Patents by Inventor Kevin M. Kilbuck

Kevin M. Kilbuck has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Memory stacking system and method
    Patent number: 7269042
    Abstract: A method of forming a stacked memory module from a plurality of memory devices is provided. Each of the plurality of memory devices is modified to include a logic block for decoding a plurality of chip select signals. A first high density memory module is also provided that includes the modified memory devices and a serial presence detect device. The first high density memory module is included within an electronic system. Also, an additional method of forming a stacked memory module is provided, the method requiring modification of an address buffer to include a logic block for decoding a plurality of chip select signals. A second high density memory module is also provided that includes the modified address buffer and a serial presence detect device. The second high density memory module is included within an electronic system.
    Type: Grant
    Filed: April 28, 2006
    Date of Patent: September 11, 2007
    Assignee: Micron Technology, Inc.
    Inventors: Thomas H. Kinsley, Kevin M. Kilbuck
  • Memory stacking system and method
    Patent number: 7046538
    Abstract: A method of forming a stacked memory module from a plurality of memory devices is provided. Each of the plurality of memory devices is modified to include a logic block for decoding a plurality of chip select signals. A first high density memory module is also provided that includes the modified memory devices and a serial presence detect device. The first high density memory module is included within an electronic system. Also, an additional method of forming a stacked memory module is provided, the method requiring modification of an address buffer to include a logic block for decoding a plurality of chip select signals. A second high density memory module is also provided that includes the modified address buffer and a serial presence detect device. The second high density memory module is included within an electronic system.
    Type: Grant
    Filed: September 1, 2004
    Date of Patent: May 16, 2006
    Assignee: Micron Technology, Inc.
    Inventors: Thomas H. Kinsley, Kevin M. Kilbuck