for making same, the film comprising residues of 5(6)-amino-2-(p-aminophenyl) benzimidazole, aromatic diamine, and aromatic diacid-chloride, in the form of polymer having a polymer chain including a salt of formula I, wherein C+ is a sodium, potassium, or calcium cation, the film having a thickness of about 1 to 50 micrometers, and a dielectric constant of 4.5 or greater at 2 GHz in the absence of any particulate additives that increase the dielectric constant of the film.

Abstract: A filled polymeric film comprising polymer and an inorganic dielectric constant-enhancing additive, the filled polymeric film having 12 to 75 percent by weight of said inorganic dielectric constant-enhancing additive, based on the total weight of the polymer and said inorganic constant-enhancing additive in the filled polymeric film; wherein the polymer comprises imidazole groups; and wherein the filled polymeric film has a filled film tenacity that is 70 to 100 percent of a neat film tenacity of a polymeric film having the same thickness made from the same polymer but without the said inorganic dielectric constant-enhancing additive.