Abstract: A powered handle for a surgical stapler can have a drive system including an electric motor. The powered handle can include a manual articulation mechanism to articulate a jaw assembly coupled to a reload shaft connected to the handle. The manual articulation mechanism can include a ball screw mechanism that translates an articulation member responsive to rotation of an articulation knob when an instrument shaft is engaged with the handle. The articulation mechanism includes a release function that allows the jaw assembly to return to a longitudinally centered orientation. The powered handle includes a battery pack serving as a power supply for the drive system. A control system can control actuation of the motor based on user inputs and operating parameters of the stapler and can provide certain motor drive profiles for predetermined positions of the stapler. The powered handle can include a manual return mechanism.

Abstract: An ultra-wide band (UWB) radio frequency (RF)/optical aperture includes a substrate having a plurality of regions. The plurality of regions may have varying characteristics and properties. In some embodiments, the plurality of regions includes a first region having a first relative dielectric constant and being transparent to signals having a frequency in a first frequency range, a second region contained in the first region and having a second relative dielectric constant and being transparent to signals having a frequency in a second frequency range, and a third region contained within the second region and having a third relative dielectric constant and being transparent to signals having a frequency in a third frequency range.

Abstract: A radio frequency (RF) module having a plurality of channels includes a heat sink having at least one tapered edge; a substrate disposed over a surface of the heat sink such that the tapered edge of the heat sink extends past a boundary of the substrate. RF, logic and power circuitry is disposed on the substrate and one or more RF signal ports are formed on an edge of the substrate to allow the RF module to be used in an array antenna having a brick architecture. The tapered edge heat sink provides both a ground plane for RF signal components and a thermal path for heat generating circuits disposed in the substrate.

Abstract: An ultra-wide band (UWB) radio frequency (RF)/optical aperture includes a substrate having a plurality of regions. The plurality of regions may have varying characteristics and properties. In some embodiments, the plurality of regions includes a first region having a first relative dielectric constant and being transparent to signals having a frequency in a first frequency range, a second region contained in the first region and having a second relative dielectric constant and being transparent to signals having a frequency in a second frequency range, and a third region contained within the second region and having a third relative dielectric constant and being transparent to signals having a frequency in a third frequency range.

Abstract: A radio frequency (RF) module having a plurality of channels includes a heat sink having at least one tapered edge; a substrate disposed over a surface of the heat sink such that the tapered edge of the heat sink extends past a boundary of the substrate. RF, logic and power circuitry is disposed on the substrate and one or more RF signal ports are formed on an edge of the substrate to allow the RF module to be used in an array antenna having a brick architecture. The tapered edge heat sink provides both a ground plane for RF signal components and a thermal path for heat generating circuits disposed in the substrate.

Abstract: Methods and apparatus for compact active cooling for missile applications generally comprise a circuit card assembly level closed loop fluid filled cooling system for cooling high power components such as microprocessors. The present invention utilizes a cooling system constrained to a single circuit card assembly providing for a drop in replacement for current passively cooled circuit card assemblies.

Abstract: Methods and apparatus for compact active cooling for missile applications generally comprise a circuit card assembly level closed loop fluid filled cooling system for cooling high power components such as microprocessors. The present invention utilizes a cooling system constrained to a single circuit card assembly providing for a drop in replacement for current passively cooled circuit card assemblies.

Abstract: A cooling device for cooling a cooled surface includes a manifold having a number of inlet slots for directing fluid into an enclosed volume or chamber, toward the cooled surface. The manifold has a number of exit ports for receiving the fluid from the enclosed volume or chamber after it has impinged upon the cooled surface. The inlet slots and exit ports may be rectangular, or may be otherwise elongated, so as to provide substantially spatially uniform heat removal from the cooled surface. The cooling device may be used for a wide variety of applications, for example for cooling small devices such as integrated circuits or other devices involving electronics.