Abstract: A system and method for chip package fabrication is disclosed. The chip package includes a base re-distribution layer having an opening formed therein, an adhesive layer having a window formed therein free of adhesive material, and a die affixed to the base re-distribution layer by way of the adhesive layer, the die being aligned with the window such that only a perimeter of the die contacts the adhesive layer. A shield element is positioned between the base re-distribution layer and adhesive layer that is generally aligned with the opening formed in the base re-distribution layer and the window of the adhesive layer such that only a perimeter of the shield element is attached to the adhesive layer. The shield element is separated from the die by an air gap and is configured to be selectively removable from the adhesive layer so as to expose the front surface of the die.

Abstract: Detector modules for an imaging system and methods of manufacturing are provided. One detector module includes a substrate, a direct conversion sensor material coupled to the substrate and a flexible interconnect electrically coupled to the direct conversion sensor material and configured to provide readout of electrical signals generated by the direct conversion sensor material. The detector module also includes at least one illumination source for illuminating the direct conversion sensor material.

Abstract: An interconnect assembly for an embedded chip package includes a dielectric layer, first metal layer comprising upper contact pads, second metal layer comprising lower contact pads, and metalized connections formed through the dielectric layer and in contact with the upper and lower contact pads to form electrical connections therebetween. A first surface of the upper contact pads is affixed to a top surface of the dielectric layer and a first surface of the lower contact pads is affixed to a bottom surface of the dielectric layer. An input/output (I/O) of a first side of the interconnect assembly is formed on a surface of the lower contact pads that is opposite the first surface of the lower contact pads, and an I/O of a second side of the interconnect assembly is formed on a surface of the upper contact pads that is opposite the first surface of the upper contact pads.

Abstract: An ultrasound acoustic assembly includes a number of ultrasound acoustic arrays, each array comprising an acoustic stack comprising a piezoelectric layer assembled with at least one acoustic impedance dematching layer and with a support layer. The acoustic stack defines a number of dicing kerfs and a number of acoustic elements, such that the dicing kerfs are formed between neighboring ones of the acoustic elements. The dicing kerfs extend through the piezoelectric layer and through the acoustic impedance dematching layer(s) but extend only partially through the support layer. The ultrasound acoustic assembly further includes a number of application specific integrated circuit (ASIC) die. Each ultrasound acoustic array is coupled to a respective ASIC die to form a respective acoustic-electric transducer module. Methods of manufacture are also provided.

Abstract: A method of protecting sensitive components prior to, during or subsequent to advanced die packaging processing includes applying a metal stack layer such as titanium/copper (Ti/Cu) onto the front surface of a die assembly such that the die assembly front surface is covered with the metal stack layer. A layer of titanium/copper/titanium (Ti/Cu/Ti) or a solder alloy is also applied to the back surface of the die assembly such that the back surface of the die assembly is covered with the Ti/Cu/Ti layer or solder alloy. The front surface metal stack layer and the back surface Ti/Cu/Ti layer or solder alloy prevent degradation of die metallization prior to, during or subsequent to the advanced die packaging processing.

Abstract: A method for scoring and controlling the quality of dynamic food products transitioning in the processing steps is performed using image analysis. An image of a plurality of moving food products on a conveyor system is captured by on-line vision equipment and image analysis is performed on the image via an algorithm that determines the percentage of pixels having varying intensities of colors and applies predetermined preferences to predict consumer dissatisfaction. The entire group of food products of one or more images is given an overall appearance score and each individual food product is also scored such that each may be ranked from least to more acceptable. The ranked food products can then be ejected in the order of worst to better rank to increase the overall quality score of the entire group.

Abstract: Systems and method for providing indications of trial-related attributes are provided. In embodiments, the method includes providing an indication to view a suggested clinical-trial criteria modification(s) that, if implemented, is expected to increase a number of patients eligible for a clinical trial. Thereafter, a suggested criterion modification for a clinical-trial criterion is received. The suggested criterion modification is based on a comparison of aggregated patient data associated with the clinical-trial criterion to the clinical-trial criterion. The indication of the suggested criterion modification for the clinical-trial criterion can be displayed.

Abstract: A system and method for chip package fabrication is disclosed. The chip package includes a base re-distribution layer having an opening formed therein, an adhesive layer having a window formed therein free of adhesive material, and a die affixed to the base re-distribution layer by way of the adhesive layer, the die being aligned with the window such that only a perimeter of the die contacts the adhesive layer. A shield element is positioned between the base re-distribution layer and adhesive layer that is generally aligned with the opening formed in the base re-distribution layer and the window of the adhesive layer such that only a perimeter of the shield element is attached to the adhesive layer. The shield element is separated from the die by an air gap and is configured to be selectively removable from the adhesive layer so as to expose the front surface of the die.

Abstract: A method includes receiving a forward spatial encoding polarity magnetic resonance (MR) coil image and a reverse spatial encoding polarity MR coil image generated from data obtained with a magnetic field gradient that is reversed with respect to the magnetic field gradient with which the forward spatial encoding polarity MR coil image is acquired. The method also includes performing an iterative shift map calculation algorithm to determine a pixel shift map corresponding to a minimized difference between the forward and reverse spatial encoding polarity MR coil images, converting the pixel shift map into a magnetic field shift map by determining a magnetic field value corresponding to each pixel in the pixel shift map, and providing the magnetic field shift map as an input to a shim calculation process that includes determining a level of at least one shim current.

Abstract: An interconnect assembly for an embedded chip package includes a dielectric layer, first metal layer comprising upper contact pads, second metal layer comprising lower contact pads, and metalized connections formed through the dielectric layer and in contact with the upper and lower contact pads to form electrical connections therebetween. A first surface of the upper contact pads is affixed to a top surface of the dielectric layer and a first surface of the lower contact pads is affixed to a bottom surface of the dielectric layer. An input/output (I/O) of a first side of the interconnect assembly is formed on a surface of the lower contact pads that is opposite the first surface of the lower contact pads, and an I/O of a second side of the interconnect assembly is formed on a surface of the upper contact pads that is opposite the first surface of the upper contact pads.

Abstract: A system and method for chip package fabrication is disclosed. The chip package includes a base re-distribution layer having an opening formed therein, an adhesive layer having a window formed therein free of adhesive material, and a die affixed to the base re-distribution layer by way of the adhesive layer, the die being aligned with the window such that only a perimeter of the die contacts the adhesive layer. A shield element is positioned between the base re-distribution layer and adhesive layer that is generally aligned with the opening formed in the base re-distribution layer and the window of the adhesive layer such that only a perimeter of the shield element is attached to the adhesive layer. The shield element is separated from the die by an air gap and is configured to be selectively removable from the adhesive layer so as to expose the front surface of the die.

Abstract: This invention provides quinazoline compounds of the formula: wherein: R1 is halo; R2 is H or halo; R3 is a) C1-C3 alkyl, optionally substituted by halo; or b) —(CH2)n-morpholino, —(CH2)n-piperidine, —(CH2)n-piperazine, —(CH2)n-piperazine-N(C1-C3 alkyl), —(CH2)n-pyrrolidine, or —(CH2)n-imidazole; n is 1 to 4; R4 is —(CH2)m-Het; Het is morpholine, piperidine, piperazine, piperazine-N(C1-C3 alkyl), imidazole, pyrrolidine, azepane, 3,4-dihydro-2H-pyridine, or 3,6-dihydro-2H-pyridine, each optionally substituted by alkyl, halo, OH, NH2, NH(C1-C3 alkyl) or N(C1-C3 alkyl)2; m is 1-3; and X is O, S or NH; or a pharmaceutically acceptable salt thereof, as well as processes and intermediate compounds for making them, useful pharmaceutical compositions and methods of using the compounds in the treatment of proliferative diseases.

Abstract: The present invention encompasses methods, apparati, and computer-readable media for correcting spatial artifacts in composite radiographic images of an object (1). A method embodiment of the present invention comprises the steps of generating the composite image from a plurality of views of the object (1); estimating a shift profile; and re-generating the image by shifting the views using the shift profile.

Abstract: Systems and method for providing indications of trial-related attributes are provided. In embodiments, the method includes providing an indication to view a suggested clinical-trial criteria modification(s) that, if implemented, is expected to increase a number of patients eligible for a clinical trial. Thereafter, a suggested criterion modification for a clinical-trial criterion is received. The suggested criterion modification is based on a comparison of aggregated patient data associated with the clinical-trial criterion to the clinical-trial criterion. The indication of the suggested criterion modification for the clinical-trial criterion can be displayed.

Abstract: Systems and method for facilitating clinical-trial referrals are provided. In embodiments, the method includes searching clinical-trial data associated with a plurality of clinical trials to identify one or more clinical trials for which a patient is eligible to participate based on patient data associated with the patient. Such clinical-trial data associated with the plurality of clinical trials can be aggregated in a centralized data store. Thereafter, an indication of the one or more clinical trials for which the patient is eligible is provided.

Abstract: This invention provides quinazoline compounds of the formula: wherein: R1 is halo; R2 is H or halo; R3 is a) C1-C3 alkyl, optionally substituted by halo; or b) —(CH2)n-morpholino, —(CH2)n-piperidine, —(CH2)n-piperazine, —(CH2)n-piperazine-N(C1-C3 alkyl), —(CH2)n-pyrrolidine, or —(CH2)n-imidazole; n is 1 to 4; R4 is —(CH2)m-Het; Het is morpholine, piperidine, piperazine, piperazine-N(C1-C3 alkyl), imidazole, pyrrolidine, azepane, 3,4-dihydro-2H-pyridine, or 3,6-dihydro-2H-pyridine, each optionally substituted by alkyl, halo, OH, NH2, NH(C1-C3 alkyl) or N(C1-C3 alkyl)2; m is 1-3; and X is O, S or NH; or a pharmaceutically acceptable salt thereof, as well as processes and intermediate compounds for making them, useful pharmaceutical compositions and methods of using the compounds in the treatment of proliferative diseases.

Abstract: An ultrasound acoustic assembly includes a number of ultrasound acoustic arrays, each array comprising an acoustic stack comprising a piezoelectric layer assembled with at least one acoustic impedance dematching layer and with a support layer. The acoustic stack defines a number of dicing kerfs and a number of acoustic elements, such that the dicing kerfs are formed between neighboring ones of the acoustic elements. The dicing kerfs extend through the piezoelectric layer and through the acoustic impedance dematching layer(s) but extend only partially through the support layer. The ultrasound acoustic assembly further includes a number of application specific integrated circuit (ASIC) die. Each ultrasound acoustic array is coupled to a respective ASIC die to form a respective acoustic-electric transducer module. Methods of manufacture are also provided.

Abstract: An interconnect structure includes an insulative web having a first surface and a second surface; a logic device secured to the second surface of the insulative web; a frame panel assembly including a frame base having a first surface and a second surface, a first frame insulative layer disposed between the frame base first surface and the insulative web second surface, an aperture extending through the frame base and first frame insulative layer, wherein at least a portion of the logic device is disposed within the aperture, and a first frame connector disposed between a first electrically conductive layer located on the frame base first surface, and a second electrically conductive layer located on a surface of the first frame insulative layer; a device connector disposed between an I/O contact on a surface of the logic device and a third electrical conductor located on a surface of the insulative web; and an insulative layer connector that is disposed between the third electrical conductor located on a sur

Abstract: A pre-packaged microwavable food having a steam emitting source integral to the package permitting preparation of the food product in a broad range of microwave ovens. A food product is placed into a package. A steam emitting source is placed in porous communication with the food product inside the package. When the package is heated, steam blankets the food product. Steam has a positive effect on cooking performance and cooking time. The steam emitting source can be made from an absorbent material or a gel. The food product can be a half-product, pellet, or other microwavable food or snack product.

Abstract: An interface circuit for a sensor array is provided. The interface circuit may be made up of an integrated circuit package that provides a first region and a second region. The first region may be spaced apart and opposite to the second region of the package. The first region of the package may provide a plurality of interfaces for interconnecting to an integrated circuit in the package a plurality of signals from the sensor array and having a first electrical characteristic, such as analog and test signals. The second region of the package may provide a plurality of interfaces for interconnecting to the integrated circuit a plurality of signals having at least one electrical characteristic different than the first characteristic, such as power and operational digital signals.