Patents by Inventor Kevin Tetz

Kevin Tetz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10804447
    Abstract: Solid state lighting (SSL) devices and methods of manufacturing SSL devices are disclosed herein. In one embodiment, an SSL device comprises a support having a surface and a solid state emitter (SSE) at the surface of the support. The SSE can emit a first light propagating along a plurality of first vectors. The SSL device can further include a converter material over at least a portion of the SSE. The converter material can emit a second light propagating along a plurality of second vectors. Additionally, the SSL device can include a lens over the SSE and the converter material. The lens can include a plurality of diffusion features that change the direction of the first light and the second light such that the first and second lights blend together as they exit the lens. The SSL device can emit a substantially uniform color of light.
    Type: Grant
    Filed: October 22, 2018
    Date of Patent: October 13, 2020
    Assignee: Micron Technology, Inc.
    Inventors: Martin F. Schubert, Kevin Tetz
  • Publication number: 20190341537
    Abstract: Solid state lighting devices and associated methods of thermal sinking are described below. In one embodiment, a light emitting diode (LED) device includes a heat sink, an LED die thermally coupled to the heat sink, and a phosphor spaced apart from the LED die. The LED device also includes a heat conduction path in direct contact with both the phosphor and the heat sink. The heat conduction path is configured to conduct heat from the phosphor to the heat sink.
    Type: Application
    Filed: July 18, 2019
    Publication date: November 7, 2019
    Inventors: Kevin Tetz, Charles M. Watkins
  • Publication number: 20190296183
    Abstract: Several embodiments of semiconductor systems and associated methods of color corrections are disclosed herein. In one embodiment, a method for producing a light emitting diode (LED) includes forming an (LED) on a substrate, measuring a base emission characteristic of the formed LED, and selecting a phosphor based on the measured base emission characteristic of the formed LED such that a combined emission from the LED and the phosphor at least approximates white light. The method further includes introducing the selected phosphor onto the LED via, for example, inkjet printing.
    Type: Application
    Filed: June 7, 2019
    Publication date: September 26, 2019
    Inventors: Kevin Tetz, Charles M. Watkins
  • Patent number: 10403805
    Abstract: Solid state lighting devices and associated methods of thermal sinking are described below. In one embodiment, a light emitting diode (LED) device includes a heat sink, an LED die thermally coupled to the heat sink, and a phosphor spaced apart from the LED die. The LED device also includes a heat conduction path in direct contact with both the phosphor and the heat sink. The heat conduction path is configured to conduct heat from the phosphor to the heat sink.
    Type: Grant
    Filed: July 18, 2017
    Date of Patent: September 3, 2019
    Assignee: Micron Technology, Inc.
    Inventors: Kevin Tetz, Charles M. Watkins
  • Patent number: 10319875
    Abstract: Several embodiments of semiconductor systems and associated methods of color corrections are disclosed herein. In one embodiment, a method for producing a light emitting diode (LED) includes forming an (LED) on a substrate, measuring a base emission characteristic of the formed LED, and selecting a phosphor based on the measured base emission characteristic of the formed LED such that a combined emission from the LED and the phosphor at least approximates white light. The method further includes introducing the selected phosphor onto the LED via, for example, inkjet printing.
    Type: Grant
    Filed: May 5, 2014
    Date of Patent: June 11, 2019
    Assignee: Micron Technology, Inc.
    Inventors: Kevin Tetz, Charles M. Watkins
  • Patent number: 10243120
    Abstract: Solid state lighting (SSL) devices and methods of manufacturing SSL devices are disclosed herein. In one embodiment, an SSL device comprises a support having a surface and a solid state emitter (SSE) at the surface of the support. The SSE can emit a first light propagating along a plurality of first vectors. The SSL device can further include a converter material over at least a portion of the SSE. The converter material can emit a second light propagating along a plurality of second vectors. Additionally, the SSL device can include a lens over the SSE and the converter material. The lens can include a plurality of diffusion features that change the direction of the first light and the second light such that the first and second lights blend together as they exit the lens. The SSL device can emit a substantially uniform color of light.
    Type: Grant
    Filed: May 17, 2018
    Date of Patent: March 26, 2019
    Assignee: Micron Technology, Inc.
    Inventors: Martin F. Schubert, Kevin Tetz
  • Publication number: 20190058097
    Abstract: Solid state lighting (SSL) devices and methods of manufacturing SSL devices are disclosed herein. In one embodiment, an SSL device comprises a support having a surface and a solid state emitter (SSE) at the surface of the support. The SSE can emit a first light propagating along a plurality of first vectors. The SSL device can further include a converter material over at least a portion of the SSE. The converter material can emit a second light propagating along a plurality of second vectors. Additionally, the SSL device can include a lens over the SSE and the converter material. The lens can include a plurality of diffusion features that change the direction of the first light and the second light such that the first and second lights blend together as they exit the lens. The SSL device can emit a substantially uniform color of light.
    Type: Application
    Filed: October 22, 2018
    Publication date: February 21, 2019
    Inventors: Martin F. Schubert, Kevin Tetz
  • Publication number: 20180358344
    Abstract: Solid state lights (SSLs) including a back-to-back solid state emitters (SSEs) and associated methods are disclosed herein. In various embodiments, an SSL can include a carrier substrate having a first surface and a second surface different from the first surface. First and second through substrate interconnects (TSIs) can extend from the first surface of the carrier substrate to the second surface. The SSL can further include a first and a second SSE, each having a front side and a back side opposite the front side. The back side of the first SSE faces the first surface of the carrier substrate and the first SSE is electrically coupled to the first and second TSIs. The back side of the second SSE faces the second surface of the carrier substrate and the second SSE is electrically coupled to the first and second TSIs.
    Type: Application
    Filed: July 26, 2018
    Publication date: December 13, 2018
    Inventors: Cem Basceri, Casey Kurth, Kevin Tetz
  • Publication number: 20180269365
    Abstract: Solid state lighting (SSL) devices and methods of manufacturing SSL devices are disclosed herein. In one embodiment, an SSL device comprises a support having a surface and a solid state emitter (SSE) at the surface of the support. The SSE can emit a first light propagating along a plurality of first vectors. The SSL device can further include a converter material over at least a portion of the SSE. The converter material can emit a second light propagating along a plurality of second vectors. Additionally, the SSL device can include a lens over the SSE and the converter material. The lens can include a plurality of diffusion features that change the direction of the first light and the second light such that the first and second lights blend together as they exit the lens. The SSL device can emit a substantially uniform color of light.
    Type: Application
    Filed: May 17, 2018
    Publication date: September 20, 2018
    Inventors: Martin F. Schubert, Kevin Tetz
  • Patent number: 10062677
    Abstract: Solid state lights (SSLs) including a back-to-back solid state emitters (SSEs) and associated methods are disclosed herein. In various embodiments, an SSL can include a carrier substrate having a first surface and a second surface different from the first surface. First and second through substrate interconnects (TSIs) can extend from the first surface of the carrier substrate to the second surface. The SSL can further include a first and a second SSE, each having a front side and a back side opposite the front side. The back side of the first SSE faces the first surface of the carrier substrate and the first SSE is electrically coupled to the first and second TSIs. The back side of the second SSE faces the second surface of the carrier substrate and the second SSE is electrically coupled to the first and second TSIs.
    Type: Grant
    Filed: August 30, 2016
    Date of Patent: August 28, 2018
    Assignee: Micron Technology, Inc.
    Inventors: Cem Basceri, Casey Kurth, Kevin Tetz
  • Patent number: 10002994
    Abstract: Solid state lighting (SSL) devices and methods of manufacturing SSL devices are disclosed herein. In one embodiment, an SSL device comprises a support having a surface and a solid state emitter (SSE) at the surface of the support. The SSE can emit a first light propagating along a plurality of first vectors. The SSL device can further include a converter material over at least a portion of the SSE. The converter material can emit a second light propagating along a plurality of second vectors. Additionally, the SSL device can include a lens over the SSE and the converter material. The lens can include a plurality of diffusion features that change the direction of the first light and the second light such that the first and second lights blend together as they exit the lens. The SSL device can emit a substantially uniform color of light.
    Type: Grant
    Filed: April 10, 2015
    Date of Patent: June 19, 2018
    Assignee: Micron Technology, Inc.
    Inventors: Martin F. Schubert, Kevin Tetz
  • Publication number: 20170317256
    Abstract: Solid state lighting devices and associated methods of thermal sinking are described below. In one embodiment, a light emitting diode (LED) device includes a heat sink, an LED die thermally coupled to the heat sink, and a phosphor spaced apart from the LED die. The LED device also includes a heat conduction path in direct contact with both the phosphor and the heat sink. The heat conduction path is configured to conduct heat from the phosphor to the heat sink.
    Type: Application
    Filed: July 18, 2017
    Publication date: November 2, 2017
    Inventors: Kevin Tetz, Charles M. Watkins
  • Patent number: 9748461
    Abstract: Solid state lighting devices and associated methods of thermal sinking are described below. In one embodiment, a light emitting diode (LED) device includes a heat sink, an LED die thermally coupled to the heat sink, and a phosphor spaced apart from the LED die. The LED device also includes a heat conduction path in direct contact with both the phosphor and the heat sink. The heat conduction path is configured to conduct heat from the phosphor to the heat sink.
    Type: Grant
    Filed: January 11, 2016
    Date of Patent: August 29, 2017
    Assignee: Micron Technology, Inc.
    Inventors: Kevin Tetz, Charles M. Watkins
  • Patent number: 9620670
    Abstract: Solid state lighting dies and associated methods of manufacturing are disclosed herein. In one embodiment, a solid state lighting die includes a substrate material, a first semiconductor material, a second semiconductor material, and an active region between the first and second semiconductor materials. The second semiconductor material has a surface facing away from the substrate material. The solid state lighting die also includes a plurality of openings extending from the surface of the second semiconductor material toward the substrate material.
    Type: Grant
    Filed: September 2, 2010
    Date of Patent: April 11, 2017
    Assignee: Micron Technology, Inc.
    Inventors: Cem Basceri, Casey Kurth, Thomas Gehrke, Kevin Tetz
  • Publication number: 20160372451
    Abstract: Solid state lights (SSLs) including a back-to-back solid state emitters (SSEs) and associated methods are disclosed herein. In various embodiments, an SSL can include a carrier substrate having a first surface and a second surface different from the first surface. First and second through substrate interconnects (TSIs) can extend from the first surface of the carrier substrate to the second surface. The SSL can further include a first and a second SSE, each having a front side and a back side opposite the front side. The back side of the first SSE faces the first surface of the carrier substrate and the first SSE is electrically coupled to the first and second TSIs. The back side of the second SSE faces the second surface of the carrier substrate and the second SSE is electrically coupled to the first and second TSIs.
    Type: Application
    Filed: August 30, 2016
    Publication date: December 22, 2016
    Inventors: Cem Basceri, Casey Kurth, Kevin Tetz
  • Patent number: 9443834
    Abstract: Solid state lights (SSLs) including a back-to-back solid state emitters (SSEs) and associated methods are disclosed herein. In various embodiments, an SSL can include a carrier substrate having a first surface and a second surface different from the first surface. First and second through substrate interconnects (TSIs) can extend from the first surface of the carrier substrate to the second surface. The SSL can further include a first and a second SSE, each having a front side and a back side opposite the front side. The back side of the first SSE faces the first surface of the carrier substrate and the first SSE is electrically coupled to the first and second TSIs. The back side of the second SSE faces the second surface of the carrier substrate and the second SSE is electrically coupled to the first and second TSIs.
    Type: Grant
    Filed: September 2, 2010
    Date of Patent: September 13, 2016
    Assignee: Micron Technology, Inc.
    Inventors: Cem Basceri, Casey Kurth, Kevin Tetz
  • Patent number: 9421568
    Abstract: A spray gun extension adapter allows a user to extend the reach of a spray gun. The adapter includes a mount shaped for receiving the spray gun. The adapter includes an adapter handle shaped to be gripped by a user. An adapter trigger is linked to an adapter actuator that operates the spray gun when the adapter trigger is engaged. The adapter actuator is positioned on the adapter to engage the spray gun trigger in some embodiments.
    Type: Grant
    Filed: April 10, 2013
    Date of Patent: August 23, 2016
    Inventor: Kevin Tetz
  • Publication number: 20160197255
    Abstract: Solid state lighting devices and associated methods of thermal sinking are described below. In one embodiment, a light emitting diode (LED) device includes a heat sink, an LED die thermally coupled to the heat sink, and a phosphor spaced apart from the LED die. The LED device also includes a heat conduction path in direct contact with both the phosphor and the heat sink. The heat conduction path is configured to conduct heat from the phosphor to the heat sink.
    Type: Application
    Filed: January 11, 2016
    Publication date: July 7, 2016
    Inventors: Kevin Tetz, Charles M. Watkins
  • Patent number: 9236550
    Abstract: Solid state lighting devices and associated methods of thermal sinking are described below. In one embodiment, a light emitting diode (LED) device includes a heat sink, an LED die thermally coupled to the heat sink, and a phosphor spaced apart from the LED die. The LED device also includes a heat conduction path in direct contact with both the phosphor and the heat sink. The heat conduction path is configured to conduct heat from the phosphor to the heat sink.
    Type: Grant
    Filed: February 22, 2013
    Date of Patent: January 12, 2016
    Assignee: Micron Technology, Inc.
    Inventors: Kevin Tetz, Charles M. Watkins
  • Publication number: 20150287895
    Abstract: Solid state lighting (SSL) devices and methods of manufacturing SSL devices are disclosed herein. In one embodiment, an SSL device comprises a support having a surface and a solid state emitter (SSE) at the surface of the support. The SSE can emit a first light propagating along a plurality of first vectors. The SSL device can further include a converter material over at least a portion of the SSE. The converter material can emit a second light propagating along a plurality of second vectors. Additionally, the SSL device can include a lens over the SSE and the converter material. The lens can include a plurality of diffusion features that change the direction of the first light and the second light such that the first and second lights blend together as they exit the lens. The SSL device can emit a substantially uniform color of light.
    Type: Application
    Filed: April 10, 2015
    Publication date: October 8, 2015
    Inventors: Martin F. Schubert, Kevin Tetz