Patents by Inventor Kevin Slatnick

Kevin Slatnick has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Stacked Printed Circuit Board Surface In A Free-Position Wireless Charger
    Publication number: 20240055907
    Abstract: A charging device has a first printed circuit board (PCB) having a top metal layer and a bottom metal layer, where a first plurality of charging cells is provided on the top metal layer of the first PCB and a second plurality of charging cells is provided on the bottom metal layer of the first PCB. The charging device may have a second PCB having a top metal layer and a bottom metal layer, where a third plurality of charging cells is provided on the top metal layer of the second PCB and a fourth plurality of charging cells is provided on the bottom metal layer of the second PCB. An adhesive layer may join the first and second PCBs. One or more interconnects may be provided between the bottom metal layer of the first PCB and the top metal layer of the second PCB.
    Type: Application
    Filed: August 14, 2023
    Publication date: February 15, 2024
    Inventors: Eric Heindel Goodchild, Camron Vossberg, Kevin Slatnick
  • Stacked printed circuit board surface in a free-position wireless charger
    Patent number: 11728689
    Abstract: A charging device has a first printed circuit board (PCB) having a top metal layer and a bottom metal layer, where a first plurality of charging cells is provided on the top metal layer of the first PCB and a second plurality of charging cells is provided on the bottom metal layer of the first PCB. The charging device may have a second PCB having a top metal layer and a bottom metal layer, where a third plurality of charging cells is provided on the top metal layer of the second PCB and a fourth plurality of charging cells is provided on the bottom metal layer of the second PCB. An adhesive layer may join the first and second PCBs. One or more interconnects may be provided between the bottom metal layer of the first PCB and the top metal layer of the second PCB.
    Type: Grant
    Filed: November 19, 2020
    Date of Patent: August 15, 2023
    Assignee: Aira, Inc.
    Inventors: Eric Heindel Goodchild, Camron Vossberg, Kevin Slatnick
  • Stacked Printed Circuit Board Surface In A Free-Position Wireless Charger
    Publication number: 20210152026
    Abstract: A charging device has a first printed circuit board (PCB) having a top metal layer and a bottom metal layer, where a first plurality of charging cells is provided on the top metal layer of the first PCB and a second plurality of charging cells is provided on the bottom metal layer of the first PCB. The charging device may have a second PCB having a top metal layer and a bottom metal layer, where a third plurality of charging cells is provided on the top metal layer of the second PCB and a fourth plurality of charging cells is provided on the bottom metal layer of the second PCB. An adhesive layer may join the first and second PCBs. One or more interconnects may be provided between the bottom metal layer of the first PCB and the top metal layer of the second PCB.
    Type: Application
    Filed: November 19, 2020
    Publication date: May 20, 2021
    Inventors: Eric Heindel Goodchild, Camron Vossberg, Kevin Slatnick