Patents by Inventor Kevin P. Unger

Kevin P. Unger has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for producing an electronic package possessing controlled impedance characteristics
    Patent number: 6845557
    Abstract: A method for creating an impedance controlled printing wiring board, particularly the formation of a structure for high speed printed wiring boards incorporating multiple differential impedance controlled layers. Furthermore, disclosed is the provision of a method for producing an impedance controlled printed circuit wiring board. Also, there is the provision of a method for producing high speed printed wiring boards with multiple differential impedance controlled layers.
    Type: Grant
    Filed: August 22, 2002
    Date of Patent: January 25, 2005
    Assignee: International Business Machines Corporation
    Inventors: Thomas R. Miller, William J. Rudik, Robert J. Testa, Kevin P. Unger, Michael Wozniak
  • Structure for high speed printed wiring boards with multiple differential impedance-controlled layers
    Publication number: 20020189094
    Abstract: A method for creating an impedance controlled printing wiring board, particularly the formation of a structure for high speed printed wiring boards incorporating multiple differential impedance controlled layers. Furthermore, disclosed is the provision of a method for producing an impedance controlled printed circuit wiring board. Also, there is the provision of a method for producing high speed printed wiring boards with multiple differential impedance controlled layers.
    Type: Application
    Filed: August 22, 2002
    Publication date: December 19, 2002
    Applicant: International Business Machines Corporation
    Inventors: Thomas R. Miller, William J. Rudik, Robert J. Testa, Kevin P. Unger, Michael Wozniak
  • Structure for high speed printed wiring boards with multiple differential impedance-controlled layers
    Patent number: 6469256
    Abstract: A method for creating an impedance controlled printing wiring board, particularly the formation of a structure for high speed printed wiring boards incorporating multiple differential impedance controlled layers. Furthermore, disclosed is the provision of a method for producing an impedance controlled printed circuit wiring board. Also, there is the provision of a method for producing high speed printed wiring boards with multiple differential impedance controlled layers.
    Type: Grant
    Filed: February 1, 2000
    Date of Patent: October 22, 2002
    Assignee: International Business Machines Corporation
    Inventors: Thomas R. Miller, William J. Rudik, Robert J. Testa, Kevin P. Unger, Michael Wozniak
  • Chemical pre-treatment and biological destruction of propylene carbonate waste streams effluent streams to reduce the biological oxygen demand thereof
    Patent number: 5275734
    Abstract: Disclosed is a method of treating a process stream from a process producing a non-biodegradable alkylene carbonate stream. The alkylene carbonate is hydrolyzed in a strong, aqueous, alkaline solution to form an aqueous alkaline solution of the corresponding alkylene glycol. This solution is then acidified to a pH of about 8 to 8.5. The acidified solution is aerated in activated sludge to reduce the biological oxugen demand (BOD) of the solution.
    Type: Grant
    Filed: August 4, 1992
    Date of Patent: January 4, 1994
    Assignee: International Business Machines Corporation
    Inventors: James A. Shurtleff, Kevin P. Unger