Abstract: An apparatus according to one embodiment includes a magnetic head having, on one module thereof, an array of N first data transducers positioned towards a media facing surface of the module, and M second data transducers interleaved with the array of first transducers. Only some of the data transducers are coupled to pads. An apparatus according to another embodiment includes a magnetic head having, on one module thereof, an array of data transducers positioned towards a media facing surface of the module, the data transducers including at least one of data readers, data writers, and combinations thereof. A plurality of pads are on the module, but less than all of the first and/or second data transducers are coupled to pads.

Abstract: An apparatus according to one embodiment includes a magnetic head having, on one module thereof, an array of N first data transducers positioned towards a media facing surface of the module, and M second data transducers interleaved with the array of first transducers. Only some of the data transducers are coupled to pads. An apparatus according to another embodiment includes a magnetic head having, on one module thereof, an array of data transducers positioned towards a media facing surface of the module, the data transducers including at least one of data readers, data writers, and combinations thereof. A plurality of pads are on the module, but less than all of the first and/or second data transducers are coupled to pads.

Abstract: A module according to one embodiment includes an array of N piggyback or merged first data transducers positioned towards a media facing surface of the module; and M second data transducers interleaved with the array of piggyback or merged data transducers, wherein the second data transducers are single data transducers, at least some of the data transducers being coupled to pads. A module according to another embodiment includes an array of N first data transducers positioned towards a media facing surface of the module, the first data transducers including at least one of data readers, data writers, and combinations thereof; and M second data transducers interleaved with the array of first data transducers, the second data transducers including at least one of data readers, data writers, and combinations thereof, wherein less than all of the first and/or second data transducers are coupled to pads.

Abstract: A module according to one embodiment includes an array of N piggyback or merged first data transducers positioned towards a media facing surface of the module; and M second data transducers interleaved with the array of piggyback or merged data transducers, wherein the second data transducers are single data transducers, at least some of the data transducers being coupled to pads. A module according to another embodiment includes an array of N first data transducers positioned towards a media facing surface of the module, the first data transducers including at least one of data readers, data writers, and combinations thereof; and M second data transducers interleaved with the array of first data transducers, the second data transducers including at least one of data readers, data writers, and combinations thereof, wherein less than all of the first and/or second data transducers are coupled to pads.

Abstract: A magnetic head according to another embodiment includes a head body including a top face, a bottom face, a pair of elongated side faces, and a pair of short end faces; at least one transducer formed in communication with the top face of the head body; and a single groove formed in the top face of the head body and extending between the transducers and one of the side faces of the head body. A method for manufacturing a magnetic head is also presented.

Abstract: A plurality of apparatuses and methods are provided for improving the manufacture and operational characteristics of thin magnetic film heads. First provided is an apparatus and method for bonding a beam and a magnetic head with optimal precision. Also included is a saw apparatus capable of dicing magnetic heads on an associated wafer in a manner that affords a planar operating surface on the magnetic head. Still yet, a specific head structure is provided which has single a groove that affords all of the benefits of the prior art head structures, but with only one action required during the thin-film head manufacturing process.