Abstract: A heat exchanger for cooling a heat generating device including a base having a recess with a base coolant inlet opening and a base coolant outlet opening. A porous core is positioned within the recess of the base, and has a core coolant inlet opening and a core coolant outlet opening that are arranged in corresponding relation with base coolant inlet opening and a base coolant outlet opening so as to be in fluid communication. A porous gasket is pinched between the porous core and the base.

Abstract: A heat exchanger for cooling a heat generating device including a base having a recess with a base coolant inlet opening and a base coolant outlet opening. A porous core is positioned within the recess of the base, and has a core coolant inlet opening and a core coolant outlet opening that are arranged in corresponding relation with base coolant inlet opening and a base coolant outlet opening so as to be in fluid communication. A porous gasket is pinched between the porous core and the base.

Abstract: A heat exchanger for cooling a heat generating device including a base having a recess with a base coolant inlet opening and a base coolant outlet opening. A porous core is positioned within the recess of the base, and has a core coolant inlet opening and a core coolant outlet opening that are arranged in corresponding relation with base coolant inlet opening and a base coolant outlet opening so as to be in fluid communication. A porous gasket is pinched between the porous core and the base.

Abstract: A heat pipe assembly (100) has a combined reservoir (102) and evaporator (104), the evaporator (104) having ducts of a vapor manifold (106) that exhausts vapor toward the condenser (108) instead of opposing the flow of liquid condensate to the reservoir (102), and the evaporator (104) having a wick passage that impels the condensate toward the reservoir (102) instead of opposing the flow of vapor.

Abstract: A flexible loop thermosyphon is provided having a flexible, hermetic, outer tube and a flexible, non-hermetic, inner tube, positioned concentrically within the outer tube, forming an annulus between the outer tube and inner tube. The annulus acts as a vapor conduit transferring vapor to the loop thermosyphon condenser while the inner tube acts as a condensate conduit returning liquid to the loop thermosyphon evaporator.

Abstract: A component of a heat pipe assembly (100) has hollow fluid transport sections (108) communicating with hollow bendable fluid transport sections (110); the bendable fluid transport sections (110) being bendable to deploy the transport sections (108) from a compact volume.

Abstract: A heat exchanger for cooling a heat generating device including a base having a recess with a base coolant inlet opening and a base coolant outlet opening. A porous core is positioned within the recess of the base, and has a core coolant inlet opening and a core coolant outlet opening that are arranged in corresponding relation with base coolant inlet opening and a base coolant outlet opening so as to be in fluid communication. A porous gasket is pinched between the porous core and the base.

Abstract: A heat exchanger for cooling a heat generating device is provided that includes a plurality of plates each defining at least one through-bore. The plates are laminated together to form a stack so that a plurality of enclosed chambers are formed by an alignment of a first portion of the through-bores within the block, and a plurality of passageways are formed by an alignment of a second portion of the through-bores within the stack such that at least one of the passageways is arranged in fluid communication with at least two of the chambers. A baffle-plate is disposed within a portion of the stack so as to form a chamber boundary and thereby to define a circuitous fluid flow path between the chambers through the at least one passageway. A fluid entrance port is defined in a first outer one of the plates and arranged in fluid communication with one of the chambers, and a fluid exit port is also defined in a second outer one of the plates and arranged in fluid communication with another one of the chambers.

Abstract: A flexible loop thermosyphon is provided having a flexible, hermetic, outer tube and a flexible, non-hermetic, inner tube, positioned concentrically within the outer tube, forming an annulus between the outer tube and inner tube. The annulus acts as a vapor conduit transferring vapor to the loop thermosyphon condenser while the inner tube acts as a condensate conduit returning liquid to the loop thermosyphon evaporator.

Abstract: A heat pipe assembly (100) has a combined reservoir (102) and evaporator (104), the evaporator (104) having ducts of a vapor manifold (106) that exhausts vapor toward the condenser (108) instead of opposing the flow of liquid condensate to the reservoir (102), and the evaporator (104) having a wick passage that impels the condensate toward the reservoir (102) instead of opposing the flow of vapor.

Abstract: A thermal management system for an electronic device is provided a first thermal energy transfer assembly that is thermally coupled between a heat generating structure located on a circuit card and a first thermal interface surface that is spaced away from the heat generating structure. A second thermal energy transfer assembly includes a second thermal interface surface which is arranged in confronting relation to the first thermal interface surface. A clamping mechanism is arranged to move the second thermal interface surface between (i) a first position that is spaced away from the first thermal interface surface, and (ii) a second position wherein the second thermal interface surface is pressed against the first thermal interface surface so as to allow the busing of thermal energy from the first thermal energy transfer assembly to the second thermal energy transfer assembly by heat transfer from the first thermal interface surface to the second thermal interface surface.

Abstract: A thermal management system for an electronic device is provided a first thermal energy transfer assembly that is thermally coupled between a heat generating structure located on a circuit card and a first thermal interface surface that is spaced away from the heat generating structure. A second thermal energy transfer assembly includes a second thermal interface surface which is arranged in confronting relation to the first thermal interface surface. A clamping mechanism is arranged to move the second thermal interface surface between (i) a first position that is spaced away from the first thermal interface surface, and (ii) a second position wherein the second thermal interface surface is pressed against the first thermal interface surface so as to allow the busing of thermal energy from the first thermal energy transfer assembly to the second thermal energy transfer assembly by heat transfer from the first thermal interface surface to the second thermal interface surface.