Patents by Inventor Kevin T. Huang

Kevin T. Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250049467
    Abstract: A method of suturing a trocar path incision in a tissue of a patient with an obturator includes inserting the obturator through the tissue such that a shaft of the obturator extends through a tissue opening about the trocar path incision and a distal tip of the obturator is positioned within a cavity of the patient. The method also includes directing the suture via a suturing feature with the obturator inserted through the tissue in order to direct the suture relative to the tissue. Furthermore, the method includes closing the tissue opening about the trocar path incision with the suture.
    Type: Application
    Filed: August 16, 2024
    Publication date: February 13, 2025
    Inventors: Frederick E. Shelton, IV, Gregory J. Bakos, Layne D. Christopher, Rebecca J. Gettinger, Jason L. Harris, Christopher J. Hess, Zhifan F. Huang, John V. Hunt, Michael A. Jacobs, Anil R. Jadhav, John A. Jast, Nichole Y. Kwee, Kevin A. Larson, James G. Lee, David T. Martin, Jerome R. Morgan, Michael A. Murray, Shailendra K. Parihar, Sol Posada, Devanathan Raghavan, Brian D. Schings, Patrick M. Schleitweiler, Nicholas Seipelt, Melinda Tellmann, Tamara S. Vetro Widenhouse
  • Publication number: 20250052088
    Abstract: A vertical cable rail panel includes first and second rails, and each comprises a channel and a plurality of spaced apart through holes. An internal member is disposed within one of the channels and defines a bearing surface and a first opening. A rigid support member vertically extends between the first rail and the second rail. A vertical cable includes a cable member, a first swage fitting, and a second swage fitting. The first end of the vertical cable extends through one of the plurality of through holes in the first rail and extends through the first opening in the internal member. A swage fitting is secured to each end of the vertical cable. A threaded member is associated with one of the swage fittings and the internal member, and adjusting the threaded member adjusts a tension in the vertical cable.
    Type: Application
    Filed: October 21, 2024
    Publication date: February 13, 2025
    Applicant: Fortress Iron, LP
    Inventors: Kevin T. Burt, Matthew Carlyle Sherstad, Shih-Te Lin, Hua-Ping Huang
  • Patent number: 12057331
    Abstract: Mass transfer tools and methods for high density transfer of arrays of micro devices are described. In an embodiment, a mass transfer tool includes a micro pick up array with an array of transfer heads arranged in clusters. The clusters of transfer heads can be used to pick up a high density group of micro devices followed by sequential placement onto a receiving substrate.
    Type: Grant
    Filed: June 11, 2021
    Date of Patent: August 6, 2024
    Assignee: Apple Inc.
    Inventors: Hyeun-Su Kim, Dariusz Golda, Chae Hyuck Ahn, Kevin T. Huang, Eric B. Newton
  • Publication number: 20240234181
    Abstract: Conformable transfer devices and micro-transfer printing methods are described. In an embodiment, a conformable transfer devices includes first and second arrays of transfer heads with differential lengths to support a micro-transfer printing sequence including a single pick operation and multiple placement operations.
    Type: Application
    Filed: May 17, 2022
    Publication date: July 11, 2024
    Inventors: Mingjing Ha, Kuan H. Lu, Paul S. Drzaic, Peter T. Carmichael, Siyi Liu, Yung-Yu Hsu, Stephen P. Bathurst, Kevin T. Huang
  • Publication number: 20220013380
    Abstract: Mass transfer tools and methods for high density transfer of arrays of micro devices are described. In an embodiment, a mass transfer tool includes a micro pick up array with an array of transfer heads arranged in clusters. The clusters of transfer heads can be used to pick up a high density group of micro devices followed by sequential placement onto a receiving substrate.
    Type: Application
    Filed: June 11, 2021
    Publication date: January 13, 2022
    Inventors: Hyeun-Su Kim, Dariusz Golda, Chae Hyuck Ahn, Kevin T. Huang, Eric B. Newton