Abstract: A power module assembly includes a frame assembly and a bus bar assembly. The frame assembly includes an upper frame body and a lower frame body coupled to the upper frame body, at least one of the upper and lower frame bodies including at least one jet orifice formed therethrough, the jet orifice configured to receive coolant at a first end and discharge the coolant at a second end, the upper and lower frame bodies at least partially defining a chamber therebetween. The bus bar assembly is arranged in the chamber and includes a bus bar arranged adjacent to the second end of the jet orifice. The jet orifice is configured to discharge the coolant directly onto the bus bar so as to reduce an operating temperature of the bus bar.

Abstract: Embodiments include semiconductor packages and methods to form the semiconductor packages. A semiconductor package includes a bridge over a glass patch. The bridge is coupled to the glass patch with an adhesive layer. The semiconductor package also includes a high-density packaging (HDP) substrate over the bridge and the glass patch. The HDP substrate is conductively coupled to the glass patch with a plurality of through mold vias (TMVs). The semiconductor package further includes a plurality of dies over the HDP substrate, and a first encapsulation layer over the TMVs, the bridge, the adhesive layer, and the glass patch. The HDP substrate includes a plurality of conductive interconnects that conductively couple the dies to the bridge and glass patch. The bridge may be an embedded multi-die interconnect bridge (EMIB), where the EMIB is communicatively coupled to the dies, and the glass patch includes a plurality of through glass vias (TGVs).

Abstract: A maritime vessel communications system may include a satellite communications network, and maritime communications terminals associated with maritime vessels and operable over the satellite communications network. The system may also include a communications management server to obtain vessel geographic position and heading data associated with the maritime vessels, and obtain historical vessel travel route data associated with the maritime vessels. The server may also use machine learning to determine predicted vessel travel routes based upon the vessel geographic position and heading data, and the historical vessel travel route data, and obtain historical satellite communications network usage data associated with the maritime communications terminals.

Abstract: Embodiments include semiconductor packages and methods to form the semiconductor packages. A semiconductor package includes a bridge over a glass patch. The bridge is coupled to the glass patch with an adhesive layer. The semiconductor package also includes a high-density packaging (HDP) substrate over the bridge and the glass patch. The HDP substrate is conductively coupled to the glass patch with a plurality of through mold vias (TMVs). The semiconductor package further includes a plurality of dies over the HDP substrate, and a first encapsulation layer over the TMVs, the bridge, the adhesive layer, and the glass patch. The HDP substrate includes a plurality of conductive interconnects that conductively couple the dies to the bridge and glass patch. The bridge may be an embedded multi-die interconnect bridge (EMIB), where the EMIB is communicatively coupled to the dies, and the glass patch includes a plurality of through glass vias (TGVs).

Abstract: A thermal management system includes a baseplate assembly and a flow system. The baseplate assembly includes a baseplate and a semiconductor die arranged on the baseplate. The flow system includes a first flow path extending over and in thermal contact with the semiconductor die and a second flow path in thermal contact with the baseplate, the flow system including a fluid flowing through the first flow path and the second flow path. The flow system is configured to direct the fluid over the semiconductor die via the first flow path and to the baseplate via the second flow path so as to transfer heat away from the semiconductor die and from the baseplate so as to cool the baseplate assembly.

Abstract: A thermal management system includes a baseplate assembly and a flow system. The baseplate assembly includes a baseplate and a semiconductor die. The flow system includes a submerged jet impingement assembly for direct semiconductor die cooling, a first flow path extending over the semiconductor die via the submerged jet impingement assembly, and a second flow path in thermal contact with the baseplate, the flow system including a fluid flowing through the first flow path and the second flow path. The flow system is configured to direct the fluid to the upper semiconductor surface of the semiconductor die via the first flow path and to the baseplate via the second flow path so as to transfer heat away from the semiconductor die and from the baseplate so as to cool the baseplate assembly.

Abstract: A maritime vessel communications system may include a satellite communications network, and maritime communications terminals associated with maritime vessels and operable over the satellite communications network. The system may also include a communications management server to obtain vessel geographic position and heading data associated with the maritime vessels, and obtain historical vessel travel route data associated with the maritime vessels. The server may also use machine learning to determine predicted vessel travel routes based upon the vessel geographic position and heading data, and the historical vessel travel route data, and obtain historical satellite communications network usage data associated with the maritime communications terminals.

Abstract: Embodiments include semiconductor packages and methods to form the semiconductor packages. A semiconductor package includes a bridge with a hybrid layer on a high-density packaging (HDP) substrate, a plurality of dies over the bridge and the HDP substrate, and a plurality of through mold vias (TMVs) on the HDP substrate. The bridge is coupled between the dies and the HDP substrate. The bridge is directly coupled to two dies of the dies with the hybrid layer, where a top surface of the hybrid layer of the bridge is directly on bottom surfaces of the dies, and where a bottom surface of the bridge is directly on a top surface of the HDP substrate. The TMVs couple the HDP substrate to the dies, and have a thickness that is substantially equal to a thickness of the bridge. The hybrid layer includes conductive pads, surface finish, and/or dielectric.

Abstract: Embodiments include semiconductor packages and methods to form the semiconductor packages. A semiconductor package includes a bridge over a glass patch. The bridge is coupled to the glass patch with an adhesive layer. The semiconductor package also includes a high-density packaging (HDP) substrate over the bridge and the glass patch. The HDP substrate is conductively coupled to the glass patch with a plurality of through mold vias (TMVs). The semiconductor package further includes a plurality of dies over the HDP substrate, and a first encapsulation layer over the TMVs, the bridge, the adhesive layer, and the glass patch. The HDP substrate includes a plurality of conductive interconnects that conductively couple the dies to the bridge and glass patch. The bridge may be an embedded multi-die interconnect bridge (EMIB), where the EMIB is communicatively coupled to the dies, and the glass patch includes a plurality of through glass vias (TGVs).

Abstract: Embodiments include semiconductor packages and methods to form the semiconductor packages. A semiconductor package includes a bridge over a glass patch. The bridge is coupled to the glass patch with an adhesive layer. The semiconductor package also includes a high-density packaging (HDP) substrate over the bridge and the glass patch. The HDP substrate is conductively coupled to the glass patch with a plurality of through mold vias (TMVs). The semiconductor package further includes a plurality of dies over the HDP substrate, and a first encapsulation layer over the TMVs, the bridge, the adhesive layer, and the glass patch. The HDP substrate includes a plurality of conductive interconnects that conductively couple the dies to the bridge and glass patch. The bridge may be an embedded multi-die interconnect bridge (EMIB), where the EMIB is communicatively coupled to the dies, and the glass patch includes a plurality of through glass vias (TGVs).

Abstract: Techniques for fabricating a package substrate comprising a via, a conductive line, and a pad are described. The package substrate can be included in a semiconductor package. For one technique, a package substrate includes: a pad in a dielectric layer; a via; and a conductive line. The via and the conductive line can be part of a structure. Alternatively, the conductive line can be adjacent to the via. The dielectric layer can include a pocket above the pad. One or more portions of the via may be formed in the pocket above the pad. Zero or more portions of the via can be formed on the dielectric layer outside the pocket. In some scenarios, no pad is above the via. The package substrate provides several advantages. One exemplary advantage is that the package substrate can assist with increasing an input/output density per millimeter per layer (IO/mm/layer) of the package substrate.

Abstract: An apparatus for detecting a puncture comprises a housing comprising a plurality of compartments. Each compartment comprises an opening for receiving a flow of air into the compartment. Each compartment also comprises a detection element mounted on an axle, the axle having a first end and a second end and being secured at said first end and said second end within the compartment. The detection element is rotatable about the axle and when a flow of air passes through the opening into the compartment, the detection element rotates around the axle in response to the flow of air.

Abstract: Disclosed herein are integrated circuit (IC) package supports and related apparatuses and methods. For example, in some embodiments, an IC package support may include a layer of dielectric material; a conductive pad at least partially on a top surface of the layer of dielectric material; and a layer of material on side surfaces of the conductive pad, wherein the layer of material does not extend onto the top surface of the layer of dielectric material. Other embodiments are also disclosed.

Abstract: A cup liner for a cup of a spray gun includes a fluid reservoir portion that defines a reservoir and includes a divider portion dividing the reservoir into two or more compartments. Each compartment contains a fluid to be dispensed by the spray gun and keeps the fluids separated from fluids held by other compartments. In addition, a fitting for a spray gun includes two or more inlet interfaces and an outlet interface. Each inlet interface couples to a fluid source and the outlet couples to the spray gun such that the fitting provides fluid communication between each fluid source and the spray gun. This permits the spray gun to spray a mixture of the fluids.

Abstract: A mirror component for receiving an actuator for adjusting a rear view position of a rear view mirror element in a rear view device includes at least one anti-back-out rib element for receiving an electrical connector of the actuator and an electrical mating connector to an electrical supply architecture being connected to the electrical connector, the anti-back-out rib element being an element enabling receiving either at least a first combination or a second combination of the electrical connector being connected to the electrical mating connector, the first and second combinations being differently shaped, and the anti-back-out rib element being adapted to prevent assembly of the actuator to the mirror component in case of the electrical connector being incorrectly connected to the electrical mating connector.

Abstract: An apparatus for detecting a puncture comprises a housing comprising a plurality of compartments. Each compartment comprises an opening for receiving a flow of air into the compartment. Each compartment also comprises a detection element mounted on an axle, the axle having a first end and a second end and being secured at said first end and said second end within the compartment. The detection element is rotatable about the axle and when a flow of air passes through the opening into the compartment, the detection element rotates around the axle in response to the flow of air.

Abstract: A load dissipating arthroplasty prosthesis comprising a shell, an articular device extending into the shell through a collar defined in the sell, a head and neck portion of the articular device extending from the collar, a shaft portion of the articular device extending into the shell, and a plurality of shock absorbing arcuate linkers spacing and allowing limited movement between the shell and the articular device.

Abstract: Embodiments include semiconductor packages and methods to form the semiconductor packages. A semiconductor package includes a bridge with a hybrid layer on a high-density packaging (HDP) substrate, a plurality of dies over the bridge and the HDP substrate, and a plurality of through mold vias (TMVs) on the HDP substrate. The bridge is coupled between the dies and the HDP substrate. The bridge is directly coupled to two dies of the dies with the hybrid layer, where a top surface of the hybrid layer of the bridge is directly on bottom surfaces of the dies, and where a bottom surface of the bridge is directly on a top surface of the HDP substrate. The TMVs couple the HDP substrate to the dies, and have a thickness that is substantially equal to a thickness of the bridge. The hybrid layer includes conductive pads, surface finish, and/or dielectric.

Abstract: Embodiments include semiconductor packages and methods to form the semiconductor packages. A semiconductor package includes a bridge over a glass patch. The bridge is coupled to the glass patch with an adhesive layer. The semiconductor package also includes a high-density packaging (HDP) substrate over the bridge and the glass patch. The HDP substrate is conductively coupled to the glass patch with a plurality of through mold vias (TMVs). The semiconductor package further includes a plurality of dies over the HDP substrate, and a first encapsulation layer over the TMVs, the bridge, the adhesive layer, and the glass patch. The HDP substrate includes a plurality of conductive interconnects that conductively couple the dies to the bridge and glass patch. The bridge may be an embedded multi-die interconnect bridge (EMIB), where the EMIB is communicatively coupled to the dies, and the glass patch includes a plurality of through glass vias (TGVs).