Abstract: An apparatus for use as a connector in certain electronic applications. The disclosed apparatus teaches a connector assembly suitable for use in applications requiring minimal height restrictions while simultaneously affording a solderless, stackable, shielded connector assembly that may include a variety of electronic filtering. A described embodiment of the present invention includes a multi-walled encasement structure of electroplated construction housing a "pi" filter sandwiched between matching layers of resilient conductive layers, each layer having contact pads for coupling to contact pads of adjacent circuit board circuitry.