Abstract: An infrared sensor, comprising a focal plane array (FPA) of resistance microbolometer infrared detectors connected in such a manner to produce different pixel formats to meet specific detection requirements. Typically each imaging pixel may be a mosaic comprising a number of sub-pixels connected in parallel (although other configurations are possible), resulting in enhanced performance and ease of manufacture by micro-fabrication methods. The FPA may be integrated with a readout microcircuit on the same substrate so that with appropriate signal processing one is capable of forming an image of the field of view of interest, facilitating target recognition and very low false alarm rate.

Abstract: An infrared sensor, comprising a focal plane array (FPA) of resistance microbolometer infrared detectors connected in such a manner to produce different pixel formats to meet specific detection requirements. Typically each imaging pixel may be a mosaic comprising a number of sub-pixels connected in parallel (although other configurations are possible), resulting in enhanced performance and ease of manufacture by micro-fabrication methods. The FPA may be integrated with a readout microcircuit on the same substrate so that with appropriate signal processing one is capable of forming an image of the field of view of interest, facilitating target recognition and very low false alarm rate.

Abstract: The detector includes a thin-film resistive component (3), at least two first electrical contacts (6, 7) electrically connected to the resistive component (3) that provide for biasing and signal readout, at least one second electrical contact (1) electrically connected to the resistive component (3) that provides bias control, an integral infra-red absorption means (4, 5) and thermal isolation means (10, 11). The detector may further include a readout integrated microcircuit (RIOC).

Abstract: The detector includes a thin-film resistive component (3), at least two first electrical contacts (6, 7) electrically connected to the resistive component (3) that provide for biasing and signal readout, at least one second electrical contact (1) electrically connected to the resistive component (3) that provides bias control, an integral infra-red absorption means (4, 5) and thermal isolation means (10, 11). The detector may further include a readout integrated microcircuit (RIOC).

Abstract: A focal plane scanning device arranged to move a mirror in an optical scanning apparatus, such as an infrared scanner, including a mirror, that is connected to a support by a central flexure member. An additional pair of flexure members are provided, each of which are attached at one end to piezoceramic drive elements and at their second ends to an adjustment bracket that bears against the rear side of the mirror. The piezoceramic drive elements are attached at their second ends to the support. When the piezoceramic members are energized, a balanced movement of the mirror about the first flexure member results.