Abstract: Multi-layer forms and methods of producing the same are disclosed. An example apparatus includes means for moving a first substrate in a direction; means for applying adhesive to a first portion of a first side of the first substrate; means for mating a second substrate with the first portion; means for applying adhesive to a third portion of a second side of the first substrate; means for folding the first substrate about a first fold line to couple the third portion to a fourth portion of the second side; means for applying adhesive to a first sub-portion of a second portion of the first side; and means for folding the first substrate and the second substrate about a second fold line to couple a face of the first sub-portion and a face of a second sub-portion of the second portion and to position the first substrate between the second substrate.

Abstract: Multi-layer forms and methods of producing the same are disclosed herein. An example apparatus includes a first substrate first layer having a first side and a second side. The apparatus includes a second substrate first layer having a third side and a fourth side. The second side is coupled to the third side. The first substrate first layer and the second substrate first layer are embossed. The apparatus includes a second substrate second layer having a fifth side and a sixth side, the fourth side coupled to the fifth side. The apparatus includes a second substrate first layer having a seventh side and an eighth side. The seventh side is coupled to the sixth side. The second substrate first layer and the second substrate second layer are not embossed.

Abstract: Multi-layer forms and methods of producing the same are disclosed herein. An example apparatus includes a first substrate first layer having a first side and a second side. The apparatus includes a second substrate first layer having a third side and a fourth side. The second side is coupled to the third side. The first substrate first layer and the second substrate first layer are embossed. The apparatus includes a second substrate second layer having a fifth side and a sixth side, the fourth side coupled to the fifth side. The apparatus includes a second substrate first layer having a seventh side and an eighth side. The seventh side is coupled to the sixth side. The second substrate first layer and the second substrate second layer are not embossed.