Abstract: Disclosed herein are system and method embodiments for a cooling system. For example, the cooling system includes a chassis that defines a cavity. A circuit board assembly is disposed in the cavity and comprises electronics that generate heat during operation. A heat sink is coupled to the electronics and is configured to engage an inner surface of the chassis. A fan is configured to direct air across the heat sink. An external cooling subsystem is mounted to at least one external surface of the chassis. The external cooling subsystem is in thermal communication with the circuit board assembly through the heat sink for transferring heat generated by the electronics.