Patents by Inventor Kevin Peck

Kevin Peck has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11981517
    Abstract: A robotic line kitting system is disclosed. In various embodiments, a signal associated with an unsafe condition is received via a communication interface. In response to the signal, a controlled operation to reduce a speed of movement of a robotic instrumentality is performed prior to a safety stop of the robotic instrumentality being triggered.
    Type: Grant
    Filed: March 30, 2021
    Date of Patent: May 14, 2024
    Assignee: Dexterity, Inc.
    Inventors: Zhouwen Sun, Cuthbert Sun, Andrew Nguyen, Samuel Tay, Emilie Peck, Kevin Jose Chavez, Robert Holmberg
  • Publication number: 20240140731
    Abstract: Data indicating a corresponding safety state information indicating an extent to which that operating zone currently is or is not available to the robotic system to perform tasks using one or more robotic instrumentalities associated with a robotic system is used, for each of a plurality of operating zones, to dynamically schedule and perform tasks associated with a higher level objective. The corresponding safety state information associated with the first operating zone indicating one of a plurality of safety states associated with a presence of a human worker in the first operating zone is received from one or more sensors associated with a first operating zone of the plurality of operating zones. Autonomous behavior of the one or more robotic instrumentalities is altered based on the one of the plurality of safety states associated with the presence of the human worker in the first operating zone indicated by the corresponding safety state information.
    Type: Application
    Filed: January 8, 2024
    Publication date: May 2, 2024
    Inventors: Zhouwen Sun, Cuthbert Sun, Andrew Nguyen, Samuel Tay, Emilie Peck, Kevin Jose Chavez, Robert Holmberg
  • Publication number: 20230334280
    Abstract: Systems and methods include an asset tracking platform for tracking, analyzing, and managing facility assets at an operational facility site. The asset tracking platform includes a site operator device in local communication with a field device. The facility assets are assigned to physical asset tags using an assignment procedure that includes scanning the physical asset tag with the field device (e.g., using a radio-frequency identifier (RFID) sensor) to associate an identifier of the physical asset tag with asset data (e.g., location data, an asset identifier, an asset type, etc.). The field device downloads an asset task list using the local communication to represent a list of daily tasks to be completed with the field device. Task execution procedures are performed for the list of daily tasks by scanning the physical asset tag with the field device which starts a timer. Task completion data is synced with the site operator device.
    Type: Application
    Filed: April 15, 2022
    Publication date: October 19, 2023
    Inventors: Meraj Mohebi, Kevin Peck
  • Patent number: 10837703
    Abstract: A thermal process device for heat treating a product or plurality of products includes a thermal processing chamber having opposed distal ends and at least one controllable heating zone. At least one buffer zone disposed is at each of the distal ends, the buffer zones and at least one heating zone of the thermal processing chamber forming a heating element assembly having an inner and outer surface. At least one layer of insulating material is disposed along the at least one buffer and heating zones of the thermal processing chamber and forming part of the heating element assembly, the at least one layer of insulating material having a controlled efficiency being applied non-uniformly across an axial length of the heating assembly.
    Type: Grant
    Filed: August 5, 2017
    Date of Patent: November 17, 2020
    Assignee: Sandvik Thermal Process Inc.
    Inventor: Kevin Peck
  • Patent number: 10453714
    Abstract: A thermal process device for heat treating a product or plurality of products includes a thermal processing chamber having opposed distal ends and a plurality of controllable heating zones. At least one buffer zone is disposed at each of the distal ends. The buffer zones and heating zones of the thermal processing chamber form a heating element assembly. The heating assembly has an inner and outer surface and a secondary shell is disposed about the outer surface of the heating element assembly and spaced therefrom to form an inlet flow passage for a flow of a temperature adjusting medium along the heating element assembly.
    Type: Grant
    Filed: August 5, 2017
    Date of Patent: October 22, 2019
    Assignee: SANDVIK THERMAL PROCESS, INC.
    Inventor: Kevin Peck
  • Publication number: 20180130680
    Abstract: A thermal process device for heat treating a product or plurality of products includes a thermal processing chamber having opposed distal ends and a plurality of controllable heating zones. At least one buffer zone is disposed at each of the distal ends. The buffer zones and heating zones of the thermal processing chamber form a heating element assembly. The heating assembly has an inner and outer surface and a secondary shell is disposed about the outer surface of the heating element assembly and spaced therefrom to form an inlet flow passage for a flow of a temperature adjusting medium along the heating element assembly.
    Type: Application
    Filed: August 5, 2017
    Publication date: May 10, 2018
    Inventor: Kevin PECK
  • Publication number: 20180038649
    Abstract: A thermal process device for heat treating a product or plurality of products includes a thermal processing chamber having opposed distal ends and at least one controllable heating zone. At least one buffer zone disposed is at each of the distal ends, the buffer zones and at least one heating zone of the thermal processing chamber forming a heating element assembly having an inner and outer surface. At least one layer of insulating material is disposed along the at least one buffer and heating zones of the thermal processing chamber and forming part of the heating element assembly, the at least one layer of insulating material having a controlled efficiency being applied non-uniformly across an axial length of the heating assembly.
    Type: Application
    Filed: August 5, 2017
    Publication date: February 8, 2018
    Inventor: Kevin PECK
  • Patent number: 7368832
    Abstract: A circuit is provided that provides for the same power characteristics to an assembly of electrical resistive elements wired in parallel as to the assembly as wired in series. An input power source provides electrical resistive power to a plurality of load elements, wherein the plurality of load elements are connected in parallel to each other. A plurality of power splitters divide the power source into separate and equal power subsources such that there is one power splitter and one power subsource for each load element, wherein the power provided to each of the plurality of load elements is equal to the power of the electrical power source. Redundancy and fault tolerance is provided to the circuitry by permitting remaining load elements to continue to operate should one or more load elements fail.
    Type: Grant
    Filed: September 29, 2003
    Date of Patent: May 6, 2008
    Assignee: MRL Industries
    Inventors: Kevin Peck, Ronald D. VanOrden, Noel H. Johnson, Thomas J. Berdner, Robin H. Slater
  • Publication number: 20070039938
    Abstract: An arrangement of a heating element into divided zones of intermingled groups is provided. The heating element arranged circumferentially about an exterior of a heating zone of a furnace, in combination with a fault tolerant circuit that provides for the same power characteristics to an assembly of electrical resistive elements wired in parallel as to the assembly as wired in series is also provided. Redundancy and fault tolerance is provided to a heating process using the combination because the circuitry permits remaining load elements to continue to operate should one or more load elements fail and the intermingled arrangement maintains a balanced application of heat.
    Type: Application
    Filed: August 18, 2006
    Publication date: February 22, 2007
    Inventors: Kevin Peck, Pontus Nilsson
  • Publication number: 20070029305
    Abstract: Heating element assemblies, heating furnaces incorporating heating element assemblies, methods to form heating element assemblies, methods to form heating furnaces and methods to reduce a magnetic field in a bifilar coil are disclosed. The heating element assembly includes two components, each component formed from heating element wire. The two components are spatially positioned and electrically arranged, relative to each other, so that an electrical current applied to the heating element assembly simultaneously travels through the two components in opposite directions.
    Type: Application
    Filed: May 31, 2006
    Publication date: February 8, 2007
    Inventors: Kevin Peck, Noel Johnson, Jim Sanches, Pontus Nilsson
  • Publication number: 20040130920
    Abstract: A circuit is provided that provides for the same power characteristics to an assembly of electrical resistive elements wired in parallel as to the assembly as wired in series. An input power source provides electrical resistive power to a plurality of load elements, wherein the plurality of load elements are connected in parallel to each other. A plurality of power splitters divide the power source into separate and equal power subsources such that there is one power splitter and one power subsource for each load element, wherein the power provided to each of the plurality of load elements is equal to the power of the electrical power source. Redundancy and fault tolerance is provided to the circuitry by permitting remaining load elements to continue to operate should one or more load elements fail.
    Type: Application
    Filed: September 29, 2003
    Publication date: July 8, 2004
    Inventors: Kevin Peck, Ronald D. VanOrden, Noel H. Johnson, Thomas J. Berdner, Robin H. Slater
  • Patent number: 5904478
    Abstract: A vertically oriented thermal processor for processing batches of semiconductor wafers held within a processing chamber. The processing chamber is contained within a processing vessel. A furnace liner surrounds the processing vessel in spaced relationship. A flow path for cooling fluid is supplied between the furnace liner and an inner wall of the furnace heater. The flow occurs through end and base segments forming part of the furnace heating enclosure. The end and base segments have interior ports which communicate with a manifold chamber. The manifold chamber is advantageously divided into inner and outer chambers by shields which reflect radiant heat. The inner and outer manifold chambers are connected by manifold connecting passages formed between the shields.
    Type: Grant
    Filed: March 7, 1997
    Date of Patent: May 18, 1999
    Assignee: Semitool, Inc.
    Inventors: Robert A. Weaver, William McEntire, Kevin Peck