Abstract: LED chip packaging assembly that facilitates an integrated method for mounting LED chips as a group to be pre-wired to be electrically connected to each other through a pattern of extendable metal wiring lines is provided. LED chips which are electrically connected to each other through extendable metal wiring lines, replace pick and place mounting and the wire bonding processes of the LED chips, respectively. Wafer level MEMS technology is utilized to form parallel wiring lines suspended and connected to various contact pads. Bonding wires connecting the LED chips are made into horizontally arranged extendable metal wiring lines which can be in a spring shape, and allowing for expanding and contracting of the distance between the connected LED chips. A tape is further provided to be bonded to the LED chips, and extended in size to enlarge distance between the LED chips to exceed the one or more prearranged distances.

Abstract: LED chip packaging assembly that facilitates an integrated method for mounting LED chips as a group to be pre-wired to be electrically connected to each other through a pattern of extendable metal wiring lines is provided. LED chips which are electrically connected to each other through extendable metal wiring lines, replace pick and place mounting and the wire bonding processes of the LED chips, respectively. Wafer level MEMS technology is utilized to form parallel wiring lines suspended and connected to various contact pads. Bonding wires connecting the LED chips are made into horizontally arranged extendable metal wiring lines which can be in a spring shape, and allowing for expanding and contracting of the distance between the connected LED chips. A tape is further provided to be bonded to the LED chips, and extended in size to enlarge distance between the LED chips to exceed the one or more prearranged distances.

Abstract: LED chip packaging assembly that facilitates an integrated method for mounting LED chips as a group to be pre-wired to be electrically connected to each other through a pattern of extendable metal wiring lines is provided. LED chips which are electrically connected to each other through extendable metal wiring lines, replace pick and place mounting and the wire bonding processes of the LED chips, respectively. Wafer level MEMS technology is utilized to form parallel wiring lines suspended and connected to various contact pads. Bonding wires connecting the LED chips are made into horizontally arranged extendable metal wiring lines which can be in a spring shape, and allowing for expanding and contracting of the distance between the connected LED chips. A tape is further provided to be bonded to the LED chips, and extended in size to enlarge distance between the LED chips to exceed the one or more prearranged distances.

Abstract: LED chip packaging assembly that facilitates an integrated method for mounting LED chips as a group to be pre-wired to be electrically connected to each other through a pattern of extendable metal wiring lines is provided. LED chips which are electrically connected to each other through extendable metal wiring lines, replace pick and place mounting and the wire bonding processes of the LED chips, respectively. Wafer level MEMS technology is utilized to form parallel wiring lines suspended and connected to various contact pads. Bonding wires connecting the LED chips are made into horizontally arranged extendable metal wiring lines which can be in a spring shape, and allowing for expanding and contracting of the distance between the connected LED chips. A tape is further provided to be bonded to the LED chips, and extended in size to enlarge distance between the LED chips to exceed the one or more prearranged distances.

Abstract: Disclosed herein is a deformable network structure, which includes a first device portion, a second device portion and at least one connector interconnecting between the first device portion and the second device portion. Moreover, the second device portion can be electrically connected to the first device portion through one of the connectors. The first and second device portions respectively have a first and a second center. Each of the connectors may be deformable from an initial state to a final state, such that a first distance between the first and second centers in the final state varies by at least 10% of a second distance between the first and second centers in the initial state.

Abstract: Disclosed herein is a deformable network structure, which includes a first device portion, a second device portion and at least one connector interconnecting between the first device portion and the second device portion. Moreover, the second device portion can be electrically connected to the first device portion through one of the connectors. The first and second device portions respectively have a first and a second center. Each of the connectors may be deformable from an initial state to a final state, such that a first distance between the first and second centers in the final state varies by at least 10% of a second distance between the first and second centers in the initial state.

Abstract: Disclosed herein is an extendable network structure, which includes a first device portion, a second device portion and at least three connectors. The three connectors are connected to the first device portion. The second device portion is electrically connected to the first device portion through one of the three connectors. The first and second device portions respectively have a first and a second center. Each of the connectors may be extendable from an initial state to an extended state, such that a first distance between the first and second centers in the extended state is at least 1.1 fold of a second distance between the first and second centers in the initial state.

Abstract: Disclosed herein is an extendable network structure, which includes a first device portion, a second device portion and at least three connectors. The three connectors are connected to the first device portion. The second device portion is electrically connected to the first device portion through one of the three connectors. The first and second device portions respectively have a first and a second center. Each of the connectors may be extendable from an initial state to an extended state, such that a first distance between the first and second centers in the extended state is at least 1.1 fold of a second distance between the first and second centers in the initial state.