Abstract: A heat sink retention device for retaining a heat sink, including a spring, proximate an electronic device in a circuit board. The device includes a first component configured to be attached to a circuit board, and a second component configured to be adjustably attached to the first component, and including an opening configured to retain a portion of a spring of a heat sink. When the first and second components are attached together and the first component is attached to the circuit board, the heat sink retention device is adapted to allow application of a force on the spring in order to retain the heat sink proximate an electronic device mounted on the circuit board.

Abstract: A heat pipe system, method, and heat sink system to enhance heat transfer from a heat-generating component. The method includes generating heat with the heat-generating component. The method also includes transferring at least a portion of the heat to at least a portion of a volatile fluid within one or more heat pipes. The method further includes modifying, dynamically, an active heat transfer region of the one or more heat pipes, thereby dynamically modulating heat transfer from the heat-generating component through the one or more heat pipes.

Abstract: A method, system and computer program product for improving discernment between qubit states in superconducting quantum computers. Channels are calibrated to train the kernel to contain the correct calibration data (“kernel states”). After calibrating a channel, testing is performed in which quantum operations are performed on qubits at the same time in adjacent channels, including the recently calibrated channel, to determine if the kernel response differs from the expected kernel response, where the expected kernel response is based on the kernel states of the trained kernel of the recently calibrated channel, beyond a threshold value. If such a situation occurs, then the phase of the signal for the recently calibrated channel is shifted and the process of recalibrating the channel (using the phase shifted signal) and testing is repeated until the difference between the kernel response and the expected kernel response is not beyond the threshold value.

Abstract: A high precision photonic readout for performing high precision photon sensing includes a laser source, photonic sensor, photonic sensor measurement module, laser and stabilization module. The photonic sensor measurement module receives the sensor light and produces a modulator control signal. The laser stabilization module receives the reference light and produces a phase lock signal that stabilizes the reference light frequency that controls the laser source to produce the reference light.

Abstract: A cable connector for counting a number of plug-in events and preventing further plug in attempts after a threshold number of plug-in events have occurred. An inner sleeve is located inside an outer sleeve, and is designed to move relative to the outer sleeve. The inner sleeve further includes a tab on an outer surface of the inner sleeve. A gear wheel is located inside the outer sleeve and perpendicular to the inner sleeve and has a number of gear teeth. A toggle plug counter rotates the gear wheel one tooth in response to a plug-in action of the cable counter. When the gear wheel rotates to a point where the tab aligns with a notch in the gear wheel an inner spring at the opposite end of the inner sleeve causes the inner sleeve to move through the gear wheel such that further plugging action becomes difficult.

Abstract: A latch mechanism includes a mounting bracket, a stop connected to the mounting bracket, a first spring connected to the mounting bracket and in contact with the stop to preload the first spring, and a latch. The latch includes a second spring rotatably connected to the mounting bracket, and a body connected to the second spring. The body includes a pad at one end of the body, and a first pawl at a second end of the body opposite of the pad.

Abstract: Techniques are provided to convert utility power having an unstable utility frequency into supply power having a stable frequency, which can be distributed and utilized as a system reference. For example, a system comprises a power generator and a power distribution system. The power generator is configured to convert utility power having an unstable utility frequency to supply power having a stable frequency component. The power distribution system is coupled to an output of the power generator, and is configured to distribute the supply power having the stable frequency component to at least one power consumer which is configured to utilize the stable frequency component of the supply power as a reference frequency.

Abstract: A latch mechanism includes a mounting bracket, a stop connected to the mounting bracket, a first spring connected to the mounting bracket and in contact with the stop to preload the first spring, and a latch. The latch includes a second spring rotatably connected to the mounting bracket, and a body connected to the second spring. The body includes a pad at one end of the body, and a first pawl at a second end of the body opposite of the pad.

Abstract: An apparatus for providing a safety and EMC compliant heat sink. The apparatus includes a heat sink configured to be attached to an internal power plane of a printed circuit board (PCB). The heat sink includes a plurality of fins extending outward from the heat sink. The apparatus further includes a compliance cage configured to be connected to a ground portion of the PCB, the compliance cage surrounding at least a portion of the heat sink. At least one capacitor plate contacting at least a portion of the compliance cage and extending inwards towards the heat sink and interleaving with the plurality of fins is present. Dielectric spacers are provided to fill a portion of the space between the capacitor plates and the heat sink fins.

Abstract: A latch assembly includes a lever arm affixed to a latch pivot point of rotation with a cam having a connecting slot. A load mechanism is configured to apply a force on the latch pivot point to retain the lever arm in a first position. The load mechanism is tuned to apply the force along a tolerance range of operation of the latch assembly.

Abstract: An apparatus for guidance and retention of integrated circuit boards includes a first structure configured to receive a first integrated circuit board and guide the first integrated circuit board for coupling to a substrate. The apparatus further includes a second structure configured to be removably coupled to the first structure. The second structure includes a first spring member configured to apply a first compressive force to the first integrated circuit board.

Abstract: Provided is a damper system for an electronic equipment rack. The damper system may include an electronic equipment rack, a battery back-up unit, and a plurality of rails disposed within the electronic equipment rack. The battery back-up unit is slidably secured to the plurality of rails and tuned to dampen seismic oscillations of the electronic equipment rack during an earthquake. The battery back-up unit is also able to provide power to the electronic equipment disposed in the rack during a power outage.

Abstract: A server includes a printed circuit board (PCB), an electronic component connected to the printed circuit board, and a chassis connected to the PCB. The chassis includes a first end with a first aperture configured to allow airflow into the server, a second end with a second aperture configured to allow the airflow out of the server after having passed across the electronic component, and a temporary bulkhead that is movable between a deployed position and a stowed position, wherein in the deployed position, the temporary bulkhead is connected to the PCB and extends across the server in a path of the airflow, and wherein in the stowed position, the temporary bulkhead is disconnected from the PCB and is positioned to open the path of the airflow.

Abstract: A heat sink retention device for retaining a heat sink, including a spring, proximate an electronic device in a circuit board. The device includes a first component configured to be attached to a circuit board, and a second component configured to be adjustably attached to the first component, and including an opening configured to retain a portion of a spring of a heat sink. When the first and second components are attached together and the first component is attached to the circuit board, the heat sink retention device is adapted to allow application of a force on the spring in order to retain the heat sink proximate an electronic device mounted on the circuit board.

Abstract: A latch mechanism includes a mounting bracket, a stop connected to the mounting bracket, a first spring connected to the mounting bracket and in contact with the stop to preload the first spring, and a latch. The latch includes a second spring rotatably connected to the mounting bracket, and a body connected to the second spring. The body includes a pad at one end of the body, and a first pawl at a second end of the body opposite of the pad.

Abstract: A latch assembly includes a lever arm affixed to a latch pivot point of rotation with a cam having a connecting slot. A load mechanism is configured to apply a force on the latch pivot point to retain the lever arm in a first position. The load mechanism is tuned to apply the force along a tolerance range of operation of the latch assembly.

Abstract: A heat sink to selectively dissipate heat from a plurality of heat-generating components. The heat sink includes a plurality of heat pipes, and a base plate configured to locate at least one of the plurality of heat pipes proximate each of the plurality of heat-generating components. The heat sink also includes a plurality of sets of fins operable to dissipate heat generated by the heat-generating components, and a plurality of sets of louvers, wherein each of the plurality of sets of louvers is associated with one of the plurality of sets of fins and is operable to open to selectively allow airflow from outside the heat sink to dissipate heat from one of the plurality of sets of fins.

Abstract: A bag film crimping device has a socket having top and bottom components joined by a bridge. Each socket component has a pair of opposed limbs, and each limb having inwardly directed teeth. A plug fits between the limbs with a friction fit in a movement from proximal to distal, and it has outwardly directed teeth for engagement with the teeth of the socket. A cover slide over the socket to cover a space at a distal end between the limbs when the socket and plug components have been separated after crimping. The cover includes has tines for prising a socket limb from the plug as the cover is pressed distally after it has previously been used to cover exposed edges of film after crimping and the top and bottom components have been separated.

Abstract: A server includes a printed circuit board (PCB), an electronic component connected to the PCB, and a chassis connected to the PCB. The chassis includes a first end with a first aperture configured to allow airflow into the server, a second end with a second aperture configured to allow the airflow out of the server after having passed across the electronic component, and a movable bulkhead comprising a first set of louvers, the movable bulkhead being movable between a closed position and an opened position, wherein each of the louvers includes a leading edge contact feature configured to interface with a trailing edge of a respective adjacent louver. In the closed position, the first set of louvers forms a wall in a primary path of the airflow, and, in the opened position, the first set of louvers are oriented in a direction of the primary path of the airflow.

Abstract: A server includes a printed circuit board (PCB), an electronic component connected to the printed circuit board, and a chassis connected to the PCB. The chassis includes a first end with a first aperture configured to allow airflow into the server, a second end with a second aperture configured to allow the airflow out of the server after having passed across the electronic component, and a temporary bulkhead that is movable between a deployed position and a stowed position, wherein in the deployed position, the temporary bulkhead is connected to the PCB and extends across the server in a path of the airflow, and wherein in the stowed position, the temporary bulkhead is disconnected from the PCB and is positioned to open the path of the airflow.