Patents by Inventor Kevin P. Dockery
Kevin P. Dockery has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11725116Abstract: A chemical mechanical polishing composition includes a liquid carrier and colloidal silica particles dispersed in the liquid carrier. The colloidal silica particles have a positive charge of at least 10 mV in the liquid carrier and may be characterized as having: (i) a number average aspect ratio of greater than about 1.25 and (ii) a normalized particle size span by weight of greater than about 0.42. The polishing composition may further optionally include an iron-containing accelerator and a tungsten etch inhibitor, for example, when the polishing composition is a tungsten CMP composition.Type: GrantFiled: March 30, 2021Date of Patent: August 15, 2023Assignee: CMC MATERIALS, INC.Inventors: Alexander W. Hains, Kim Long, Steven Grumbine, Roman A. Ivanov, Kevin P. Dockery, Benjamin Petro, Brian Sneed, Galyna Krylova
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Publication number: 20230070776Abstract: A chemical mechanical polishing composition comprises, consists of, or consists essentially of a liquid carrier, anionic particles dispersed in the liquid carrier, an anionic polymer or surfactant, and a cationic polymer.Type: ApplicationFiled: August 25, 2022Publication date: March 9, 2023Inventors: Yang-Yao Lee, Hsin-Yen Wu, Kevin P. Dockery, Na Zhang, Chi-Rung Shie
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Patent number: 11492514Abstract: A composition comprises, consists of, or consists essentially of a polymer including a derivatized amino acid monomer unit. A chemical mechanical polishing composition includes a water based liquid carrier, abrasive particles dispersed in the liquid carrier, and a cationic polymer having a derivatized amino acid monomer unit. A method of chemical mechanical polishing includes utilizing the chemical mechanical polishing composition to remove at least a portion of a metal or dielectric layer from a substrate and thereby polish the substrate.Type: GrantFiled: December 16, 2020Date of Patent: November 8, 2022Assignee: CMC Materials, Inc.Inventors: Na Zhang, David Bailey, Kevin P. Dockery, Roman A. Ivanov, Deepak Shukla
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Patent number: 11043151Abstract: The invention provides a chemical-mechanical polishing composition comprising (a) an abrasive selected from the group consisting of alumina, ceria, titania, zirconia, and combinations thereof, wherein the abrasive is surface-coated with a copolymer comprising a combination of sulfonic acid monomeric units and carboxylic acid monomeric units a combination of sulfonic acid monomeric units and phosphonic acid monomeric units, (b) an oxidizing agent, and (c) water, wherein the polishing composition has a pH of about 2 to about 5. The invention further provides a method of chemically-mechanically polishing a substrate with the inventive chemical-mechanical polishing composition. Typically, the substrate comprises tungsten or cobalt and silicon oxide.Type: GrantFiled: October 3, 2017Date of Patent: June 22, 2021Assignee: CMC Materials, Inc.Inventors: Ji Cui, Helin Huang, Kevin P. Dockery, Pankaj K. Singh, Hung-Tsung Huang, Chih-Hsien Chien
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Patent number: 10676647Abstract: A chemical mechanical polishing composition includes a water based liquid carrier, cationic abrasive particles dispersed in the liquid carrier, a first amino acid compound having an isoelectric point of less than 7 and a second amino acid compound having an isoelectric point of greater than 7. The pH of the composition is in a range from about 1 to about 5. A method for chemical mechanical polishing a substrate including a tungsten layer includes contacting the substrate with the above described polishing composition, moving the polishing composition relative to the substrate, and abrading the substrate to remove a portion of the tungsten from the substrate and thereby polish the substrate.Type: GrantFiled: December 31, 2018Date of Patent: June 9, 2020Assignee: Cabot Microelectronics CorporationInventors: Na Zhang, Kevin P. Dockery, Zhao Liu, Roman A. Ivanov
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Patent number: 10647887Abstract: The invention provides a chemical-mechanical polishing composition comprising a) surface-modified colloidal silica particles, comprising a negatively-charged group on the surface of the particles, wherein the surface-modified colloidal silica particles have a negative charge, a particle size of about 90 nm to about 350 nm, and a zeta potential of about ?5 mV to about ?35 mV at a pH of about 3, b) an iron compound, c) a stabilizing agent, d) a corrosion inhibitor, and e) an aqueous carrier. The invention also provides a method suitable for polishing a substrate.Type: GrantFiled: January 8, 2018Date of Patent: May 12, 2020Assignee: Cabot Microelectronics CorporationInventors: Kevin P. Dockery, Pankaj K. Singh, Steven Grumbine, Kim Long
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Patent number: 10640679Abstract: The invention provides a chemical-mechanical polishing composition containing a ceria abrasive, a polyhydroxy aromatic carboxylic acid, an ionic polymer of formula I: wherein X1 and X2, Z1 and Z2, R1, R2, R3, and R4, and n are as defined herein, and water, wherein the polishing composition has a pH of about 1 to about 4.5. The invention further provides a method of chemically-mechanically polishing a substrate with the inventive chemical-mechanical polishing composition. Typically, the substrate contains silicon oxide, silicon nitride, and/or polysilicon.Type: GrantFiled: October 16, 2017Date of Patent: May 5, 2020Assignee: Cabot Microelectronics CorporationInventors: Sudeep Pallikkara Kuttiatoor, Charles Hamilton, Kevin P. Dockery
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Patent number: 10066126Abstract: Described are compositions (e.g., slurries) useful in methods for chemical-mechanical processing (e.g. polishing or planarizing) a surface of a substrate that contains tungsten, the slurries containing abrasive particles, metal cation catalyst, phosphorus-containing zwitterionic compound, and optional ingredients such as oxidizer; also described are methods and substrates used or processed on combination with the compositions.Type: GrantFiled: January 6, 2016Date of Patent: September 4, 2018Assignee: Cabot Microelectronics CorporationInventors: Kevin P. Dockery, Helin Huang, Matthew Carnes, Glenn Whitener
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Publication number: 20170190936Abstract: Described are compositions (e.g., slurries) useful in methods for chemical-mechanical processing (e.g. polishing or planarizing) a surface of a substrate that contains tungsten, the slurries containing abrasive particles, metal cation catalyst, phosphorus-containing zwitterionic compound, and optional ingredients such as oxidizer; also described are methods and substrates used or processed on combination with the compositions.Type: ApplicationFiled: January 6, 2016Publication date: July 6, 2017Inventors: Kevin P. Dockery, Helin Huang, Matthew Carnes, Glenn Whitener
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Patent number: 8906252Abstract: The invention provides a chemical-mechanical polishing composition containing a ceria abrasive, an ionic polymer of formula I: wherein X1 and X2, Z1 and Z2, R2, R3, and R4, and n are as defined herein, and water, wherein the polishing composition has a pH of about 1 to about 4.5. The invention further provides a method of chemically-mechanically polishing a substrate with the inventive chemical-mechanical polishing composition. Typically, the substrate contains silicon oxide, silicon nitride, and/or polysilicon.Type: GrantFiled: May 21, 2013Date of Patent: December 9, 2014Assignee: Cabot Microelelctronics CorporationInventors: Kevin P. Dockery, Renhe Jia, Jeffrey Dysard
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Publication number: 20140346140Abstract: The invention provides a chemical-mechanical polishing composition containing a ceria abrasive, an ionic polymer of formula I: wherein X1 and X2, Z1 and Z2, R2, R3, and R4, and n are as defined herein, and water, wherein the polishing composition has a pH of about 1 to about 4.5. The invention further provides a method of chemically-mechanically polishing a substrate with the inventive chemical-mechanical polishing composition. Typically, the substrate contains silicon oxide, silicon nitride, and/or polysilicon.Type: ApplicationFiled: May 21, 2013Publication date: November 27, 2014Inventors: Kevin P. Dockery, Renhe Jia, Jeffrey Dysard
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Patent number: 8485654Abstract: An aqueous inkjet printing fluid composition for use in an inkjet printer including a silicon-based material which contacts the aqueous printing fluid composition, having in a concentration sufficient to inhibit corrosion of the silicon-based material when contacted by the aqueous printing fluid composition a soluble metal ligand complex of Formula (I): wherein M represents a divalent or a trivalent metal, R1 and R2 each independently represent alkyl, aryl, or heteroaryl substituents, R3 represents hydrogen, a halide, or an alkyl, aryl, or heteroaryl substituent, and the number of ligands n is 2 or 3. The useful lifetime of microelectromechanical fluidic devices based on silicon fabrication is extended.Type: GrantFiled: October 29, 2010Date of Patent: July 16, 2013Assignee: Eastman Kodak CompanyInventors: Allan F. Sowinski, Kevin P. Dockery
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Patent number: 8459787Abstract: An aqueous inkjet printing fluid composition for use in an inkjet printer having a silicon-based material which contacts the aqueous printing fluid composition, including in a concentration sufficient to inhibit corrosion of the silicon-based material when contacted by the aqueous printing fluid composition a soluble metal ligand complex of Formula (I): wherein M represents a divalent or a trivalent metal, R1 represents a hydrogen, or an alkyl, alkenyl, or aryl substituent, X1 and X2 each independently represent either O or S, Q represents the atoms necessary to form a five, six or seven-membered heterocyclic or carbocyclic ring, and the number of ligands n is 2 or 3. The useful lifetime of microelectromechanical fluidic devices based on silicon fabrication is extended.Type: GrantFiled: October 29, 2010Date of Patent: June 11, 2013Assignee: Eastman Kodak CompanyInventors: Allan F. Sowinski, Kevin P. Dockery
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Patent number: 8419176Abstract: A process for printing inkjet ink and other aqueous compositions through silicon-based microelectromechanical printer structures is disclosed that suppresses the normal dissolution of the silicon device components in contact with the aqueous composition. Inkjet ink and other aqueous compositions used in the process contain the soluble salts of organic aromatic azo compounds in sufficient concentrations to inhibit silicon corrosion. The useful lifetime of microelectromechanical fluidic devices based on silicon fabrication is extended.Type: GrantFiled: May 29, 2009Date of Patent: April 16, 2013Assignee: Eastman Kodak CompanyInventors: Kevin P. Dockery, Allan F. Sowinski, Barbara B. Lussier, Mihaela L. Madaras, Kurt D. Sieber, Hwei-Ling Yau
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Publication number: 20120105553Abstract: An aqueous inkjet printing fluid composition for use in an inkjet printer comprising a silicon-based material which contacts the aqueous printing fluid composition, comprising in a concentration sufficient to inhibit corrosion of the silicon-based material when contacted by the aqueous printing fluid composition a soluble metal ligand complex of Formula (I): wherein M represents a divalent or a trivalent metal, R1 represents a hydrogen, or an alkyl, alkenyl, or aryl substituent, X1 and X2 each independently represent either O or S, Q represents the atoms necessary to form a five, six or seven-membered heterocyclic or carbocyclic ring, and the number of ligands n is 2 or 3. The useful lifetime of microelectromechanical fluidic devices based on silicon fabrication is extended.Type: ApplicationFiled: October 29, 2010Publication date: May 3, 2012Inventors: Allan F. Sowinski, Kevin P. Dockery
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Publication number: 20120105535Abstract: An aqueous inkjet printing fluid composition for use in an inkjet printer comprising a silicon-based material which contacts the aqueous printing fluid composition, comprising in a concentration sufficient to inhibit corrosion of the silicon-based material when contacted by the aqueous printing fluid composition a soluble metal ligand complex of Formula (I): wherein M represents a divalent or a trivalent metal, R1 and R2 each independently represent alkyl, aryl, or heteroaryl substituents, R3 represents hydrogen, a halide, or an alkyl, aryl, or heteroaryl substituent, and the number of ligands n is 2 or 3. The useful lifetime of microelectromechanical fluidic devices based on silicon fabrication is extended.Type: ApplicationFiled: October 29, 2010Publication date: May 3, 2012Inventors: Allan F. Sowinski, Kevin P. Dockery
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Publication number: 20100302292Abstract: A process for printing inkjet ink and other aqueous compositions through silicon-based microelectromechanical printer structures is disclosed that suppresses the normal dissolution of the silicon device components in contact with the aqueous composition. Inkjet ink and other aqueous compositions used in the process contain the soluble salts of organic aromatic azo compounds in sufficient concentrations to inhibit silicon corrosion. The useful lifetime of microelectromechanical fluidic devices based on silicon fabrication is extended.Type: ApplicationFiled: May 29, 2009Publication date: December 2, 2010Inventors: Kevin P. Dockery, Allan F. Sowinski, Barbara B. Lussier, Mihaela L. Madaras, Kurt D. Sieber, Hwei-Ling Yau
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Publication number: 20090065478Abstract: Measuring thickness and the rate of change of thickness of a material having a surface while the material is being etched, comprising: illuminating the material with low coherence light, a portion of the which transmits through the material and a portion of which is reflected; etching the material surface and while etching, collecting a portion of the reflected light from each optical interface of the material with a low coherence light interferometer; calculating the thickness and rate of change of thickness of the material or part of the material according to the obtained interferometric data; and storing or displaying the resultant thickness and rate of change of thickness of the material. The present invention provides a unique way of calculating the thermo optic coefficient of a material. This method can be used simultaneously with etching the material so that changes to the etching rate can be made in real time.Type: ApplicationFiled: September 11, 2007Publication date: March 12, 2009Inventors: Kevin P. Dockery, Michael A. Marcus, Kurt D. Sieber
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Patent number: 7368624Abstract: A process for forming an aryl-aryl bond comprises the step of reacting an arene hydrocarbon compound with either (1) an organic oxidant selected from the group consisting of a quinone, a quinone imine, a quinone diimine, and a nitroarene, or (2) an oxidizing salt selected from the group consisting of a triarylaminium salt, an oxonium salt, and a nitrosium salt, or (3) a hypervalent iodine compound, each in the presence of a Brönsted or Lewis acid.Type: GrantFiled: March 30, 2004Date of Patent: May 6, 2008Assignee: Eastman Kodak CompanyInventors: Christopher T. Brown, Deepak Shukla, Kevin P. Dockery, Jerome R. Lenhard, James R. Matz
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Patent number: 7153896Abstract: An element for the attachment of protein arrays, the element comprising a surface to which are attached a plurality of piperazine functional groups wherein the piperazine functional groups are represented by Formula I: where R1, R2, R3, R4, R5, R6, R7, R8, R9, R10, are hydrogen, alkyl, alkenyl, alkynyl, alkylhalo, cycloalkyl, cycloalkenyl, alkylthio, alkoxy, with the proviso that at least one of R1 to R10 be a non-labile chemical unit that attaches the piperazine functional group to the surface of the element.Type: GrantFiled: November 14, 2003Date of Patent: December 26, 2006Assignee: Eastman Kodak CompanyInventors: Kevin P. Dockery, David M. Teegarden, Tiecheng A. Qiao, Brian J. Antalek, Susan Power