Patents by Inventor Kevin Kuo

Kevin Kuo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240133309
    Abstract: A seal monitoring apparatus is provided. The seal monitoring apparatus includes a temperature sensor and a controller in communication with the temperature sensor. The temperature sensor is mounted at a seal of a device. The controller is configured to receive measured temperature data from the temperature sensor and calculate expected temperature data for the seal based at least in part on operating conditions of the device. The controller is configured to determine a condition of the seal based at least in part on a temperature difference of the measured temperature data from the expected temperature data.
    Type: Application
    Filed: October 24, 2022
    Publication date: April 25, 2024
    Inventors: Rahul Anil Bidkar, Deepak Trivedi, Bugra H. Ertas, Pei-Hsin Kuo, Joseph Herbert Fields, Andrew Kevin Winn, Eric R. Westervelt
  • Patent number: 8350059
    Abstract: Disclosed herein are methods and intermediates useful in the preparation of macrolides, e.g., compounds of formula (IV) wherein R1-R12 are as defined herein.
    Type: Grant
    Filed: December 8, 2008
    Date of Patent: January 8, 2013
    Assignee: Eisai R&D Management Co., Ltd.
    Inventors: Roch Boivin, Silvio A. Campagna, Hong Du, Francis G. Fang, Thomas Horstmann, Charles-Andre Lemelin, Jing Li, Pamela McGuinness, Xiang Niu, Matthew J. Schnaderbeck, Kevin (kuo-ming) Wu, Xiaojie (jeff) Zhu
  • Publication number: 20110237805
    Abstract: Disclosed herein are methods and intermediates useful in the preparation of macrolides, e.g., compounds of formula (IV) wherein R1-R12 are as defined herein.
    Type: Application
    Filed: December 8, 2008
    Publication date: September 29, 2011
    Applicant: EISAI R&D MANAGEMENT CO., LTD.
    Inventors: Roch Boivin, Silvio A. Campagna, Hong Du, Francis G. Fang, Thomas Horstmann, Charles-Andre Lemelin, Jing Li, Pamela Mcguinness, Xiang Niu, Matthew J. Schnaderbeck, Kevin (kuo-ming) Wu, Xiaojie (Jeff) Zhu
  • Publication number: 20110094592
    Abstract: A fluid check valve consisting of a pair of leaflets contained within an annular body member (10). These leaflets (16 and 17) open and close hemodynamically as a reaction to the natural pumping action of the heart. They open from the center outward based upon their S shape profile (45). Blood flows through the interior surface (12) of the annular body member and leaflets. These leaflets open and close relying upon, protruding rails from the annular body member (20 and 21) and their integrated stop means (31-38). The protruding rails guide the leaflets in a floating pivot action that virtually eliminates area of stasis and prevent thrombosis.
    Type: Application
    Filed: October 22, 2010
    Publication date: April 28, 2011
    Inventors: Howard Shi-How Cheng, Kevin Kuo-Tsai Cheng
  • Patent number: 7560812
    Abstract: An electronic assembly includes a substrate, a chip, a conductive fence and a heat sink. The substrate has a bonding surface. The chip is bonded to the bonding surface. The conductive fence connects the bonding surface and at least locally surrounds the sides of the chip. The heat sink is disposed over the substrate and contacts the chip and the conductive fence. By disposing the conductive fence between the substrate and the heat sink, the conductive fence and the heat sink can further function as the shields of the chip to reduce any adverse influence of an ESD current on the chip.
    Type: Grant
    Filed: October 30, 2006
    Date of Patent: July 14, 2009
    Assignee: VIA Technologies, Inc.
    Inventors: Kevin Kuo, Stanley Huang, Cheng-Ming Hsu, Neng-An Kuo
  • Publication number: 20080012123
    Abstract: An electronic assembly includes a substrate, a chip, a conductive fence and a heat sink. The substrate has a bonding surface. The chip is bonded to the bonding surface. The conductive fence connects the bonding surface and at least locally surrounds the sides of the chip. The heat sink is disposed over the substrate and contacts the chip and the conductive fence. By disposing the conductive fence between the substrate and the heat sink, the conductive fence and the heat sink can further function as the shields of the chip to reduce any adverse influence of an ESD current on the chip.
    Type: Application
    Filed: October 30, 2006
    Publication date: January 17, 2008
    Applicant: VIA TECHNOLOGIES, INC.
    Inventors: Kevin Kuo, Stanley Huang, Cheng-Ming Hsu, Neng-An Kuo
  • Publication number: 20060056149
    Abstract: An electronic device includes a first metal case, a second metal case, an electronic unit, a first heat insulation layer and a second heat insulation layer. In this case, the first metal case has a plurality of first holes, and the second metal case has a plurality of second holes. The first metal case is assembled with the second metal case to form an accommodating space. The electronic unit is disposed in the accommodating space. At least one surface of the first metal case is coated with the first heat insulation layer, and at least one surface of the second metal case is coated with the second heat insulation layer.
    Type: Application
    Filed: November 9, 2005
    Publication date: March 16, 2006
    Inventors: Robert Kuo, James Hsyu, Cary Hsiao, Kevin Kuo
  • Publication number: 20060040529
    Abstract: A fixing component of a main board comprises a connecting part, a thread-assembling part and a fixing part. The connecting part has a first surface and a second surface, wherein the first surface is disposed opposite to the second surface. The thread-assembling part is disposed on the first surface of the connecting part. The fixing part is disposed on the second surface. The connecting part and the fixing part are disposed on a main board by utilizing DIP technology and SMT.
    Type: Application
    Filed: January 18, 2005
    Publication date: February 23, 2006
    Applicant: VIA Technologies, Inc.
    Inventors: Kevin Kuo, James Hsyu, Langhans Chang
  • Publication number: 20060023423
    Abstract: An expandable heat sink is used for dissipating heat of a heat source on a main board. The heat sink comprises a main body and an expanded body. The main body comprises a main-body contact surface, which is contacted with the heat source, and a plurality of first fins. The first fins compose a main connecting portion. Furthermore, the expanded body comprises a plurality of second fins and the second fins compose an expanded connecting portion. The expanded connecting portion is removably connected to the main connecting portion.
    Type: Application
    Filed: November 16, 2004
    Publication date: February 2, 2006
    Applicant: VIA Technologies, Inc.
    Inventors: Kevin Kuo, James Hsyu, Langhans Chang, Robert Kuo
  • Publication number: 20060024991
    Abstract: A connection device with plurality return paths includes a first connection component and a second connection component. The first connection component has a rectangular containing portion, a plurality of first pins and two first ground pads. The first pins are disposed at two long sides of the rectangular containing portion. The first ground pads are disposed at two short sides of the rectangular containing portion. The second connection component has a rectangular protruding portion corresponding to the rectangular containing portion, a plurality of second pins and two second ground pads. The second pins are disposed at two long sides of the rectangular protruding portion. The second ground pads are disposed at two short sides of the rectangular protruding portion. When the rectangular protruding portion is inserted into the rectangular containing portion, each first pin connects to each second pin, and each first ground pad connects to each second ground pad.
    Type: Application
    Filed: January 18, 2005
    Publication date: February 2, 2006
    Applicant: VIA Technologies, Inc.
    Inventors: Kevin Kuo, Langhans Chang
  • Publication number: 20020072698
    Abstract: A blood pumping device includes a receptacle for receiving blood and having a non-valved inlet and outlet openings coupled to an aorta and the femoral artery. The receptacle includes a surface having a peripheral portion coupled to a peripheral portion of a diaphragm, and having a port coupled to a pump. The pump may shrink the diaphragm to draw the blood into the receptacle and may expand the diaphragm to pump the blood in the chamber of the receptacle out of the inlet opening and the outlet opening of the receptacle and into the aorta and the femoral artery of the patient.
    Type: Application
    Filed: January 15, 2002
    Publication date: June 13, 2002
    Inventors: Jih Chung Chiang, Chin Sheng Tung, Kevin Kuo Tsai Cheng, Shih Hsiung Chen, Tzu Min Kao, Jeng Wei, Pong Jeu Lu
  • Patent number: 5573250
    Abstract: A dartboard clock includes a disk-like face member, serving as a dial plate, having a front surface on which a dartboard pattern is provided and an opposite back surface on which a circumferential flange is provided. The face member has a central through hole through which a rotating shaft of a timing device is received and fixed therein. Timing hands in the form of darts are provided with holes to engage a remote end of the rotating shaft that projects out of the front surface of the face member so as to have the timing hands run on the front surface. Pins in the form of the point section of a dart are threadingly attached to the back surface of the face member to pierce into a dartboard or a B.B. gun. target board for supporting the dartboard clock on the dartboard. A foldable support member is attached to the back surface of the face member for individually supporting the dartboard clock on a horizontal surface.
    Type: Grant
    Filed: February 6, 1996
    Date of Patent: November 12, 1996
    Inventor: Kevin Kuo