Abstract: Packaging is disclosed. The packaging may include a charging element to charge an electronic device contained within the packaging. The charging may be performed by inductive charging. The packaging may include a magnet to position and retain an item within the packaging. The packaging may include protective surfaces formed of microfiber to help protect an item contained therein. The microfiber may be debossed around its periphery to minimize interruption between the microfiber and an underlying surface to which it is applied.

Abstract: Examples of computing devices and assemblies for mounting computer components to an enclosure or other structure of the computing device are described. In some examples, the mounting assembly may include a compliant member having a plurality of corner portions configured to engage the corners of the component. The mounting assembly may also include a bracket configured to enclose at least a portion of the compliant member. The mounting bracket may be configured to mount the component at an angle relative to the enclosure or other structure, and may include one or more features adapted for improved cooling of the component mounted therein. The compliant member may include a plurality of ribs or other retaining elements for maintaining the component in a spaced apart position relative to the mounting bracket.

Abstract: Packaging is disclosed. The packaging may include a charging element to charge an electronic device contained within the packaging. The charging may be performed by inductive charging. The packaging may include a magnet to position and retain an item within the packaging. The packaging may include protective surfaces formed of microfiber to help protect an item contained therein. The microfiber may be debossed around its periphery to minimize interruption between the microfiber and an underlying surface to which it is applied.

Abstract: Computing devices and microphone assemblies including acoustic waveguides are described. According to some examples, a computing device may include an enclosure, a microphone which may be spaced apart and angled relative to the interior surface of the enclosure to which the microphone may be coupled. The computing device may further include an acoustic waveguide disposed between the microphone and the interior surface of the enclosure, the acoustic waveguide having a passage for allowing acoustic energy to be transmitted from a microphone opening in the enclosure to the receiving element of the microphone (also referred to as sensing element, or microphone sensor).