Abstract: Laser cutting a metal foil by providing a polymer film as a carrier layer for the metal foil where the metal foil is ablated by the laser beam wavelength selected for laser cutting and wherein the polymer film is a polymer film that is transparent to the laser beam wavelength selected for laser cutting such that laser cutting produces metal foil cut parts in a substrate while the polymer backing remains intact for supporting the cut parts for subsequent separation of the cut parts from substrate.

Abstract: A system and method of cooling and purging a laser processing system comprising at least one galvo system for directing at least one laser beam to a work piece and a protection window mounting plate comprising at least one protection window secured in a corresponding cavity of the mounting plate where the plate is configured with at least one air flow passageway in the mounting plate for each protection window such that an airflow used to cool each galvo systems is directed through the mounting plate vis the passageway and further directed past the window cavity to purge the cavity, where the purging air flow is then vented or exhausted from the laser system.

Abstract: A system and method of cooling and purging a laser processing system comprising at least one galvo system for directing at least one laser beam to a work piece and a protection window mounting plate comprising at least one protection window secured in a corresponding cavity of the mounting plate where the plate is configured with at least one air flow passageway in the mounting plate for each protection window such that an airflow used to cool each galvo systems is directed through the mounting plate vis the passageway and further directed past the window cavity to purge the cavity, where the purging air flow is then vented or exhausted from the laser system.

Abstract: A laser processing system and method for cutting individual parts from a continuous moving web of substrate material. The laser system is configured to cleanly cut individual parts from a moving web without severing or damaging a supporting conveyor belt by partially processing the substrate as the substrate passes over a first conveyor belt comprising a plurality of individual belts spaced apart across the width of the web. The laser is directed to process the substrate according to gaps in the apparatus below the substrate, that is the laser is configured to process the substrate along a path wherein the substrate is passed over air rather than a physical support or conveyor. The finishing of the singulation of the individual part is completed by laser processing the web as it passes over a gap between a first conveyor and a second conveyor system.