Patents by Inventor Kevin P. Dixon

Kevin P. Dixon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11841245
    Abstract: A measurement system, its assembly and use are disclose. The system may include an instrument for making sensor measurements. The instrument has a substantially cylindrical housing. The shape and size allow the instrument to easily fit in an average hand enabling handheld operation. The housing houses a board stack of electronic boards. These electronics drive an electrical signal in at least one drive channel and measure responses from at least two sensing channels. These responses are provided to a processor for analysis. The instrument has a sensor connector that enables simultaneous electrical and mechanical attachment of an end effector.
    Type: Grant
    Filed: January 6, 2023
    Date of Patent: December 12, 2023
    Assignee: JENTEK Sensors, Inc.
    Inventors: Neil J Goldfine, Todd M Dunford, Scott A Denenberg, Kevin P Dixon, Yanko K Sheiretov, Saber Bahranifard, Stuart D Chaplan, Mark Windoloski
  • Publication number: 20230160728
    Abstract: A measurement system, its assembly and use are disclose. The system may include an instrument for making sensor measurements. The instrument has a substantially cylindrical housing. The shape and size allow the instrument to easily fit in an average hand enabling handheld operation. The housing houses a board stack of electronic boards. These electronics drive an electrical signal in at least one drive channel and measure responses from at least two sensing channels. These responses are provided to a processor for analysis. The instrument has a sensor connector that enables simultaneous electrical and mechanical attachment of an end effector.
    Type: Application
    Filed: January 6, 2023
    Publication date: May 25, 2023
    Applicant: JENTEK Sensors, Inc.
    Inventors: Neil J Goldfine, Todd M Dunford, Scott A Denenberg, Kevin P Dixon, Yanko K Sheiretov, Saber Bahranifard, Stuart D Chaplan, Mark Windoloski
  • Patent number: 11549831
    Abstract: A measurement system, its assembly and use are disclose. The system may include an instrument for making sensor measurements. The instrument has a substantially cylindrical housing. The shape and size allow the instrument to easily fit in an average hand enabling handheld operation. The housing houses a board stack of electronic boards. These electronics drive an electrical signal in at least one drive channel and measure responses from at least two sensing channels. These responses are provided to a processor for analysis. The instrument has a sensor connector that enables simultaneous electrical and mechanical attachment of an end effector.
    Type: Grant
    Filed: September 16, 2019
    Date of Patent: January 10, 2023
    Assignee: JENTEK Sensors, Inc.
    Inventors: Neil J Goldfine, Todd M Dunford, Scott A Denenberg, Kevin P Dixon, Yanko K Sheiretov, Saber Bahranifard, Stuart D Chaplan, Mark Windoloski
  • Publication number: 20220373367
    Abstract: A measurement system, its assembly and use are disclose. The system may include an instrument for making sensor measurements. The instrument has a substantially cylindrical housing. The shape and size allow the instrument to easily fit in an average hand enabling handheld operation. The housing houses a board stack of electronic boards. These electronics drive an electrical signal in at least one drive channel and measure responses from at least two sensing channels. These responses are provided to a processor for analysis. The instrument has a sensor connector that enables simultaneous electrical and mechanical attachment of an end effector.
    Type: Application
    Filed: September 16, 2019
    Publication date: November 24, 2022
    Applicant: JENTEK Sensors, Inc.
    Inventors: Neil J Goldfine, Todd M Dunford, Scott A Denenberg, Kevin P Dixon, Yanko K Sheiretov, Saber Bahranifard, Stuart D Chaplan, Mark Windoloski
  • Publication number: 20210080297
    Abstract: A measurement system, its assembly and use are disclose. The system may include an instrument for making sensor measurements. The instrument has a substantially cylindrical housing. The shape and size allow the instrument to easily fit in an average hand enabling handheld operation. The housing houses a board stack of electronic boards. These electronics drive an electrical signal in at least one drive channel and measure responses from at least two sensing channels. These responses are provided to a processor for analysis. The instrument has a sensor connector that enables simultaneous electrical and mechanical attachment of an end effector.
    Type: Application
    Filed: September 16, 2019
    Publication date: March 18, 2021
    Applicant: JENTEK Sensors, Inc.
    Inventors: Neil J Goldfine, Todd M Dunford, Scott A Denenberg, Kevin P Dixon, Yanko K Sheiretov, Saber Bahranifard, Stuart D Chaplan, Mark Windoloski
  • Patent number: 10677756
    Abstract: A sensor system has an integrated sensor cartridge, and instrument, and an instrument side connector. The integrated sensor cartridge has a mechanical support, a flexible sensor array, and a rigid connector. The mechanical support is shaped to facilitate sensor measurements on a test object. The rigid connector has a mechanical connection and an electrical connection for simultaneous electrical and mechanical mating of the sensor cartridge to the instrument side connector. The flexible array has a connecting portion, a lead portion, and a sensing portion. The sensing portion is attached to the mechanical support, and the connecting portion interfaces with the rigid connector. The connecting portion may form the electrical connection of the rigid connector or may simply mate internally with the electrical connection. The instrument side connector is connected to the instrument which measures the response of the flexible sensor array.
    Type: Grant
    Filed: May 31, 2016
    Date of Patent: June 9, 2020
    Assignee: JENTEK SENSORS, INC.
    Inventors: Neil J Goldfine, Yanko K Sheiretov, Scott A Denenberg, Karen Walrath, Todd M Dunford, Kevin P Dixon, Christopher T Martin
  • Patent number: 10416118
    Abstract: A measurement system, its assembly and use are disclose. The system may include an instrument for making sensor measurements. The instrument has a substantially cylindrical housing. The shape and size allow the instrument to easily fit in an average hand enabling handheld operation. The housing houses a board stack of electronic boards. These electronics drive an electrical signal in at least one drive channel and measure responses from at least two sensing channels. These responses are provided to a processor for analysis. The instrument has a sensor connector that enables simultaneous electrical and mechanical attachment of an end effector.
    Type: Grant
    Filed: May 12, 2017
    Date of Patent: September 17, 2019
    Assignee: JENTEK Sensors, Inc.
    Inventors: Neil J Goldfine, Todd M Dunford, Scott A Denenberg, Kevin P Dixon, Yanko K Sheiretov, Saber Bahranifard, Stuart D Chaplan, Mark D Windoloski
  • Publication number: 20160349214
    Abstract: A sensor system has an integrated sensor cartridge, and instrument, and an instrument side connector. The integrated sensor cartridge has a mechanical support, a flexible sensor array, and a rigid connector. The mechanical support is shaped to facilitate sensor measurements on a test object. The rigid connector has a mechanical connection and an electrical connection for simultaneous electrical and mechanical mating of the sensor cartridge to the instrument side connector. The flexible array has a connecting portion, a lead portion, and a sensing portion. The sensing portion is attached to the mechanical support, and the connecting portion interfaces with the rigid connector. The connecting portion may form the electrical connection of the rigid connector or may simply mate internally with the electrical connection. The instrument side connector is connected to the instrument which measures the response of the flexible sensor array.
    Type: Application
    Filed: May 31, 2016
    Publication date: December 1, 2016
    Inventors: Neil J. Goldfine, Yanko K. Sheiretov, Scott A. Denenberg, Karen Walrath, Todd M. Dunford, Kevin P. Dixon, Christopher T. Martin