Patents by Inventor Kevin Thuy Luong
Kevin Thuy Luong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 8111480Abstract: An electronic component, comprising: a portion of a row cut from a wafer; and a closure coupled to the portion of the row of the wafer towards a first edge of the portion of the row of the wafer; the portion of the row of the wafer having a bonding area positioned adjacent a second edge of the portion of the row of the wafer, the second edge of the portion of the row of the wafer being positioned opposite the first edge of the portion of the row of the wafer and along a same side thereof, wherein the bonding area includes a layer of adhesive thereon.Type: GrantFiled: April 21, 2008Date of Patent: February 7, 2012Assignee: International Business Machines CorporationInventors: Annayya P. Deshpande, Calvin Shyhjong Lo, Kevin Thuy Luong, Artemio Juan Torres
-
Patent number: 7492552Abstract: A tape head read/write module that has a composite air bearing surface, and a method and apparatus for embedding a chip in a substrate to form a composite air bearing surface. An example of the module includes a substrate that has an air bearing surface, a front, a back, and a chip receiving slot. The air bearing surface of the substrate has a first portion adjoining a first side of the chip receiving slot, and a second portion adjoining a second side of the chip receiving slot. The module also includes a chip that has an air bearing surface, a bottom surface, a front, a back, and active elements. The active elements are located proximate the front of the chip. The chip is positioned in the chip receiving slot in the substrate, with the air bearing surface of the chip substantially aligned with the air bearing surface of the substrate.Type: GrantFiled: August 4, 2007Date of Patent: February 17, 2009Assignee: International Business Machines CorporationInventors: Annayya P. Deshpande, Hoodin Hamidi, Icko E. Iben, Kevin Thuy Luong, Sassan K. Shahidi, Abel J. Taina
-
Patent number: 7446974Abstract: An electronic component according to one embodiment comprises a portion of a row cut from a wafer; and a closure coupled to the portion of the row of the wafer towards a first edge of the portion of the row of the wafer; the portion of the row of the wafer having a bonding area positioned adjacent a second edge of the portion of the row of the wafer, the second edge of the portion of the row of the wafer being positioned opposite the first edge of the portion of the row of the wafer and along a same side thereof, wherein the bonding area includes a layer of adhesive thereon, wherein the adhesive coupled to the bonding area is spaced from the closure. Additional systems and methods are also presented.Type: GrantFiled: January 14, 2005Date of Patent: November 4, 2008Assignee: International Business Machines CorporationInventors: Annayya P. Deshpande, Calvin Shyhjong Lo, Kevin Thuy Luong, Artemio Juan Torres
-
Publication number: 20080218904Abstract: An electronic component, comprising: a portion of a row cut from a wafer; and a closure coupled to the portion of the row of the wafer towards a first edge of the portion of the row of the wafer; the portion of the row of the wafer having a bonding area positioned adjacent a second edge of the portion of the row of the wafer, the second edge of the portion of the row of the wafer being positioned opposite the first edge of the portion of the row of the wafer and along a same side thereof, wherein the bonding area includes a layer of adhesive thereon.Type: ApplicationFiled: April 21, 2008Publication date: September 11, 2008Inventors: Annayya P. Deshpande, Calvin Shyhjong Lo, Kevin Thuy Luong, Artemio Juan Torres
-
Patent number: 7274536Abstract: A tape head read/write module that has a composite air bearing surface, and a method and apparatus for embedding a chip in a substrate to form a composite air bearing surface. An example of the module includes a substrate that has an air bearing surface, a front, a back, and a chip receiving slot. The air bearing surface of the substrate has a first portion adjoining a first side of the chip receiving slot, and a second portion adjoining a second side of the chip receiving slot. The module also includes a chip that has an air bearing surface, a bottom surface, a front, a back, and active elements. The active elements are located proximate the front of the chip. The chip is positioned in the chip receiving slot in the substrate, with the air bearing surface of the chip substantially aligned with the air bearing surface of the substrate.Type: GrantFiled: June 7, 2006Date of Patent: September 25, 2007Assignee: International Business Machines CorporationInventors: Annayya P. Deshpande, Hoodin Hamidi, Icko E. Iben, Kevin Thuy Luong, Sassan K. Shahidi, Abel J. Taina
-
Patent number: 7167339Abstract: A method is provided for providing air-skiving edges of a tape head. A slot is created in an upper face of a substrate of a tape head. The slot includes at least one edge defining an edge of a tape bearing surface (TBS) of the tape head. The surface of the tape head is then formed and finished, such as by lapping. A grind operation is subsequently conducted to form a notch in the upper face of the substrate of the tape head. Such notch extends from the slot to an outside end of the substrate of the tape head.Type: GrantFiled: December 3, 2003Date of Patent: January 23, 2007Assignee: International Business Machines CorporationInventors: Robert Glenn Biskeborn, Luis Hector Palacios Borja, Calvin Shyhjong Lo, Kevin Thuy Luong, Sassan K. Shahidi
-
Patent number: 7082013Abstract: A method and apparatus for embedding a chip in a substrate to form a composite air bearing surface. An example of the method includes securing the substrate in a fixed position, aligning the chip in a first direction with a chip receiving slot in the substrate, depositing adhesive in the chip receiving slot, and aligning the chip in a second direction with the chip receiving slot. The chip is pushed into the adhesive in the chip receiving slot until the air bearing surface of the chip is substantially at a desired protrusion in a third direction in relation to the air bearing surface of the substrate. The adhesive is cured with the air bearing surface of the chip substantially at the desired protrusion in the third direction, and with the chip substantially aligned in the first and second directions with chip receiving slot.Type: GrantFiled: May 6, 2003Date of Patent: July 25, 2006Assignee: International Business Machines CorporationInventors: Annayya P. Deshpande, Hoodin Hamidi, Icko E. Iben, Kevin Thuy Luong, Sassan K. Shahidi, Abel J. Taina
-
Patent number: 6863061Abstract: A method and mechanism for slicing a thin film wafer. A closure is bonded to a section of a thin film wafer. A blade is used to slice a row from the section of the wafer by cutting through the closure and thin film wafer such that opposite sides of the blade engage an equal surface area of the closure.Type: GrantFiled: January 15, 2003Date of Patent: March 8, 2005Assignee: International Business Machines CorporationInventors: Annayya P. Deshpande, Calvin Shyhjong Lo, Kevin Thuy Luong, Artemio Juan Torres
-
Publication number: 20040223261Abstract: A method and apparatus for embedding a chip in a substrate to form a composite air bearing surface. An example of the method includes securing the substrate in a fixed position, aligning the chip in a first direction with a chip receiving slot in the substrate, depositing adhesive in the chip receiving slot, and aligning the chip in a second direction with the chip receiving slot. The chip is pushed into the adhesive in the chip receiving slot until the air bearing surface of the chip is substantially at a desired protrusion in a third direction in relation to the air bearing surface of the substrate. The adhesive is cured with the air bearing surface of the chip substantially at the desired protrusion in the third direction, and with the chip substantially aligned in the first and second directions with chip receiving slot.Type: ApplicationFiled: May 6, 2003Publication date: November 11, 2004Inventors: Annayya P. Deshpande, Hoodin Hamidi, Icko E. Iben, Kevin Thuy Luong, Sassan K. Shahidi, Abel J. Taina
-
Publication number: 20040134477Abstract: A method and mechanism for slicing a thin film wafer. A closure is bonded to a section of a thin film wafer. A blade is used to slice a row from the section of the wafer by cutting through the closure and thin film wafer such that opposite sides of the blade engage an equal surface area of the closure.Type: ApplicationFiled: January 15, 2003Publication date: July 15, 2004Applicant: INTERNATIONAL BUSINESS MACHINESInventors: Annayya P. Deshpande, Calvin Shyhjong Lo, Kevin Thuy Luong, Artemio Juan Torres