Abstract: Example alignment members are provided herein. In one example, the alignment member includes a frame member, a stiffener member, a bracket member, and a spring member. The frame member includes a set of roller bushings. The stiffener member includes a set of cam members. The bracket member to receive the stiffener member. The spring member is connected to the stiffener member. The spring member to expand and contract based on the position of the set of roller bushings.

Abstract: Example methods and apparatus to implement an electrical/optical transceiver to facilitate data transfer are disclosed. An example apparatus includes an electrical transceiver lane to transfer data at a first bandwidth over an electrical link. The example apparatus also includes a plurality of optical transceiver sub-lanes to transfer data over an optical link. The example apparatus also includes a lane switch to dynamically map the electrical transceiver lane to the plurality of optical transceiver sub-lanes based on an analysis of the first bandwidth and the plurality of optical transceiver sub-lanes to accommodate the first bandwidth with at least a subset of the plurality of optical transceiver sub-lanes to transfer data between the electrical link and the optical link.

Abstract: A system is provided for computer networking. The system includes a first frame installed in a rack. The first frame includes a first frame shuffle that interconnects resource modules within the first frame and a first rocker-arm plenum that interconnects resource modules of the first frame with resource modules of other frames of the rack through a high-bandwidth fabric. The system also includes a second frame installed in the rack. The second frame includes a second frame shuffle that interconnects resource modules within the second frame and a second rocker-arm plenum communicatively coupled to the first rocker-arm plenum, wherein the second rocker-arm plenum interconnects resource modules of the second frame with resource modules of other frames of the rack through the high-bandwidth fabric. The system further includes a frame bridge. The frame bridge includes a first bracket slidably connected to a second bracket.

Abstract: Examples described herein include optical connectors with different positions. In some examples, an electronic device comprises a housing, an optical fiber, and a first optical connector secured to the optical fiber. The housing may have a first wall. The optical fiber may be within the housing. The first optical connector may be moveable between a first position and a second position along the first wall.

Abstract: Examples described herein include optical connectors with different positions. In some examples, an electronic device comprises a housing, an optical fiber, and a first optical connector secured to the optical fiber. The housing may have a first wall. The optical fiber may be within the housing. The first optical connector may be moveable between a first position and a second position along the first wall.

Abstract: One example of an optical jumper includes an optical cable, a first connector, a second connector, and a tag. The first connector is optically coupled to a first end of the optical cable. The second connector is optically coupled to a second end of the optical cable. The tag is coupled to the first connector and stores data identifying the optical cable, the first connector, and the second connector. The tag is readable by a system with the first connector optically coupled to the system.

Abstract: An example electronic device may include a chassis, a circuit board in the chassis that includes a first active component, a number of fans, a number of guide walls that define an air inlet channel, and a thermoelectric cooler (TEC). There may be an airflow path such that, when the fans operate, air flows along the airflow path from an intake opening of the air inlet channel to an exhaust of the chassis, with the first active component being located in the airflow path downstream of the intake opening of the air inlet channel. A cold portion of the TEC may extend into the airflow path upstream of the first active component and a hot portion of the TEC may extend into the airflow path downstream of the first active component.

Abstract: An example electronic device may include a chassis, a circuit board in the chassis that includes a first active component, a number of fans, a number of guide walls that define an air inlet channel, and a thermoelectric cooler (TEC). There may be an airflow path such that, when the fans operate, air flows along the airflow path from an intake opening of the air inlet channel to an exhaust of the chassis, with the first active component being located in the airflow path downstream of the intake opening of the air inlet channel. A cold portion of the TEC may extend into the airflow path upstream of the first active component and a hot portion of the TEC may extend into the airflow path downstream of the first active component.

Abstract: An optical touch panel includes an emitter light guide that receives and traps light from a light source. The optical touch panel also includes a collector light guide. Responsive to pressure being applied to the emitter light guide in at least one location that corresponds to at least one location on a display positioned underneath the light guides, optical coupling occurs between the emitter light guide and the collector light guide. The optical coupling causes light trapped in the emitter light guide to escape and be collected by the collector light guide. At least one optical sensor detects the collected light and determines the location at which pressure is applied to the emitter light guide that corresponds to the location on the display based on the detected collected light. The optical sensor may also determine the force of the pressure applied.

Abstract: One example of a multi-chip module includes a substrate, a semiconductor chip, and an optical transceiver. The substrate has a first side and a second side opposite the first side. The semiconductor chip is electrically coupled to the first side of the substrate. The optical transceiver is electrically coupled to the second side of the substrate.

Abstract: One example of a system includes a system board including first contacts and second contacts and a cage attached to the system board. The cage includes a first side over the first contacts and a second side over the second contacts. A first lever is coupled to the first side of the cage and pivotable with respect to the cage. A second lever is coupled to the second side of the cage and pivotable with respect to the cage. A removable transceiver module includes third contacts. The transceiver module is installable in at least one of the first side and the second side of the cage using at least one of the first lever and the second lever.

Abstract: In one example, a system for a press-fit pin converter includes a first housing coupled to a second housing to enclose a portion of a press-fit contact pin between the first housing and the second housing, where a side of the first housing provides a ball grid array (BGA) connection and a side of the second housing provides a press-fit pin connection.

Abstract: One example of a cable assembly includes a housing, a first cable, a first connector board, a second cable, and a second connector board. The first connector board is electrically coupled to the first cable and is at least partially arranged within the housing. The second connector board is electrically coupled to the second cable and is at least partially arranged within the housing.

Abstract: An example method of manufacturing an optical interface. An optical socket may be provided that has an alignment feature that is to engage an optical connector, and first solder attachment pads. A printed circuit board may be provided that has an active optical device and second solder attachment pads. The optical socket may be connected to the printed circuit board by reflowing solder between the first and second solder attachment pads. The first and second solder attachment pads, the alignment feature, and the active optical device are positioned such that, while reflowing the solder, the solder automatically forces the optical socket into an aligned position.

Abstract: Example alignment members are provided herein. In one example, the alignment member includes a frame member, a stiffener member, a bracket member, and a spring member. The frame member includes a set of roller bushings. The stiffener member includes a set of cam members. The bracket member to receive the stiffener member. The spring member is connected to the stiffener member. The spring member to expand and contract based on the position of the set of roller bushings.

Abstract: One example of a system includes a blade enclosure and a midplane within the blade enclosure. The midplane supports a first sleeve connector and a second sleeve connector, where each of the first and second sleeve connectors have a first side and a second side. A server blade installed in the blade enclosure includes an air duct coupled to the first side of the first sleeve connector. A cooling module including an air manifold is coupled to the second side of the first sleeve connector to deliver cool air to the air duct of the server blade.

Abstract: Example alignment members are provided herein. In one example, the alignment member includes a frame member, a stiffener member, a bracket member, and a spring member. The frame member includes a set of roller bushings. The stiffener member includes a set of cam members. The bracket member to receive the stiffener member. The spring member is connected to the stiffener member. The spring member to expand and contract based on the position of the set of roller bushings.

Abstract: A socket (130) employs a substrate (310) including a conductive network. An array of first contacts (136) is on a top surface of the substrate (310) and arranged to engage an integrated circuit (110). An array of second contacts (138) is on a bottom surface of the substrate (310) and arranged to engage a circuit board (120). The conductive network electrically connects the first contacts (136) respectively to the second contacts (138), and the first contacts (136) include a routed first contact (136?) that the conductive network routes horizontally in or on the substrate (310).

Abstract: Examples include an optical connector with a movable cleaning element that comprises a connector sleeve and an optical ferrule located at a rear of the connector sleeve. Some examples comprise a cleaning element located within the connector sleeve, said cleaning element comprising a wipe panel to clean an end of an optical ferrule of a male optical connector when mated with the female optical connector and a spring flap to couple the wipe panel to the connector sleeve. Some examples comprise channels, located in the connector sleeve, and protrusions, located in the wipe panel, that engage into the channels such that the wipe panel is movable along the channels between a cleaning position in which the wipe panel is positioned perpendicular to the optical ferrule of the male optical connector and a resting position in which the wipe panel allows connection of the ferrules of the male and female optical connectors.

Abstract: A socket (130) employs a substrate (310) including a conductive network. An array of first contacts (136) is on a top surface of the substrate (310) and arranged to engage an integrated circuit (110). An array of second contacts (138) is on a bottom surface of the substrate (310) and arranged to engage a circuit board (120). The conductive network electrically connects the first contacts (136) respectively to the second contacts (138), and the first contacts (136) include a routed first contact (136?) that the conductive network routes horizontally in or on the substrate (310).