Abstract: Thermal protection close-outs are disclosed. A disclosed example thermal protection close-out includes a ring defining an aperture extending therethrough, an outer layer of the ring including a fabric sleeving, and an inner layer of the ring including insulation, the outer layer enclosing the inner layer.

Abstract: Provided are stacks including CMC structures and capping layers deposited on surfaces of these CMC structures. Also provided are methods for hermetically sealing the surfaces of the CMC structures with the capping layers. These stacks may be used to construct walls of radomes that enclose antennas and other equipment of aerospace vehicles. The capping layers may form smooth external surfaces of the radomes and may hermetically seal the underlying CMC structures. The dielectric properties of these stacks may be configured to minimize interference with operations of the antennas and other equipment deposited within the radome.

Abstract: Provided are stacks including CMC structures and capping layers deposited on surfaces of these CMC structures. Also provided are methods for hermetically sealing the surfaces of the CMC structures with the capping layers. These stacks may be used to construct walls of radomes that enclose antennas and other equipment of aerospace vehicles. The capping layers may form smooth external surfaces of the radomes and may hermetically seal the underlying CMC structures. The dielectric properties of these stacks may be configured to minimize interference with operations of the antennas and other equipment deposited within the radome.

Abstract: Provided are methods for hermetically sealing the surfaces of the CMC structures with the capping layers, comprising depositing a slurry onto the surface of a CMC structure and treating the CMC structure with the deposited slurry in an oxygen containing environment, thereby forming a stack. These stacks may be used to construct walls of radomes that enclose antennas and other equipment of aerospace vehicles. The capping layers may form smooth external surfaces of the radomes and may hermetically seal the underlying CMC structures. The dielectric properties of these stacks may be configured to minimize interference with operations of the antennas and other equipment deposited within the radome.

Abstract: Provided are stacks including CMC structures and capping layers deposited on surfaces of these CMC structures. Also provided are methods for hermetically sealing the surfaces of the CMC structures with the capping layers. These stacks may be used to construct walls of radomes that enclose antennas and other equipment of aerospace vehicles. The capping layers may form smooth external surfaces of the radomes and may hermetically seal the underlying CMC structures. The dielectric properties of these stacks may be configured to minimize interference with operations of the antennas and other equipment deposited within the radome.

Abstract: Provided are stacks including CMC structures and capping layers deposited on surfaces of these CMC structures. Also provided are methods for hermetically sealing the surfaces of the CMC structures with the capping layers. These stacks may be used to construct walls of radomes that enclose antennas and other equipment of aerospace vehicles. The capping layers may form smooth external surfaces of the radomes and may hermetically seal the underlying CMC structures. The dielectric properties of these stacks may be configured to minimize interference with operations of the antennas and other equipment deposited within the radome.