Abstract: A system includes an endoscope connector and an endoscope adapter. The endoscope connector includes a first portion. The first portion includes a first magnetic coupling element and a first planar portion that is perpendicular to an axial direction of the endoscope connector. The endoscope adapter includes a second planar portion. The second planar portion includes a second magnetic coupling element and a substantially planar surface that is perpendicular to an axial direction of the endoscope adapter. The endoscope connector is non-mechanically attachable to the endoscope adapter using the first magnetic coupling element and the second magnetic coupling element. The first planar portion is alignable with the second planar portion such that: electroconductive contacts of the endoscope connector are axially aligned with electroconductive pins of the endoscope adapter and a port of the endoscope connector is axially aligned with a corresponding insertion port of the endoscope adapter.

Abstract: An anti-lock sensor ring may have a flattened exciting portion having a retention mechanism projecting from a ring radial edge. The retention mechanism may have cantilever spring retention clips elastically deformable to snap on a disc brake band retention seat. The mechanism may also have a cantilever support portion disposed side by side to and spaced apart from the cantilever spring retention clips. Each of the cantilever spring retention clips may have a retention surface and the cantilever support portion with a support surface. When the anti-lock sensor ring is dismounted from a disc brake band, the plane defined by the retention surface and the plane defined by the support surface are facing each other in order to create opposing gripping elements.

Abstract: A braking band of a disk brake disk has a first plate and a second plate arranged joined to each other by connecting elements. The first and second plates have first and second plate outer surfaces, opposite portions of the first and second outer surfaces forming opposite braking surfaces. The braking band has a plurality of attachment portions for connecting the braking band to a vehicle hub or a bell. Each attachment portion has a connection seat. The attachment portions are spaced by recesses. Each attachment portion has an attachment portion wall having opposite side wall portions, two bottom wall portions and an inner end wall portion, and opposite first and second attachment portion surfaces. Each recess extends radially beyond the connection seat. Each side wall portion is joined to the adjoining bottom wall portion by a cylindrical bottom arch avoiding edges. Each side wall portion is joined to the adjoining inner end wall portion by a cylindrical end arch avoiding edges.

Abstract: An anti-lock sensor ring may have a flattened exciting portion having a retention mechanism projecting from a ring radial edge. The retention mechanism may have cantilever spring retention clips elastically deformable to snap on a disc brake band retention seat. The mechanism may also have a cantilever support portion disposed side by side to and spaced apart from the cantilever spring retention clips. Each of the cantilever spring retention clips may have a retention surface and the cantilever support portion with a support surface. When the anti-lock sensor ring is dismounted from a disc brake band, the plane defined by the retention surface and the plane defined by the support surface are facing each other in order to create opposing gripping elements.

Abstract: A braking band of a disk brake disk has a first plate and a second plate arranged joined to each other by connecting elements. The first and second plates have first and second plate outer surfaces, opposite portions of the first and second outer surfaces forming opposite braking surfaces. The braking band has a plurality of attachment portions for connecting the braking band to a vehicle hub or a bell. Each attachment portion has a connection seat. The attachment portions are spaced by recesses. Each attachment portion has an attachment portion wall having opposite side wall portions, two bottom wall portions and an inner end wall portion, and opposite first and second attachment portion surfaces. Each recess extends radially beyond the connection seat. Each side wall portion is joined to the adjoining bottom wall portion by a cylindrical bottom arch avoiding edges. Each side wall portion is joined to the adjoining inner end wall portion by a cylindrical end arch avoiding edges.

Abstract: An example test system includes a test head and a probe card assembly connected to the test head. The probe card assembly includes: a probe card having electrical contacts, a stiffener connected to the probe card to impart rigidity to the probe card, and a heater to heat to at least part of the probe card assembly. A prober is configured to move a device under test (DUT) into contact with the electrical contacts of the probe card assembly.

Abstract: A storage system is configured to store material on a mountable surface. The storage system includes a mounting panel with a pouch attachment ladder system grid of webbing slots, a plurality of rigid stay protrusion slots and a plurality of mounting hardware holes. A modular lightweight load-carrying equipment holster that has a pouch attachment ladder system grid of webbing. The pouch attachment ladder system grid of webbing fits through the pouch attachment ladder system grid of webbing slots which is then held in place with a rigid stay. The rigid stay further comprises a protrusion in order to prevent the rigid stay from sliding out of the pouch attachment ladder system grid of webbing.

Abstract: A high-efficiency modulating gas furnace (herein ‘gas furnace’) includes a furnace controller. The gas furnace further includes a gas valve and at least one pressure switch that is coupled to the furnace controller. The electrical contacts of the at least one pressure switch are removed from a series electrical circuit with the gas valve such that the gas furnace operates without de-energizing the gas valve as soon as the electrical contacts of the at least one pressure switch are opened. Further, the furnace controller operates the induced draft blower at or close to a lowest RPM at which the electrical contacts of the at least one pressure switch can be kept closed, which is between a make point RPM at which the electrical contacts of the at least one pressure switch close and a break point RPM at which the electrical contacts of the at least one pressure switch open.

Abstract: A high-efficiency modulating gas furnace (herein ‘gas furnace’) includes a furnace controller. The gas furnace further includes a gas valve and at least one pressure switch that is coupled to the furnace controller. The electrical contacts of the at least one pressure switch are removed from a series electrical circuit with the gas valve such that the gas furnace operates without de-energizing the gas valve as soon as the electrical contacts of the at least one pressure switch are opened. Further, the furnace controller operates the induced draft blower at or close to a lowest RPM at which the electrical contacts of the at least one pressure switch can be kept closed, which is between a make point RPM at which the electrical contacts of the at least one pressure switch close and a break point RPM at which the electrical contacts of the at least one pressure switch open.

Abstract: Systems and methods for thermal management for telecommunications enclosures are provided. In one embodiment, a method for thermal management for modular radio frequency (RF) electronics housed within an electronics enclosure comprises: distributing heat generated from an RF electronics component installed on a first thermal region of an electronics module base plate across the first thermal region using at least one primary heat pipe that laterally traverses the first thermal region; distributing heat generated from the RF electronics component to a second thermal region using at least one secondary heat pipe not parallel with the at least one primary heat pipe; conductively transferring heat across a thermal interface between the electronics module back-plate and a backplane of an electronics enclosure that houses the electronics module, wherein the backplane comprises a plurality heat sink fins aligned with the at least one primary heat pipe and the at least one secondary heat pipe.

Abstract: This invention describes the equipment and a method to recover starch from a dilute starch stream produced by manufacturing facilities which process the starch-containing materials, such as potato and corn.

Abstract: An example test system includes: a heating mechanism; a cooling mechanism; an instrument module having one or more interfaces to receive signals from a device under test (DUT), where the instrument module includes one or more electrical components to affect the signals, where the instrument module is between the heating mechanism and the cooling mechanism, and where the heating mechanism and the cooling mechanism are each configured to operate to maintain the instrument module within a target temperature range.

Abstract: An example test system includes a test head and a probe card assembly connected to the test head. The probe card assembly includes: a probe card having electrical contacts, a stiffener connected to the probe card to impart rigidity to the probe card, and a heater to heat to at least part of the probe card assembly. A prober is configured to move a device under test (DUT) into contact with the electrical contacts of the probe card assembly.

Abstract: This invention describes the equipment and a method to recover starch from a dilute starch stream produced by manufacturing facilities which process the starch-containing materials, such as potato and corn.

Abstract: Systems and methods for thermal management for telecommunications enclosures are provided. In one embodiment, a method for thermal management for modular radio frequency (RF) electronics housed within an electronics enclosure comprises: distributing heat generated from an RF electronics component installed on a first thermal region of an electronics module base plate across the first thermal region using at least one primary heat pipe that laterally traverses the first thermal region; distributing heat generated from the RF electronics component to a second thermal region using at least one secondary heat pipe not parallel with the at least one primary heat pipe; conductively transferring heat across a thermal interface between the electronics module back-plate and a backplane of an electronics enclosure that houses the electronics module, wherein the backplane comprises a plurality heat sink fins aligned with the at least one primary heat pipe and the at least one secondary heat pipe.

Abstract: Systems and methods for thermal management for telecommunications enclosures are provided. In one embodiment, a method for thermal management for modular radio frequency (RF) electronics housed within an electronics enclosure comprises: distributing heat generated from an RF electronics component installed on a first thermal region of an electronics module base plate across the first thermal region using at least one primary heat pipe that laterally traverses the first thermal region; distributing heat generated from the RF electronics component to a second thermal region using at least one secondary heat pipe not parallel with the at least one primary heat pipe; conductively transferring heat across a thermal interface between the electronics module back-plate and a backplane of an electronics enclosure that houses the electronics module, wherein the backplane comprises a plurality heat sink fins aligned with the at least one primary heat pipe and the at least one secondary heat pipe.