Abstract: An enclosure arrangement includes a chassis, and a central electronics complex. The central electronics complex has a cage removably positioned within the chassis. The cage has an open top providing access into the interior of the cage. The central electronics complex also includes a backplane arranged in a horizontal position, and forming a floor of the cage. The backplane has at least one card slot on a surface thereof. The central electronics complex further includes at least one circuit board disposed in the interior of the cage and being removably received by the card slot. The circuit board is arranged in a vertical position so that a gravitational force helps retain the circuit board in the card slot. The cage is removably positioned within the chassis. At least one rail connects the cage to the chassis. The cage is disposed on the rail, and is guidable into the chassis using the rail.

Abstract: An interface includes an enclosure having a plurality of walls interconnected to form a parallelepiped having a space therein. The enclosure is positionable to occupy a plurality of slots located in a computer housing of a first type computer. The enclosure has a width corresponding essentially to a total width of the plurality of slots. The interface further includes a computer subsystem of a second type computer disposed within the space of the enclosure. The computer subsystem includes a circuit card, and a distribution card attached to, and electrically coupled with, the circuit card. The distribution card is connectable to a backplane of the first type computer located external to the enclosure and within the computer housing.

Abstract: A computer arrangement includes an electronics enclosure located within a computer housing, which is divided into a plurality of physically separated cooling zones. The enclosure has a plurality of inlet and outlet openings. Each cooling zone is in registration with respective inlet and outlet openings. A backplane is disposed within the electronics enclosure, and has front and rear surfaces. A first electrical component is attached to one of the surfaces and is arranged in one of the cooling zones. At least one circuit board is disposed within the electronics enclosure and is attached to the front surface of the backplane. The circuit board has a second electrical component attached to a surface thereof, which is arranged in another one of the cooling zones. A system operation card is disposed within the electronics enclosure, and is attached to the rear surface of the backplane.