Abstract: A semiconductor burn-in board configured for insertion into a chamber of a semiconductor burn-in machine includes a power regulator board and a testing board. The power regulator board includes a main power connector configured to receive main power from a semiconductor burn-in machine, a plurality of power supplies each configured to receive the main power from the main power connector and convert the main power to test power, and a pair of test power connectors for each power supply. The testing board is attached to the power regulator board and includes a plurality of device testing units. Each device testing unit is configured to receive the test power from at least one of the power supplies through at least one pair of the test power connectors and apply test signals to a semiconductor device received in the device testing unit.

Abstract: A burn-in system includes a testing stage configured to stress test one an integrated circuit and a power stage having a voltage control mode and a current control mode. The power stage is configured to supply power to the testing stage. One embodiment of the power stage includes a pulse width modulator, a current control circuit and a voltage control circuit. The pulse width modulator is configured to generate a modulated power output that is coupled to the testing stage. The current control circuit is configured to produce a current error output signal that is based on a difference between a measured load current, which is indicative of the current that is supplied to the testing stage by the modulated power output, and target load current.