Patents by Inventor Kevin L. Wert
Kevin L. Wert has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8397796Abstract: A heat exchanger for cooling a heat generating device including a base having a recess with a base coolant inlet opening and a base coolant outlet opening. A porous core is positioned within the recess of the base, and has a core coolant inlet opening and a core coolant outlet opening that are arranged in corresponding relation with base coolant inlet opening and a base coolant outlet opening so as to be in fluid communication. A porous gasket is pinched between the porous core and the base.Type: GrantFiled: April 1, 2010Date of Patent: March 19, 2013Assignee: Thermal Corp.Inventors: John G. Thayer, Kevin L. Wert, Mark T. North, C. Scott Schaeffer
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Publication number: 20100181056Abstract: A heat exchanger for cooling a heat generating device including a base having a recess with a base coolant inlet opening and a base coolant outlet opening. A porous core is positioned within the recess of the base, and has a core coolant inlet opening and a core coolant outlet opening that are arranged in corresponding relation with base coolant inlet opening and a base coolant outlet opening so as to be in fluid communication. A porous gasket is pinched between the porous core and the base.Type: ApplicationFiled: April 1, 2010Publication date: July 22, 2010Inventors: John G. Thayer, Kevin L. Wert, Mark T. North, C. Scott Schaeffer
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Patent number: 7690419Abstract: A heat exchanger for cooling a heat generating device including a base having a recess with a base coolant inlet opening and a base coolant outlet opening. A porous core is positioned within the recess of the base, and has a core coolant inlet opening and a core coolant outlet opening that are arranged in corresponding relation with base coolant inlet opening and a base coolant outlet opening so as to be in fluid communication. A porous gasket is pinched between the porous core and the base.Type: GrantFiled: May 3, 2006Date of Patent: April 6, 2010Assignee: Thermal Corp.Inventors: John G. Thayer, Kevin L. Wert, Mark T. North, C. Scott Schaeffer
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Patent number: 7111394Abstract: A heat pipe assembly (100) has a combined reservoir (102) and evaporator (104), the evaporator (104) having ducts of a vapor manifold (106) that exhausts vapor toward the condenser (108) instead of opposing the flow of liquid condensate to the reservoir (102), and the evaporator (104) having a wick passage that impels the condensate toward the reservoir (102) instead of opposing the flow of vapor.Type: GrantFiled: November 12, 2004Date of Patent: September 26, 2006Assignee: Thermal Corp.Inventor: Kevin L. Wert
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Patent number: 7096928Abstract: A flexible loop thermosyphon is provided having a flexible, hermetic, outer tube and a flexible, non-hermetic, inner tube, positioned concentrically within the outer tube, forming an annulus between the outer tube and inner tube. The annulus acts as a vapor conduit transferring vapor to the loop thermosyphon condenser while the inner tube acts as a condensate conduit returning liquid to the loop thermosyphon evaporator.Type: GrantFiled: August 23, 2005Date of Patent: August 29, 2006Assignee: Thermal Corp.Inventors: Alfred L. Phillips, Dmitry K. Khrustalev, Kevin L. Wert, Michael J. Wilson, Jonathan P. Wattelet, John Broadbent
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Patent number: 7080681Abstract: A component of a heat pipe assembly (100) has hollow fluid transport sections (108) communicating with hollow bendable fluid transport sections (110); the bendable fluid transport sections (110) being bendable to deploy the transport sections (108) from a compact volume.Type: GrantFiled: March 3, 2004Date of Patent: July 25, 2006Assignee: Thermal Corp.Inventor: Kevin L. Wert
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Patent number: 7044199Abstract: A heat exchanger for cooling a heat generating device including a base having a recess with a base coolant inlet opening and a base coolant outlet opening. A porous core is positioned within the recess of the base, and has a core coolant inlet opening and a core coolant outlet opening that are arranged in corresponding relation with base coolant inlet opening and a base coolant outlet opening so as to be in fluid communication. A porous gasket is pinched between the porous core and the base.Type: GrantFiled: October 20, 2004Date of Patent: May 16, 2006Assignee: Thermal Corp.Inventors: John G. Thayer, Kevin L. Wert, Mark T. North, C. Scott Schaeffer
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Patent number: 7017655Abstract: A heat exchanger for cooling a heat generating device is provided that includes a plurality of plates each defining at least one through-bore. The plates are laminated together to form a stack so that a plurality of enclosed chambers are formed by an alignment of a first portion of the through-bores within the block, and a plurality of passageways are formed by an alignment of a second portion of the through-bores within the stack such that at least one of the passageways is arranged in fluid communication with at least two of the chambers. A baffle-plate is disposed within a portion of the stack so as to form a chamber boundary and thereby to define a circuitous fluid flow path between the chambers through the at least one passageway. A fluid entrance port is defined in a first outer one of the plates and arranged in fluid communication with one of the chambers, and a fluid exit port is also defined in a second outer one of the plates and arranged in fluid communication with another one of the chambers.Type: GrantFiled: December 18, 2003Date of Patent: March 28, 2006Assignee: Modine Manufacturing Co.Inventors: Michael J. Wilson, Kevin L. Wert, Jonathan Wattelet, Richard DeKeuster, Donald Lightner
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Patent number: 7013955Abstract: A flexible loop thermosyphon is provided having a flexible, hermetic, outer tube and a flexible, non-hermetic, inner tube, positioned concentrically within the outer tube, forming an annulus between the outer tube and inner tube. The annulus acts as a vapor conduit transferring vapor to the loop thermosyphon condenser while the inner tube acts as a condensate conduit returning liquid to the loop thermosyphon evaporator.Type: GrantFiled: February 25, 2004Date of Patent: March 21, 2006Assignee: Thermal Corp.Inventors: Alfred L. Phillips, Dmitry K. Khrustalev, Kevin L. Wert, Michael J. Wilson, Jonathan P. Wattelet, John Broadbent
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Patent number: 6926072Abstract: A heat pipe assembly (100) has a combined reservoir (102) and evaporator (104), the evaporator (104) having ducts of a vapor manifold (106) that exhausts vapor toward the condenser (108) instead of opposing the flow of liquid condensate to the reservoir (102), and the evaporator (104) having a wick passage that impels the condensate toward the reservoir (102) instead of opposing the flow of vapor.Type: GrantFiled: October 22, 2003Date of Patent: August 9, 2005Assignee: Thermal Corp.Inventor: Kevin L. Wert
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Patent number: 6804117Abstract: A thermal management system for an electronic device is provided a first thermal energy transfer assembly that is thermally coupled between a heat generating structure located on a circuit card and a first thermal interface surface that is spaced away from the heat generating structure. A second thermal energy transfer assembly includes a second thermal interface surface which is arranged in confronting relation to the first thermal interface surface. A clamping mechanism is arranged to move the second thermal interface surface between (i) a first position that is spaced away from the first thermal interface surface, and (ii) a second position wherein the second thermal interface surface is pressed against the first thermal interface surface so as to allow the busing of thermal energy from the first thermal energy transfer assembly to the second thermal energy transfer assembly by heat transfer from the first thermal interface surface to the second thermal interface surface.Type: GrantFiled: July 28, 2003Date of Patent: October 12, 2004Assignee: Thermal Corp.Inventors: Alfred L. Phillips, Dmitry K. Khrustalev, Kevin L. Wert, Michael J. Wilson, Jonathan P. Wattelet, John Broadbent
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Publication number: 20040037045Abstract: A thermal management system for an electronic device is provided a first thermal energy transfer assembly that is thermally coupled between a heat generating structure located on a circuit card and a first thermal interface surface that is spaced away from the heat generating structure. A second thermal energy transfer assembly includes a second thermal interface surface which is arranged in confronting relation to the first thermal interface surface. A clamping mechanism is arranged to move the second thermal interface surface between (i) a first position that is spaced away from the first thermal interface surface, and (ii) a second position wherein the second thermal interface surface is pressed against the first thermal interface surface so as to allow the busing of thermal energy from the first thermal energy transfer assembly to the second thermal energy transfer assembly by heat transfer from the first thermal interface surface to the second thermal interface surface.Type: ApplicationFiled: July 28, 2003Publication date: February 26, 2004Inventors: Alfred L. Phillips, Dmitry K. Khrustalev, Kevin L. Wert, Michael J. Wilson, Jonathan P. Wattelet, John Broadbent