Patents by Inventor Kevin Soukup

Kevin Soukup has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Selective imaging through dual photoresist layers
    Patent number: 8383323
    Abstract: A system and method for selective imaging through dual photoresist layers. The system and method includes coating a surface of the wafer with a first resist and baking the wafer to sufficiently drive out solvents in the first resist. The first resist is exposed to a first radiation source and exposing an edge of the wafer having the first resist disposed thereon to the first radiation source. The method further includes hard baking the first resist to the wafer and coating the first resist with a second resist. The method also includes baking the wafer to sufficiently drive out solvents in the second resist and exposing the second resist to a second radiation source. The method also includes exposing select portions of the edge of the wafer having the second resist disposed thereon to the second radiation source and hard baking the second resist to the wafer.
    Type: Grant
    Filed: September 13, 2006
    Date of Patent: February 26, 2013
    Assignees: Samsung Austin Semiconductor, L.P., Samsung Electronics Co., Ltd.
    Inventors: Pedro Morrison, Kevin Soukup, David Cho, Karla Mendoza
  • Selective imaging through dual photoresist layers
    Publication number: 20080076068
    Abstract: A system and method for selective imaging through dual photoresist layers. The system and method includes coating a surface of the wafer with a first resist and baking the wafer to sufficiently drive out solvents in the first resist. The first resist is exposed to a first radiation source and exposing an edge of the wafer having the first resist disposed thereon to the first radiation source. The method further includes hard baking the first resist to the wafer and coating the first resist with a second resist. The method also includes baking the wafer to sufficiently drive out solvents in the second resist and exposing the second resist to a second radiation source. The method also includes exposing select portions of the edge of the wafer having the second resist disposed thereon to the second radiation source and hard baking the second resist to the wafer.
    Type: Application
    Filed: September 13, 2006
    Publication date: March 27, 2008
    Applicant: Samsung Austin Semiconductor
    Inventors: Pedro Morrison, Kevin Soukup, David Cho, Karla Mendoza