Abstract: An interconnect for connecting two printed circuit boards (30, 32) directly together and a method for achieving same. A through hole (70) is formed in a first printed circuit board (30), which is surrounded by a conductive layer (62). A conductive layer (82) is also deposited on a second printed circuit board (32) opposite the through hole (70). The conductive layers (62, 82) allow for the conduction of electrical signals between and about the two printed circuit boards (30, 32). In the preferred embodiment, the conductive layer (62, 82) is copper metalization and the through hole (70) is plated with copper. A solder joint (58) is applied to fill the through hole (70) and establish electrical connection between the conductive layers (62, 82) on the two printed circuit boards (30, 32). Electrical connection is established by applying the solder joint (58) to and between the conductive layers (62, 82) on both boards (30, 32).

Abstract: A method for adjusting an electronic part template corresponding to an electronic part that is to be placed on a substrate includes capturing an image of the electronic part, calculating a dimension of the electronic part from the image, and adjusting the electronic part template according to the dimension. This dynamic adjustment of the electronic part template helps to reduce excessive rejection rates due to slight mechanical differences among functionally equivalent electronic parts supplied by different suppliers.

Abstract: A heat sinking apparatus that dissipates heat generated by a surface mountable power device, which can be auto picked and placed, comprises a first planar surface, at least one gull wing mounting tab, and at least one connective leg. The at least one connective leg thermally couples the first planar surface to the gull wing tab and all three structures are comprised of a thermally conductive material. When the heat sinking apparatus is coupled to a substrate, heat generated by the surface mountable power device is thermally transferred through a thermal plane of the substrate to the heat sinking apparatus.