Patents by Inventor Kevin Lee Brekkestran

Kevin Lee Brekkestran has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Circuit board assembly with heat sinking
    Patent number: 6377462
    Abstract: A circuit assembly includes a printed circuit board which has a plurality of copper traces formed thereon. Heat generating electronic components are surface mounted on the board in contact with parts of the traces. A heat conducting copper plate is mounted on the board adjacent to and spaced apart from the electronic components, and in contact with other parts of the traces. A silicon pad is mounted on the plate, and a heat sink member is mounted on the pad so that the pad is between the heat sink member and the traces. Heat conducting solder bridges are formed between the edges of the electronic components and the edges of the plate.
    Type: Grant
    Filed: January 9, 2001
    Date of Patent: April 23, 2002
    Assignee: Deere & Company
    Inventors: Michael A. Hajicek, Jon Thomas Jacobson, Mark Jones, Kevin Lee Brekkestran