Patents by Inventor Kevin R. Aufderhar

Kevin R. Aufderhar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090208816
    Abstract: An electrode in an electrochemical cell for an implantable medical device is presented. The electrode includes a plurality of electrode plates. Each electrode plate includes a tab extending therefrom. The tab is shaped in a H-shape, a T-shape, a Y-shape, and a L-shape.
    Type: Application
    Filed: January 31, 2008
    Publication date: August 20, 2009
    Inventors: Joseph J. Viavattine, Kevin R. Aufderhar
  • Publication number: 20090197180
    Abstract: A battery (or cell) in an implantable medical device is presented. The cell includes a first electrode element with a first tab extending therefrom and a second electrode element with a second tab extending therefrom. A spacer is coupled to the first and second tabs.
    Type: Application
    Filed: January 31, 2008
    Publication date: August 6, 2009
    Inventors: Joseph J. Viavattine, Kevin R. Aufderhar, Paul B. Aamodt, Hailiang Zhao
  • Patent number: 5233152
    Abstract: A robotic laser soldering apparatus for automated assembly of microscopic components which is capable of acquiring, orienting, and soldering very small electrical components, such as gallium arsenide (GaAs) beam lead diodes, to a circuit board having a soft substrate. The apparatus includes a vacuum pickup means for picking up and holding the diode, pattern recognition means for determining the proper positioning of the diode on the circuit board, and a laser for soldering the diode leads.
    Type: Grant
    Filed: April 1, 1991
    Date of Patent: August 3, 1993
    Assignee: Honeywell Inc.
    Inventors: Steve A. Prokosch, Kevin R. Aufderhar
  • Patent number: 5023426
    Abstract: A robotic laser soldering apparatus for automated assembly of microscopic components which is capable of acquiring, orienting, and soldering very small electrical components, such as gallium arsenide (GaAs) beam lead diodes, to a circuit board having a soft substrate. The apparatus includes a vacuum pickup means for picking up and holding the diode, pattern recognition means for determining the proper positioning of the diode on the circuit board, and a laser for soldering the diode leads.
    Type: Grant
    Filed: June 21, 1989
    Date of Patent: June 11, 1991
    Assignee: Honeywell Inc.
    Inventors: Steve A. Prokosch, Kevin R. Aufderhar