Abstract: In one implementation, a power semiconductor package includes a conductive carrier including a switch node segment and a power output segment. The power semiconductor package also includes an integrated output inductor stacked over the conductive carrier and configured to couple the switch node segment to the power output segment. The power semiconductor package further includes a power stage stacked over the integrated output inductor.

Abstract: In one implementation, an insertable power unit for plugging into a mother board includes a power module situated on a substrate, and a mounting contact on an extended side of the substrate away from the power module. The mounting contact is electrically coupled to the power module by electrical routing in the substrate. The mounting contact is configured to provide electrical connection between the power module and the mother board.

Abstract: In one implementation, a power unit for plugging into a mother board includes a power module situated on a substrate. The substrate is situated on conductive slats, each having an extended end away from the power module. Each of the conductive slats provides a mounting contact of the power unit. Each mounting contact is electrically coupled to the power module by electrical routing in the substrate. The mounting contacts are configured to provide electrical connection between the power module and the mother board.

Abstract: In one implementation, a power semiconductor package includes a conductive carrier including a switch node segment and a power output segment. The power semiconductor package also includes an integrated output inductor stacked over the conductive carrier and configured to couple the switch node segment to the power output segment. The power semiconductor package further includes a power stage stacked over the integrated output inductor, the power stage including a pulse-width modulation (PWM) control and driver coupled to a control transistor and a sync transistor.

Abstract: In one implementation, a power semiconductor package includes a conductive carrier including a switch node segment and a power output segment. The power semiconductor package also includes an integrated output inductor stacked over the conductive carrier and configured to couple the switch node segment to the power output segment. The power semiconductor package further includes a power stage stacked over the integrated output inductor, the power stage including a pulse-width modulation (PWM) control and driver coupled to a control transistor and a sync transistor.

Abstract: In one implementation, a power semiconductor package includes a conductive carrier including a switch node segment and a power output segment. The power semiconductor package also includes an integrated output inductor stacked over the conductive carrier and configured to couple the switch node segment to the power output segment. The power semiconductor package further includes a power stage stacked over the integrated output inductor.

Abstract: A gun and bow camera mount providing an apparatus capable of mounting a conventional hand-held camera to any of various hunting weapons. The gun and bow camera mount includes a camera support having a camera mount resiliently biased against a carriage. The camera support includes typical mounting apparatus defining a shooting vector corresponding to the direction a conventional hand-held camera points when mounted to the typical mounting apparatus. The gun and bow camera mount includes features for securing the camera support to a conventional hunting weapon such that the shooting vector is fixed in a direction parallel to the line of fire of the weapon.