Abstract: Disclosed herein are compounds, salts, solvates of Formula (1), and any formulation thereof. Also disclosed are methods of increasing soil nutrient availability to a plant by contacting a plant or soil with compounds, salts, solvates of Formula (1), or any formulation thereof. The compounds and methods disclosed herein may increase an amount of nitrogen or soluble phosphate in a soil.

Abstract: Novel tools and techniques are provided for implementing intelligent alert automation (“IAA”). In various embodiments, IAA receives alert/event feeds from several different alerting and ticketing systems via input Redis queues, and uses a triage system to determine whether to process the alert/event or disregard it. If so, IAA may create a flow instance, assign a unique instance ID, and place the flow instance in one of a plurality of jobs queues based on alert/event type and/or or source. An abattoir system retrieves a flow instance from one of the jobs queues (in order of the queue's priority), and processes the next node or step in the flow instance. The flow instance is placed back into the jobs queue for subsequent processing by the same or different abattoir system until no additional nodes or steps remain in the flow, at which point the flow instance is considered complete.

Abstract: Novel tools and techniques are provided for implementing intelligent alert automation (“IAA”). In various embodiments, IAA receives alert/event feeds from several different alerting and ticketing systems via input Redis queues, and uses a triage system to determine whether to process the alert/event or disregard it. If so, IAA may create a flow instance, assign a unique instance ID, and place the flow instance in one of a plurality of jobs queues based on alert/event type and/or or source. An abattoir system retrieves a flow instance from one of the jobs queues (in order of the queue's priority), and processes the next node or step in the flow instance. The flow instance is placed back into the jobs queue for subsequent processing by the same or different abattoir system until no additional nodes or steps remain in the flow, at which point the flow instance is considered complete.

Abstract: A semiconductor device package includes a package substrate having a die attach region, a silicon carbide (SiC) substrate having a first surface including a semiconductor device layer thereon and a second surface that is opposite the first surface, and a die attach metal stack. The die attach metal stack includes a sputtered die attach material layer that attaches the second surface of the SiC substrate to the die attach region of the package substrate, where the sputtered die attach material layer comprises a void percent of about 15% or less. The sputtered die attach material layer may be formed using a sputter gas including at least one of krypton (Kr), xenon (Xe), or radon (Rn). The die attach metal stack may further include a metal interlayer that prevent contacts with a first barrier metal layer during a phase transition of the die attach material layer.

Abstract: The present invention relates to a mold for molding a component, in particular a particle foam part and a method for manufacturing the component using such a mold. In one embodiment, a mold for molding a component comprises (a.) a mixture of a polymer material and a filler material, (b.) wherein the filler material is adapted to allow a heating of the component inside the mold by means of an electromagnetic field.

Abstract: Novel tools and techniques are provided for implementing intelligent alert automation (“IAA”). In various embodiments, IAA receives alert/event feeds from several different alerting and ticketing systems via input Redis queues, and uses a triage system to determine whether to process the alert/event or disregard it. If so, IAA may create a flow instance, assign a unique instance ID, and place the flow instance in one of a plurality of jobs queues based on alert/event type and/or or source. An abattoir system retrieves a flow instance from one of the jobs queues (in order of the queue's priority), and processes the next node or step in the flow instance. The flow instance is placed back into the jobs queue for subsequent processing by the same or different abattoir system until no additional nodes or steps remain in the flow, at which point the flow instance is considered complete.

Abstract: The present invention relates to a mold for molding a component, in particular a piece of sports apparel, a method for manufacturing the component using such a mold and a shoe with such a component. In one embodiment, a mold for molding a component, in particular a piece of sports apparel, comprises (a.) a mixture of a polymer material and a filler material, (b.) wherein the filler material is adapted to allow a heating of the component inside the mold by means of an electromagnetic field.

Abstract: A method for forming semiconductor devices from a semiconductor wafer includes cutting a first surface of a semiconductor wafer to form a first region that extends partially through the semiconductor wafer and the first region has a bottom portion. The method further includes directing a beam of laser light to the semiconductor wafer such that the beam of laser light is focused within the semiconductor wafer between the first surface and the second surface thereof and the beam of laser light further cuts the semiconductor wafer by material ablation to form a second region aligned with the first region. A resulting semiconductor device is disclosed as well.

Abstract: A method for forming semiconductor devices from a semiconductor wafer includes cutting a first surface of a semiconductor wafer to form a first region that extends partially through the semiconductor wafer and the first region has a bottom portion. The method further includes directing a beam of laser light to the semiconductor wafer such that the beam of laser light is focused within the semiconductor wafer between the first surface and the second surface thereof and the beam of laser light further cuts the semiconductor wafer by material ablation to form a second region aligned with the first region. A resulting semiconductor device is disclosed as well.

Abstract: A semiconductor device package includes a package substrate having a die attach region, a silicon carbide (SiC) substrate having a first surface including a semiconductor device layer thereon and a second surface that is opposite the first surface, and a die attach metal stack. The die attach metal stack includes a sputtered die attach material layer that attaches the second surface of the SiC substrate to the die attach region of the package substrate, where the sputtered die attach material layer comprises a void percent of about 15% or less. The sputtered die attach material layer may be formed using a sputter gas including at least one of krypton (Kr), xenon (Xe), or radon (Rn). The die attach metal stack may further include a metal interlayer that prevent contacts with a first barrier metal layer during a phase transition of the die attach material layer.

Abstract: Disclosed herein are compounds, salts, solvates of Formula (1), and any formulation thereof. Also disclosed are methods of increasing soil nutrient availability to a plant by contacting a plant or soil with compounds, salts, solvates of Formula (1), or any formulation thereof. The compounds and methods disclosed herein may increase an amount of nitrogen or soluble phosphate in a soil.

Abstract: A semiconductor device package includes a package substrate having a die attach region, a silicon carbide (SiC) substrate having a first surface including a semiconductor device layer thereon and a second surface that is opposite the first surface, and a die attach metal stack. The die attach metal stack includes a sputtered die attach material layer that attaches the second surface of the SiC substrate to the die attach region of the package substrate, where the sputtered die attach material layer comprises a void percent of about 15% or less. The sputtered die attach material layer may be formed using a sputter gas including at least one of krypton (Kr), xenon (Xe), or radon (Rn). The die attach metal stack may further include a metal interlayer that prevent contacts with a first barrier metal layer during a phase transition of the die attach material layer.

Abstract: The compounds and methods described herein can improve iAge (Inflammatory Age) of patients with a specific immunotype. For example, a patients iAge can be moved into a responders cohort from a non-responders cohort for an immunotherapy. The compounds and methods described herein can also improve cardiovascular patient outcomes using cAge to stratify CVD patients into risk cohorts for therapy and monitoring. Higher risk CVD patients can be converted to lower risk patients by treating the patients with molecules that reduce their cAge.

Abstract: A semiconductor device package includes a package substrate having a die attach region, a silicon carbide (SiC) substrate having a first surface including a semiconductor device layer thereon and a second surface that is opposite the first surface, and a die attach metal stack. The die attach metal stack includes a sputtered die attach material layer that attaches the second surface of the SiC substrate to the die attach region of the package substrate, where the sputtered die attach material layer comprises a void percent of about 15% or less. The sputtered die attach material layer may be formed using a sputter gas including at least one of krypton (Kr), xenon (Xe), or radon (Rn). The die attach metal stack may further include a metal interlayer that prevent contacts with a first barrier metal layer during a phase transition of the die attach material layer.

Abstract: A method for forming semiconductor devices from a semiconductor wafer includes cutting a first surface of a semiconductor wafer to form a first region that extends partially through the semiconductor wafer and the first region has a bottom portion. The method further includes directing a beam of laser light to the semiconductor wafer such that the beam of laser light is focused within the semiconductor wafer between the first surface and the second surface thereof and the beam of laser light further cuts the semiconductor wafer by material ablation to form a second region aligned with the first region. A resulting semiconductor device is disclosed as well.

Abstract: A filter band assembly for a solenoid-actuated valve includes a filter band adapted to be disposed about a valve body of the solenoid-actuated valve. The filter band has a first end at one end and a second end at another end. The filter band assembly also includes a separate bracket affixed to one of the first end and the second end and adapted to support the one of the first end and the second end on the valve body to allow the first end and the second end to be joined together in a closed position.

Abstract: A control valve includes a metal insert extending along an axis and presenting an interior insert surface defining a fluid passage. The control valve also includes a valve member slidably disposed in the fluid passage, and a composite valve body. The composite valve body has a first and second protrusion disposed about the axis. The first protrusion is spaced from the second protrusion along the axis. The composite valve body has a connecting bridge integral with and extending between the first and second protrusions. The connecting bridge has a first connecting side and a second connecting side spaced from the first connecting side, with the axis, the first connecting side, and the second connecting side defining a central angle between 5 and 45 degrees.

Abstract: A control valve includes a metal insert extending along an axis and presenting an interior insert surface defining a fluid passage. The control valve also includes a valve member slidably disposed in the fluid passage, and a composite valve body. The composite valve body has a first and second protrusion disposed about the axis. The first protrusion is spaced from the second protrusion along the axis. The composite valve body has a connecting bridge integral with and extending between the first and second protrusions. The connecting bridge has a first connecting side and a second connecting side spaced from the first connecting side, with the axis, the first connecting side, and the second connecting side defining a central angle between 5 and 45 degrees.

Abstract: A lens system includes a TIR (Total Internal Reflection) lens and a diffuser. The lens has an optical body member including an upper end, a lower end opposite the upper end, and an outer surface. The outer surface is shaped to provide total internal reflection for light from a light source. An upper surface extends in a series of steps from the upper end to a first interior portion of the optical body member. A substantially cylindrical cavity extends from the lower end to a second interior portion of the optical body member. A middle portion separates the first and second interior portions and has a flat upper surface and a curved lower surface. The diffuser has a curved shell configured for disposing over a light source and configured to fit inside the cylindrical cavity of the optical body member, the diffuser having a circular rim fused to the lower end of the optical body member.

Abstract: A filter band assembly for a solenoid-actuated valve includes a filter band adapted to be disposed about a valve body of the solenoid-actuated valve. The filter band has a first end at one end and a second end at another end. The filter band assembly also includes a separate bracket affixed to one of the first end and the second end and adapted to support the one of the first end and the second end on the valve body to allow the first end and the second end to be joined together in a closed position.