Patents by Inventor Kevin L. Wert

Kevin L. Wert has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8397796
    Abstract: A heat exchanger for cooling a heat generating device including a base having a recess with a base coolant inlet opening and a base coolant outlet opening. A porous core is positioned within the recess of the base, and has a core coolant inlet opening and a core coolant outlet opening that are arranged in corresponding relation with base coolant inlet opening and a base coolant outlet opening so as to be in fluid communication. A porous gasket is pinched between the porous core and the base.
    Type: Grant
    Filed: April 1, 2010
    Date of Patent: March 19, 2013
    Assignee: Thermal Corp.
    Inventors: John G. Thayer, Kevin L. Wert, Mark T. North, C. Scott Schaeffer
  • Publication number: 20100181056
    Abstract: A heat exchanger for cooling a heat generating device including a base having a recess with a base coolant inlet opening and a base coolant outlet opening. A porous core is positioned within the recess of the base, and has a core coolant inlet opening and a core coolant outlet opening that are arranged in corresponding relation with base coolant inlet opening and a base coolant outlet opening so as to be in fluid communication. A porous gasket is pinched between the porous core and the base.
    Type: Application
    Filed: April 1, 2010
    Publication date: July 22, 2010
    Inventors: John G. Thayer, Kevin L. Wert, Mark T. North, C. Scott Schaeffer
  • Patent number: 7690419
    Abstract: A heat exchanger for cooling a heat generating device including a base having a recess with a base coolant inlet opening and a base coolant outlet opening. A porous core is positioned within the recess of the base, and has a core coolant inlet opening and a core coolant outlet opening that are arranged in corresponding relation with base coolant inlet opening and a base coolant outlet opening so as to be in fluid communication. A porous gasket is pinched between the porous core and the base.
    Type: Grant
    Filed: May 3, 2006
    Date of Patent: April 6, 2010
    Assignee: Thermal Corp.
    Inventors: John G. Thayer, Kevin L. Wert, Mark T. North, C. Scott Schaeffer
  • Patent number: 7111394
    Abstract: A heat pipe assembly (100) has a combined reservoir (102) and evaporator (104), the evaporator (104) having ducts of a vapor manifold (106) that exhausts vapor toward the condenser (108) instead of opposing the flow of liquid condensate to the reservoir (102), and the evaporator (104) having a wick passage that impels the condensate toward the reservoir (102) instead of opposing the flow of vapor.
    Type: Grant
    Filed: November 12, 2004
    Date of Patent: September 26, 2006
    Assignee: Thermal Corp.
    Inventor: Kevin L. Wert
  • Patent number: 7096928
    Abstract: A flexible loop thermosyphon is provided having a flexible, hermetic, outer tube and a flexible, non-hermetic, inner tube, positioned concentrically within the outer tube, forming an annulus between the outer tube and inner tube. The annulus acts as a vapor conduit transferring vapor to the loop thermosyphon condenser while the inner tube acts as a condensate conduit returning liquid to the loop thermosyphon evaporator.
    Type: Grant
    Filed: August 23, 2005
    Date of Patent: August 29, 2006
    Assignee: Thermal Corp.
    Inventors: Alfred L. Phillips, Dmitry K. Khrustalev, Kevin L. Wert, Michael J. Wilson, Jonathan P. Wattelet, John Broadbent
  • Patent number: 7080681
    Abstract: A component of a heat pipe assembly (100) has hollow fluid transport sections (108) communicating with hollow bendable fluid transport sections (110); the bendable fluid transport sections (110) being bendable to deploy the transport sections (108) from a compact volume.
    Type: Grant
    Filed: March 3, 2004
    Date of Patent: July 25, 2006
    Assignee: Thermal Corp.
    Inventor: Kevin L. Wert
  • Patent number: 7044199
    Abstract: A heat exchanger for cooling a heat generating device including a base having a recess with a base coolant inlet opening and a base coolant outlet opening. A porous core is positioned within the recess of the base, and has a core coolant inlet opening and a core coolant outlet opening that are arranged in corresponding relation with base coolant inlet opening and a base coolant outlet opening so as to be in fluid communication. A porous gasket is pinched between the porous core and the base.
    Type: Grant
    Filed: October 20, 2004
    Date of Patent: May 16, 2006
    Assignee: Thermal Corp.
    Inventors: John G. Thayer, Kevin L. Wert, Mark T. North, C. Scott Schaeffer
  • Patent number: 7017655
    Abstract: A heat exchanger for cooling a heat generating device is provided that includes a plurality of plates each defining at least one through-bore. The plates are laminated together to form a stack so that a plurality of enclosed chambers are formed by an alignment of a first portion of the through-bores within the block, and a plurality of passageways are formed by an alignment of a second portion of the through-bores within the stack such that at least one of the passageways is arranged in fluid communication with at least two of the chambers. A baffle-plate is disposed within a portion of the stack so as to form a chamber boundary and thereby to define a circuitous fluid flow path between the chambers through the at least one passageway. A fluid entrance port is defined in a first outer one of the plates and arranged in fluid communication with one of the chambers, and a fluid exit port is also defined in a second outer one of the plates and arranged in fluid communication with another one of the chambers.
    Type: Grant
    Filed: December 18, 2003
    Date of Patent: March 28, 2006
    Assignee: Modine Manufacturing Co.
    Inventors: Michael J. Wilson, Kevin L. Wert, Jonathan Wattelet, Richard DeKeuster, Donald Lightner
  • Patent number: 7013955
    Abstract: A flexible loop thermosyphon is provided having a flexible, hermetic, outer tube and a flexible, non-hermetic, inner tube, positioned concentrically within the outer tube, forming an annulus between the outer tube and inner tube. The annulus acts as a vapor conduit transferring vapor to the loop thermosyphon condenser while the inner tube acts as a condensate conduit returning liquid to the loop thermosyphon evaporator.
    Type: Grant
    Filed: February 25, 2004
    Date of Patent: March 21, 2006
    Assignee: Thermal Corp.
    Inventors: Alfred L. Phillips, Dmitry K. Khrustalev, Kevin L. Wert, Michael J. Wilson, Jonathan P. Wattelet, John Broadbent
  • Patent number: 6926072
    Abstract: A heat pipe assembly (100) has a combined reservoir (102) and evaporator (104), the evaporator (104) having ducts of a vapor manifold (106) that exhausts vapor toward the condenser (108) instead of opposing the flow of liquid condensate to the reservoir (102), and the evaporator (104) having a wick passage that impels the condensate toward the reservoir (102) instead of opposing the flow of vapor.
    Type: Grant
    Filed: October 22, 2003
    Date of Patent: August 9, 2005
    Assignee: Thermal Corp.
    Inventor: Kevin L. Wert
  • Patent number: 6804117
    Abstract: A thermal management system for an electronic device is provided a first thermal energy transfer assembly that is thermally coupled between a heat generating structure located on a circuit card and a first thermal interface surface that is spaced away from the heat generating structure. A second thermal energy transfer assembly includes a second thermal interface surface which is arranged in confronting relation to the first thermal interface surface. A clamping mechanism is arranged to move the second thermal interface surface between (i) a first position that is spaced away from the first thermal interface surface, and (ii) a second position wherein the second thermal interface surface is pressed against the first thermal interface surface so as to allow the busing of thermal energy from the first thermal energy transfer assembly to the second thermal energy transfer assembly by heat transfer from the first thermal interface surface to the second thermal interface surface.
    Type: Grant
    Filed: July 28, 2003
    Date of Patent: October 12, 2004
    Assignee: Thermal Corp.
    Inventors: Alfred L. Phillips, Dmitry K. Khrustalev, Kevin L. Wert, Michael J. Wilson, Jonathan P. Wattelet, John Broadbent
  • Publication number: 20040037045
    Abstract: A thermal management system for an electronic device is provided a first thermal energy transfer assembly that is thermally coupled between a heat generating structure located on a circuit card and a first thermal interface surface that is spaced away from the heat generating structure. A second thermal energy transfer assembly includes a second thermal interface surface which is arranged in confronting relation to the first thermal interface surface. A clamping mechanism is arranged to move the second thermal interface surface between (i) a first position that is spaced away from the first thermal interface surface, and (ii) a second position wherein the second thermal interface surface is pressed against the first thermal interface surface so as to allow the busing of thermal energy from the first thermal energy transfer assembly to the second thermal energy transfer assembly by heat transfer from the first thermal interface surface to the second thermal interface surface.
    Type: Application
    Filed: July 28, 2003
    Publication date: February 26, 2004
    Inventors: Alfred L. Phillips, Dmitry K. Khrustalev, Kevin L. Wert, Michael J. Wilson, Jonathan P. Wattelet, John Broadbent