Patents by Inventor Kevin Niu

Kevin Niu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • POWER MODULE PACKAGING SYSTEMS AND FABRICATION METHODS
    Publication number: 20230230854
    Abstract: A method and system for fabricating a three-dimensional power module packaging structure is provided. The power module packaging method incorporates a one-time SMD-molding process, which simultaneously connects bare semiconductor dies and conductive pillars to the PCB substrate directly.
    Type: Application
    Filed: January 18, 2022
    Publication date: July 20, 2023
    Inventors: Wenkai Wu, Kevin Niu, Cheng Wei Chen