Abstract: A method for making forming a semiconductor package comprises forming a plurality of alignment marks in or on a carrier substrate; positioning and bonding a plurality of semiconductor dies to the carrier substrate based on the plurality of alignment marks; further processing the plurality of semiconductor dies into a reconstituted wafer; and decoupling the reconstituted wafer from the carrier substrate at an interface using a laser source. The alignment marks are interposed between the interface and the laser source.

Abstract: In an automated defect detection and classification system, one or more computing devices access scan data acquired in an ultrasonic scan of an object. A first input feature map, including a two-dimensional (2D) scan image, is built from the scan data and input to a first deep neural network to generate a first output feature map. A second input feature map, including an image of a defect-free object, is input to a second deep neural network, having the same structure and weight values as first deep neural network, to produce a second output feature map. The scanned object is determined to contain a defect when a distance between first and second output feature maps is large. In an alternative approach, the 2D scan image and one or more images of the defect-free object are input to different channels of neural network trained using color images.

Abstract: The present disclosure generally relates to emitting organic molecules, including but not limited to, pyrazoles such as 2-phenyl-2H-pyrazol-3-yl acetate, etc. In some cases, the molecules are able to emit in blue or green wavelengths. In some aspects, such molecules may be used in organic light emitting diodes. In certain embodiments, the molecules may comprise one or more bridge moieties and one or more chromophores. In some embodiments, these molecules can be used as electroluminescent media in devices requiring light emission as a function of applied voltage. Other embodiments of the disclosure are generally directed to systems and devices using such molecules, methods of using such molecules, e.g., to control the emission of light, kits involving such molecules, or the like.

Abstract: A method of forming a bonded wafer, where the method includes receiving a first wafer including a first surface characteristic and a second wafer including a second surface characteristic; based on the first surface characteristic, performing a first location specific processing on the first wafer to obtain a first surface-to-be-bonded including a third surface characteristic; and bonding the first surface-to-be-bonded of the first wafer with the second wafer.

Abstract: In a method and apparatus for automated inspection, an image is acquired of an object under inspection and a difference image is generated showing the difference between the acquired image and a reference image of a defect-free object of the same type. Characteristics of the difference image, or detected isolated regions of the difference image, are passed to an automated defect classifier to classify defects in the object under inspection. The characteristics of the difference image may be pixels of the difference image or features determined therefrom. The features may be extracted using a neural network, for example. The automated defect classifier is trained using difference images and may be further trained, in operation, based on operator classifications and using simulated images of defects identified by an operator.

Abstract: A photonic integrated circuit (PIC) device includes a first PIC die including a first plurality of contact pads, each first contact pad includes a first electrical contact region including a first plurality of electrical contacts, a first optical contact region, and a first transition region disposed between the first electrical contact region and the first optical contact region, the first transition region includes a first plurality of dummy contacts.

Abstract: The present disclosure generally relates to emitting organic molecules, including but not limited to, thiazoles such as 1,3-thiazoles, 4-methyl-1,3-thiazoles, etc. In some cases, the molecules are able to emit in blue or green wavelengths. In some aspects, such molecules may be used in organic light emitting diodes. In certain embodiments, the molecules may comprise one or more bridge moieties and one or more chromophores in certain cases. In some embodiments, these molecules can be used as electroluminescent media in devices requiring light emission as a function of applied voltage. Other embodiments of the disclosure are generally directed to systems and devices using such molecules, methods of using such molecules, e.g., to control the emission of light, kits involving such molecules, or the like.

Abstract: A method for fabricating a photonic integrated circuit (PIC), where the method includes providing a first PIC die including a first optical component covered by a first dielectric layer; performing a location specific ion beam planarizing of the first dielectric layer to form a first planarized surface; providing a second PIC die including a second optical component covered by a second dielectric layer; performing a planarizing of the second dielectric layer to form a second planarized surface; and bonding the first planarized surface of the first PIC die to the second planarized surface of the second PIC die to form a three dimensional (3D) stacked PIC die.

Abstract: A method of producing a particle coating on one or more items is provided. The method comprises mixing a supercritical fluid with a solution comprising dissolved material for forming particles. The method further comprises spraying the mixture into a precipitation chamber (316) to precipitate particles, wherein the chamber is at a pressure below a supercritical pressure of the supercritical fluid. The method comprises conveying items to be coated from an inlet of the chamber to an outlet of the chamber. The method also comprises capturing the precipitated particles on items within the chamber.

Abstract: A method of producing a particle coating on one or more items is provided. The method comprises mixing supercritical carbon dioxide with a solution comprising dissolved material for forming particles. The method further comprises spraying the mixture into a precipitation chamber (316) to precipitate particles, wherein the chamber is at a pressure below a supercritical pressure of the supercritical fluid. The method also comprises capturing the precipitated particles on one or more items located within the chamber.

Abstract: A catheter may include an elongate body including a proximal portion including a proximal end, and a distal tip portion. The distal tip portion may include an inner liner and a marker band circumferentially surrounding the inner liner. The distal tip portion also may include an outer jacket circumferentially surrounding a first portion of the inner liner and ending proximal of a proximal end of the marker band; and a tip outer jacket circumferentially surrounding a second portion of the inner liner and the marker band. The tip outer jacket extends distally past the marker band distal end to a distal tip of the elongate body, and a proximal end of the tip outer jacket may be laterally adjacent to a distal end of the outer jacket.

Abstract: Disinfection cap includes housing comprising closed top, essentially cylindrical sidewall, and open bottom formed by the sidewall with opening to inner cavity within the housing for receiving tip including mating feature of needleless connector. Disinfection sponge can be configured within inner cavity, removable cover sealing opening to inner cavity to seal sponge within inner cavity prior to cap use. Inner cavity includes at least one thread on inner surface of its sidewall that does not correspond to the mating feature of needleless connector, but is sufficient to interlock with mating feature of needleless connector. Plurality of disinfection caps are disposed on strip of IV pole hanging device such that each cap can be peeled off the strip unsealed for immediate use, or separated from the strip sealed for later use.

Abstract: Semiconductor devices and corresponding methods of manufacturing the same are disclosed. For example, a semiconductor device includes a first semiconductor substrate and a second semiconductor substrate. A first portion of a test structure is disposed over the first substrate and a second portion of the test structure is disposed over the second substrate. The test structure includes intentionally offset portions. The performance characteristics of the intestinally offset portions are measured to detect an alignment of the first portion of the test structure and a second portion of the test structure.

Abstract: A catheter may include an elongate body including a proximal portion including a proximal end, and a distal tip portion. The distal tip portion may include an inner liner and a marker band circumferentially surrounding the inner liner. The distal tip portion also may include an outer jacket circumferentially surrounding a first portion of the inner liner and ending proximal of a proximal end of the marker band; and a tip outer jacket circumferentially surrounding a second portion of the inner liner and the marker band. The tip outer jacket extends distally past the marker band distal end to a distal tip of the elongate body, and a proximal end of the tip outer jacket may be laterally adjacent to a distal end of the outer jacket.

Abstract: The present disclosure generally relates to optical molecules, including but not limited to 1,3-thiazolidin-4-ones and other molecules comprising an aza-heterocyclic ring system containing a chalcogen. In some embodiments, the molecules may absorb light between 300 nm and 800 nm, e.g., appearing as various colors, depending on the absorbance. In some cases, the optical molecules can be used as color additives, pigments, dyes, or the like. Other embodiments of the disclosure are generally directed to systems and devices using such compounds, methods of using such compounds, kits involving such compounds, or the like.

Abstract: The techniques described herein relate to computerized methods and apparatuses for predicting properties of molecules using a neural network. The neural network may include one or more layers to convert atom and bond features of an input molecule into respective atom and bond representations; a graph neural network configured to update the atom and bond representations; a molecule layer configured to convert the updated atom and bond representations into a molecule representation; and a target layer configured to predict one or more properties of the molecule based on the molecule representation. Prediction may include a regression operation to predict a single property value of the molecule, or a classification operation to predict probabilities of the molecule belonging to respective classes of a plurality of classes. The graph neural network may include a graph transformer network. The graph neural network may include a graph convolutional neural network.

Abstract: A method of processing a substrate that includes: forming an infrared (IR) absorbing separation layer over a first substrate; forming one or more layers over the IR absorbing separation layer; bonding the first substrate and a second substrate at a bonding interface between the one or more layers and the second substrate using a direct bonding technique to form a wafer stack; exposing the wafer stack to an infrared (IR) light irradiation to separate the first substrate from the one or more layers.

Abstract: A connector caps that can reduce risk of accidentally removing the cap include a locking feature where outer housing is designed to prevent removal of the cap unless a downward force is applied to the cap with counter clockwise rotation. Structural elements making up the cap locking feature can be optimized or varied, for example to require application of more or less force, more or less downward movement, more or less rotational movement, and variations of other characteristics to facilitate intentional removal and/or to prevent unintentional removal of the cap from the needleless connector, and/or to facilitate securing of the cap on the needleless connector. Optionally, a needleless connector cap can include an outer housing providing holes or openings or vents such that air can pass through if the cap becomes lodged in air passage way.

Abstract: In some implementations, a method may include providing a silicon on insulator (SOI) substrate having a first semiconductor layer, a buried oxide layer over the first semiconductor region, and a second semiconductor region over the buried oxide, the second semiconductor region having a plurality of recesses exposing the underlying buried oxide, each recess having a shape and size configured to accommodate a die. In addition, the device may include bonding a plurality of semiconductor dies to the buried oxide through the plurality of recesses.

Abstract: Disinfection cap includes housing comprising closed top, essentially cylindrical sidewall, and open bottom formed by the sidewall with opening to inner cavity within the housing for receiving tip including mating feature of needleless connector. Disinfection sponge can be configured within inner cavity, removable cover sealing opening to inner cavity to seal sponge within inner cavity prior to cap use. Inner cavity includes at least one thread on inner surface of its sidewall that does not correspond to the mating feature of needleless connector, but is sufficient to interlock with mating feature of needleless connector. Plurality of disinfection caps are disposed on strip of IV pole hanging device such that each cap can be peeled off the strip unsealed for immediate use, or separated from the strip sealed for later use.