Abstract: An automated electronic module inspection system having illumination sources that produce digitized gray scale images that are then analyzed by a computer. The inspection system illuminates the module including solder joints, components and printed circuit board using a sequence of illumination that produce visual images which are used to identify defects. The inspection system inspects for all defects as specified in MIL-STD-2000A (Section 4.4) by using both surface reflectance properties as well as topological properties of objects. The system comprises two video cameras. A positioning table aligns a module-under-test with the optical axis of each camera thereby enabling the same field-of-view to be observed under different lighting conditions. A dark field illumination associated with a first camera preferentially illuminates non-flat surfaces, but not vertical surfaces. A bright field illumination associated with a second camera preferentially illuminates relatively flat surfaces.

Abstract: A method for simultaneously soldering the two solder covered ends of an electronic chip component to respective conductor pads. Pulsed coherent laser radiation having a predetermined energy profile is separated into two spacially separate beams and they are respectively directed toward the opposing ends of the chip to reflow the solder.