Patents by Inventor Kevin Kuo
Kevin Kuo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240133309Abstract: A seal monitoring apparatus is provided. The seal monitoring apparatus includes a temperature sensor and a controller in communication with the temperature sensor. The temperature sensor is mounted at a seal of a device. The controller is configured to receive measured temperature data from the temperature sensor and calculate expected temperature data for the seal based at least in part on operating conditions of the device. The controller is configured to determine a condition of the seal based at least in part on a temperature difference of the measured temperature data from the expected temperature data.Type: ApplicationFiled: October 24, 2022Publication date: April 25, 2024Inventors: Rahul Anil Bidkar, Deepak Trivedi, Bugra H. Ertas, Pei-Hsin Kuo, Joseph Herbert Fields, Andrew Kevin Winn, Eric R. Westervelt
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Patent number: 8350059Abstract: Disclosed herein are methods and intermediates useful in the preparation of macrolides, e.g., compounds of formula (IV) wherein R1-R12 are as defined herein.Type: GrantFiled: December 8, 2008Date of Patent: January 8, 2013Assignee: Eisai R&D Management Co., Ltd.Inventors: Roch Boivin, Silvio A. Campagna, Hong Du, Francis G. Fang, Thomas Horstmann, Charles-Andre Lemelin, Jing Li, Pamela McGuinness, Xiang Niu, Matthew J. Schnaderbeck, Kevin (kuo-ming) Wu, Xiaojie (jeff) Zhu
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Publication number: 20110237805Abstract: Disclosed herein are methods and intermediates useful in the preparation of macrolides, e.g., compounds of formula (IV) wherein R1-R12 are as defined herein.Type: ApplicationFiled: December 8, 2008Publication date: September 29, 2011Applicant: EISAI R&D MANAGEMENT CO., LTD.Inventors: Roch Boivin, Silvio A. Campagna, Hong Du, Francis G. Fang, Thomas Horstmann, Charles-Andre Lemelin, Jing Li, Pamela Mcguinness, Xiang Niu, Matthew J. Schnaderbeck, Kevin (kuo-ming) Wu, Xiaojie (Jeff) Zhu
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Publication number: 20110094592Abstract: A fluid check valve consisting of a pair of leaflets contained within an annular body member (10). These leaflets (16 and 17) open and close hemodynamically as a reaction to the natural pumping action of the heart. They open from the center outward based upon their S shape profile (45). Blood flows through the interior surface (12) of the annular body member and leaflets. These leaflets open and close relying upon, protruding rails from the annular body member (20 and 21) and their integrated stop means (31-38). The protruding rails guide the leaflets in a floating pivot action that virtually eliminates area of stasis and prevent thrombosis.Type: ApplicationFiled: October 22, 2010Publication date: April 28, 2011Inventors: Howard Shi-How Cheng, Kevin Kuo-Tsai Cheng
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Patent number: 7560812Abstract: An electronic assembly includes a substrate, a chip, a conductive fence and a heat sink. The substrate has a bonding surface. The chip is bonded to the bonding surface. The conductive fence connects the bonding surface and at least locally surrounds the sides of the chip. The heat sink is disposed over the substrate and contacts the chip and the conductive fence. By disposing the conductive fence between the substrate and the heat sink, the conductive fence and the heat sink can further function as the shields of the chip to reduce any adverse influence of an ESD current on the chip.Type: GrantFiled: October 30, 2006Date of Patent: July 14, 2009Assignee: VIA Technologies, Inc.Inventors: Kevin Kuo, Stanley Huang, Cheng-Ming Hsu, Neng-An Kuo
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Publication number: 20080012123Abstract: An electronic assembly includes a substrate, a chip, a conductive fence and a heat sink. The substrate has a bonding surface. The chip is bonded to the bonding surface. The conductive fence connects the bonding surface and at least locally surrounds the sides of the chip. The heat sink is disposed over the substrate and contacts the chip and the conductive fence. By disposing the conductive fence between the substrate and the heat sink, the conductive fence and the heat sink can further function as the shields of the chip to reduce any adverse influence of an ESD current on the chip.Type: ApplicationFiled: October 30, 2006Publication date: January 17, 2008Applicant: VIA TECHNOLOGIES, INC.Inventors: Kevin Kuo, Stanley Huang, Cheng-Ming Hsu, Neng-An Kuo
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Publication number: 20060056149Abstract: An electronic device includes a first metal case, a second metal case, an electronic unit, a first heat insulation layer and a second heat insulation layer. In this case, the first metal case has a plurality of first holes, and the second metal case has a plurality of second holes. The first metal case is assembled with the second metal case to form an accommodating space. The electronic unit is disposed in the accommodating space. At least one surface of the first metal case is coated with the first heat insulation layer, and at least one surface of the second metal case is coated with the second heat insulation layer.Type: ApplicationFiled: November 9, 2005Publication date: March 16, 2006Inventors: Robert Kuo, James Hsyu, Cary Hsiao, Kevin Kuo
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Publication number: 20060040529Abstract: A fixing component of a main board comprises a connecting part, a thread-assembling part and a fixing part. The connecting part has a first surface and a second surface, wherein the first surface is disposed opposite to the second surface. The thread-assembling part is disposed on the first surface of the connecting part. The fixing part is disposed on the second surface. The connecting part and the fixing part are disposed on a main board by utilizing DIP technology and SMT.Type: ApplicationFiled: January 18, 2005Publication date: February 23, 2006Applicant: VIA Technologies, Inc.Inventors: Kevin Kuo, James Hsyu, Langhans Chang
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Publication number: 20060023423Abstract: An expandable heat sink is used for dissipating heat of a heat source on a main board. The heat sink comprises a main body and an expanded body. The main body comprises a main-body contact surface, which is contacted with the heat source, and a plurality of first fins. The first fins compose a main connecting portion. Furthermore, the expanded body comprises a plurality of second fins and the second fins compose an expanded connecting portion. The expanded connecting portion is removably connected to the main connecting portion.Type: ApplicationFiled: November 16, 2004Publication date: February 2, 2006Applicant: VIA Technologies, Inc.Inventors: Kevin Kuo, James Hsyu, Langhans Chang, Robert Kuo
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Publication number: 20060024991Abstract: A connection device with plurality return paths includes a first connection component and a second connection component. The first connection component has a rectangular containing portion, a plurality of first pins and two first ground pads. The first pins are disposed at two long sides of the rectangular containing portion. The first ground pads are disposed at two short sides of the rectangular containing portion. The second connection component has a rectangular protruding portion corresponding to the rectangular containing portion, a plurality of second pins and two second ground pads. The second pins are disposed at two long sides of the rectangular protruding portion. The second ground pads are disposed at two short sides of the rectangular protruding portion. When the rectangular protruding portion is inserted into the rectangular containing portion, each first pin connects to each second pin, and each first ground pad connects to each second ground pad.Type: ApplicationFiled: January 18, 2005Publication date: February 2, 2006Applicant: VIA Technologies, Inc.Inventors: Kevin Kuo, Langhans Chang
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Publication number: 20020072698Abstract: A blood pumping device includes a receptacle for receiving blood and having a non-valved inlet and outlet openings coupled to an aorta and the femoral artery. The receptacle includes a surface having a peripheral portion coupled to a peripheral portion of a diaphragm, and having a port coupled to a pump. The pump may shrink the diaphragm to draw the blood into the receptacle and may expand the diaphragm to pump the blood in the chamber of the receptacle out of the inlet opening and the outlet opening of the receptacle and into the aorta and the femoral artery of the patient.Type: ApplicationFiled: January 15, 2002Publication date: June 13, 2002Inventors: Jih Chung Chiang, Chin Sheng Tung, Kevin Kuo Tsai Cheng, Shih Hsiung Chen, Tzu Min Kao, Jeng Wei, Pong Jeu Lu
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Patent number: 5573250Abstract: A dartboard clock includes a disk-like face member, serving as a dial plate, having a front surface on which a dartboard pattern is provided and an opposite back surface on which a circumferential flange is provided. The face member has a central through hole through which a rotating shaft of a timing device is received and fixed therein. Timing hands in the form of darts are provided with holes to engage a remote end of the rotating shaft that projects out of the front surface of the face member so as to have the timing hands run on the front surface. Pins in the form of the point section of a dart are threadingly attached to the back surface of the face member to pierce into a dartboard or a B.B. gun. target board for supporting the dartboard clock on the dartboard. A foldable support member is attached to the back surface of the face member for individually supporting the dartboard clock on a horizontal surface.Type: GrantFiled: February 6, 1996Date of Patent: November 12, 1996Inventor: Kevin Kuo