Patents by Inventor Kevin Patrick Caffey

Kevin Patrick Caffey has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Stacked redistribution layers on die
    Patent number: 9171782
    Abstract: Some implementations provide a semiconductor device (e.g., die) that includes a substrate, several metal layers and dielectric layers coupled to the substrate, a pad coupled to one of the plurality of metal layers, a first metal redistribution layer coupled to the pad, and a second metal redistribution layer coupled to the first metal redistribution layer. The second metal redistribution layer includes a cobalt tungsten phosphorous material. In some implementations, the first metal redistribution layer is a copper layer. In some implementations, the semiconductor device further includes a first underbump metallization (UBM) layer and a second underbump metallization (UBM) layer.
    Type: Grant
    Filed: August 6, 2013
    Date of Patent: October 27, 2015
    Assignee: QUALCOMM Incorporated
    Inventors: Christine Sung-An Hau-Riege, You-Wen Yau, Kevin Patrick Caffey, Lizabeth Ann Keser, Gene Hyde McAllister, Reynante Tamunan Alvarado, Steve Joseph Bezuk, Damion Bryan Gastelum
  • STACKED REDISTRIBUTION LAYERS ON DIE
    Publication number: 20150041982
    Abstract: Some implementations provide a semiconductor device (e.g., die) that includes a substrate, several metal layers and dielectric layers coupled to the substrate, a pad coupled to one of the plurality of metal layers, a first metal redistribution layer coupled to the pad, and a second metal redistribution layer coupled to the first metal redistribution layer. The second metal redistribution layer includes a cobalt tungsten phosphorous material. In some implementations, the first metal redistribution layer is a copper layer. In some implementations, the semiconductor device further includes a first underbump metallization (UBM) layer and a second underbump metallization (UBM) layer.
    Type: Application
    Filed: August 6, 2013
    Publication date: February 12, 2015
    Applicant: QUALCOMM Incorporated
    Inventors: Christine Sung-An Hau-Riege, You-Wen Yau, Kevin Patrick Caffey, Lizabeth Ann Keser, Gene H. McAllister, Reynante Tamunan Alvarado, Steve J. Bezuk, Damion Bryan Gastelum