Patents by Inventor Kevin P. DeKam

Kevin P. DeKam has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230398732
    Abstract: The present disclosure describes materials, methods, and systems for three-dimensional printing. In one example, a three-dimensional printing kit can include a fusing agent and a microbe-inhibiting agent. The fusing agent can include water and an electromagnetic radiation absorber. The electromagnetic radiation absorber can absorb radiation and convert the radiation energy to heat. The microbe-inhibiting agent can include a liquid vehicle and a metal bis(dithiolene) complex. The disclosure also describes methods of three-dimensional printing that utilize a metal-containing microbe-inhibiting material, which can be a metal bis(dithiolene) complex or other materials.
    Type: Application
    Filed: October 30, 2020
    Publication date: December 14, 2023
    Inventors: JARRID ALEXANDER WITTKOPF, KRISTOPHER J ERICKSON, EMRE HIRO DISCEKICI, STERLING CHAFFINS, KEVIN P DeKAM, RAGHUVIR N SENGUPTA, ALBERT LIU, ELIZABETH GALATI
  • Publication number: 20230373157
    Abstract: In an example method for forming three-dimensional (3D) printed electronic parts, a build material is applied. An electronic agent is selectively applied in a plurality of passes on a portion of the build material. A fusing agent is also selectively applied on the portion of the build material. The build material is exposed to radiation in a plurality of heating events. During at least one of the plurality of heating events, the portion of the build material in contact with the fusing agent fuses to form a region of a layer. The region of the layer exhibits an electronic property. An order of the plurality of passes, the selective application of the fusing agent, and the plurality of heating events is controlled to control a mechanical property of the layer and the electronic property of the region.
    Type: Application
    Filed: July 31, 2023
    Publication date: November 23, 2023
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Yan ZHAO, Kristopher J. ERICKSON, Aja HARTMAN, Lihua ZHAO, Sterling CHAFFINS, Kevin P. DEKAM
  • Publication number: 20230347586
    Abstract: The present disclosure is drawn to 3D printing kits, multi-fluid kits for 3D printing, and methods of making 3D printed articles. In one example, a 3D printing kit can include a powder bed material, a fusible fluid, and a magnetic fluid. The powder bed material can include polymer particles. The fusible fluid can include water and a radiation absorber. The fusible fluid can be to selectively apply to the powder bed material. The magnetic fluid can include magnetic particles, and the magnetic fluid can be to selectively apply to the powder bed material.
    Type: Application
    Filed: July 7, 2023
    Publication date: November 2, 2023
    Inventors: Kevin P. DeKam, Sterling Chaffins, Cassady Sparks Roop
  • Publication number: 20230303884
    Abstract: A method for forming parts with electrically conductive features includes applying a layer of thermoplastic polymer powder particles in a powder bed and selectively applying an aqueous pretreat composition including a metal chloride salt on a portion of the layer. A conductive fusing ink including transition metal particles and a dispersing agent is selectively applied onto the applied aqueous pretreat composition on the portion of the layer, wherein the dispersing agent binds to, and passivates surfaces of the transition metal particles. The layer is exposed to electromagnetic radiation to fuse the thermoplastic polymer powder particles in the portion of the layer and sinter the transition metal particles, thereby forming a conductive feature.
    Type: Application
    Filed: June 1, 2023
    Publication date: September 28, 2023
    Inventors: Sterling Chaffins, Kevin P. DeKam, Michael G. Monroe
  • Patent number: 11760010
    Abstract: In an example method for forming three-dimensional (3D) printed electronic parts, a build material is applied. An electronic agent is selectively applied in a plurality of passes on a portion of the build material. A fusing agent is also selectively applied on the portion of the build material. The build material is exposed to radiation in a plurality of heating events. During at least one of the plurality of heating events, the portion of the build material in contact with the fusing agent fuses to form a region of a layer. The region of the layer exhibits an electronic property. An order of the plurality of passes, the selective application of the fusing agent, and the plurality of heating events is controlled to control a mechanical property of the layer and the electronic property of the region.
    Type: Grant
    Filed: December 23, 2021
    Date of Patent: September 19, 2023
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Yan Zhao, Kristopher J. Erickson, Aja Hartman, Lihua Zhao, Sterling Chaffins, Kevin P. DeKam
  • Patent number: 11738508
    Abstract: In an example, a composition for three-dimensional (3D) printing includes a polymer build material and a non-conductive fusing agent dispensable onto the polymer build material to form a polymer-fusing agent composite portion when heated to a sintering temperature, a conductive agent dispensable onto on the polymer build material to form a polymer-conductive agent composite portion when heated at least to the sintering temperature, the conductive agent comprising: at least one conductive particulate present in an amount of from about 10% to about 60% of a total weight of the conductive agent; at least one co-solvent present in an amount of from about 10% to about 50% of a total weight of the conductive agent; and an additive present in an amount of from about 0% to about 10% of a total weight of the conductive agent.
    Type: Grant
    Filed: November 17, 2017
    Date of Patent: August 29, 2023
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Sterling Chaffins, Kevin P DeKam, Kristopher J Erickson, Cory J Ruud, Jami Ryan Barone, Ruhua Cai, Anthony J Galvan
  • Patent number: 11712845
    Abstract: The present disclosure is drawn to 3D printing kits, multi-fluid kits for 3D printing, and methods of making 3D printed articles. In one example, a 3D printing kit can include a powder bed material, a fusible fluid, and a magnetic fluid. The powder bed material can include polymer particles. The fusible fluid can include water and a radiation absorber. The fusible fluid can be to selectively apply to the powder bed material. The magnetic fluid can include magnetic particles, and the magnetic fluid can be to selectively apply to the powder bed material.
    Type: Grant
    Filed: October 16, 2018
    Date of Patent: August 1, 2023
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Kevin P. DeKam, Sterling Chaffins, Cassady Sparks Roop
  • Publication number: 20220402205
    Abstract: A 3-dimensional printed part can include a part body including a first matrix of fusing agent and thermoplastic polymer powder, a security feature including a second matrix of fusing agent, thermoplastic polymer powder, and photoluminescent agent, and a masking feature including a third matrix of fusing agent and thermoplastic polymer powder. The security feature can be positioned beneath and visible through the masking feature upon photoluminescent emission of the security feature.
    Type: Application
    Filed: August 19, 2022
    Publication date: December 22, 2022
    Inventors: Garry Hinch, Kevin P. DeKam, Sterling Chaffins, James William Stasiak
  • Publication number: 20220388239
    Abstract: The present disclosure is drawn to 3-dimensional printed parts that can include a conductive composite portion and an insulating portion. The conductive composite portion can include a matrix of fused thermoplastic polymer particles interlocked with a matrix of sintered elemental transition metal particles. The insulating portion can include a matrix of fused thermoplastic polymer particles that are continuous with the matrix of fused thermoplastic polymer particles in the conductive composite portion. The insulating portion can be substantially free of sintered elemental transition metal particles and can include transition metal oxide bronze particles.
    Type: Application
    Filed: August 19, 2022
    Publication date: December 8, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Sterling CHAFFINS, Cassady Sparks ROOP, Kevin P. DEKAM, Vladek KASPERCHIK, Ali EMAMJOMEH, Johnathon HOLROYD, Stephen G. RUDISILL, Alexey S. KABALNOV
  • Patent number: 11465341
    Abstract: A 3-dimensional printed part can include a part body including a first matrix of fusing agent and thermoplastic polymer powder, a security feature including a second matrix of fusing agent, thermoplastic polymer powder, and photoluminescent agent, and a masking feature including a third matrix of fusing agent and thermoplastic polymer powder. The security feature can be positioned beneath and visible through the masking feature upon photoluminescent emission of the security feature.
    Type: Grant
    Filed: April 28, 2016
    Date of Patent: October 11, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Garry Hinch, Kevin P. DeKam, Sterling Chaffins, James William Stasiak
  • Patent number: 11458675
    Abstract: The present disclosure is drawn to material sets for 3-dimensional printing. The material set can include a thermoplastic polymer powder having an average particle size from 20 ?m to 200 ?m, a conductive fusing agent composition including a transition metal, and nonconductive fusing agent composition. The nonconductive fusing agent composition can include transition metal oxide bronze particles.
    Type: Grant
    Filed: October 25, 2016
    Date of Patent: October 4, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Sterling Chaffins, Cassady Sparks Roop, Kevin P DeKam, Vladek Kasperchik, Ali Emamjomeh, Johnathon Holroyd, Stephen G Rudisill, Alexey S Kabalnov
  • Patent number: 11427725
    Abstract: The present disclosure is drawn to material sets for 3-dimensional printing, 3-dimensional printing systems, and 3-dimensional printed parts. A material set can include a thermoplastic polymer powder having an average particle size from 20 ?m to 100 ?m, a photoluminescent ink including a photoluminescent agent, and a fusing ink. The fusing ink can include a fusing agent capable of absorbing electromagnetic radiation to produce heat.
    Type: Grant
    Filed: April 28, 2016
    Date of Patent: August 30, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: James William Stasiak, Garry Hinch, Sterling Chaffins, Kevin P. DeKam
  • Publication number: 20220126507
    Abstract: The present disclosure is drawn to three-dimensional printing kits, methods of making magnetic three-dimensional printed articles, and systems for three-dimensional printing. In one example, a three-dimensional printing kit can include a powder bed material, a fusing agent, and a magnetic agent. The powder bed material can include polymer particles. The fusing agent can include water and a non-magnetic radiation absorber. The non-magnetic radiation absorber can absorb radiation energy and convert the radiation energy to heat. The magnetic agent can include a dispersion of magnetic nanoparticles.
    Type: Application
    Filed: July 16, 2019
    Publication date: April 28, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Emre Hiro Discekici, Shannon Reuben Woodruff, Cory J. Ruud, Vladek Kasperchik, Jesiska Tandy, Kevin P. DeKam
  • Patent number: 11312877
    Abstract: The present disclosure is drawn to fluid sets, material sets, and 3-dimensional printing systems. A fluid set can include a pretreat composition that includes a salt of an alkali metal with bromide or iodide. The fluid set can also include a conductive fusing agent composition including a transition metal for fusing thermoplastic powder when exposed to electromagnetic radiation.
    Type: Grant
    Filed: October 25, 2016
    Date of Patent: April 26, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Sterling Chaffins, Kevin P. Dekam
  • Publication number: 20220118694
    Abstract: In an example method for forming three-dimensional (3D) printed electronic parts, a build material is applied. An electronic agent is selectively applied in a plurality of passes on a portion of the build material. A fusing agent is also selectively applied on the portion of the build material. The build material is exposed to radiation in a plurality of heating events. During at least one of the plurality of heating events, the portion of the build material in contact with the fusing agent fuses to form a region of a layer. The region of the layer exhibits an electronic property. An order of the plurality of passes, the selective application of the fusing agent, and the plurality of heating events is controlled to control a mechanical property of the layer and the electronic property of the region.
    Type: Application
    Filed: December 23, 2021
    Publication date: April 21, 2022
    Inventors: Yan Zhao, Kristopher J. Erickson, Aja Hartman, Lihua Zhao, Sterling Chaffins, Kevin P. DeKam
  • Patent number: 11304313
    Abstract: According to examples, a method of making a three-dimensional conductive printed part, including forming a layer of polymeric build material; selectively applying a fusing agent on a first selected area of the formed polymeric build material; selectively applying a conductive agent on a second selected area of the formed polymeric build material; and applying a solder receiving material to a portion of the first selected area and a portion of the second selected area; in which the solder receiving material is present on a surface of the conductive three-dimensional printed part is disclosed.
    Type: Grant
    Filed: December 15, 2017
    Date of Patent: April 12, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Sterling Chaffins, Kevin P. Dekam, Thomas A. Saksa, Juan Sebastian Ramirez
  • Patent number: 11292189
    Abstract: In an example of a method for three-dimensional (3D) printing, a polymeric or polymeric composite build material is applied. A dielectric agent is selectively applied on at least a portion of the polymeric or polymeric composite build material. The dielectric agent includes a dielectric material having an effective relative permittivity (?r) value ranging from 1.1 to about 10,000. A fusing agent is selectively applied on the at least the portion of the polymeric or polymeric composite build material, and the polymeric or polymeric composite build material is exposed to radiation to fuse the at least the portion of the polymeric or polymeric composite build material to form a region of a layer of a 3D part. The region exhibits a dielectric property, a piezoelectric property, or a combination thereof.
    Type: Grant
    Filed: November 17, 2017
    Date of Patent: April 5, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Andrew Van Brocklin, Kevin P. DeKam, Vladek Kasperchik, Johnathon Holroyd, Douglas Pederson, Sterling Chaffins
  • Publication number: 20220063189
    Abstract: Methods and systems for making three-dimensional printed articles. In one example, a method of making a three-dimensional article can include printing a conductive element including a composite of a conductive material and a polymeric build material; printing an adjacent portion in contact with the conductive element, where the adjacent portion includes a nonconductive polymeric build material; and heating the conductive element by running an electric current through the conductive element, and thereby heating the adjacent portion to a temperature sufficient to change a physical property of the nonconductive polymeric build material of the adjacent portion.
    Type: Application
    Filed: April 29, 2019
    Publication date: March 3, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Sterling Chaffins, Thomas A. Saksa, Kevin P. DeKam, Juan Sebastian Ramirez, Dale Peterson, Jami Ryan Barone
  • Patent number: 11199456
    Abstract: A temperature sensor can include a resistor, a first electrical contact at a first end of the resistor, a second electrical contact at a second end of the resistor, and a resistance measuring device. The resistor can be formed of a matrix of sintered elemental transition metal particles interlocked with a matrix of fused thermoplastic polymer particles. The resistance measuring device can be connected to the first electrical contact and the second electrical contact to measure a resistance of the resistor.
    Type: Grant
    Filed: October 25, 2016
    Date of Patent: December 14, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Kevin P DeKam, Timothy L Weber, Sterling Chaffins
  • Publication number: 20210362408
    Abstract: The present disclosure is drawn to 3D printing kits, multi-fluid kits for 3D printing, and methods of making 3D printed articles. In one example, a 3D printing kit can include a powder bed material, a fusible fluid, and a magnetic fluid. The powder bed material can include polymer particles. The fusible fluid can include water and a radiation absorber. The fusible fluid can be to selectively apply to the powder bed material. The magnetic fluid can include magnetic particles, and the magnetic fluid can be to selectively apply to the powder bed material.
    Type: Application
    Filed: October 16, 2018
    Publication date: November 25, 2021
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Kevin P. DeKam, Sterling Chaffins, Cassady Sparks Roop